Three-dimensional writable printed memory
View Patent ↗The present invention discloses a three-dimensional writable printed memory (3D-wP). It comprises at least a printed memory array and a writable memory array. The printed memory array stores contents data, which are recorded with a printing means; the writable memory array stores custom data, which are recorded with a writing means. The writing means is preferably direct-write lithography. To maintain manufacturing throughput, the total amount of custom data should be less than 1% of the total amount of content data.
1. A method of making a three-dimensional writable printed memory (3D-wP), comprising the steps of:
1) forming a substrate circuit on a semiconductor substrate;
2) recording custom data using a direct-write lithography;
3) recording content data into a plurality of vertically stacked memory levels above said substrate using a printing means, wherein said memory levels are stacked above and coupled to said substrate;
wherein the total amount of said custom data is less than 1% of the total amount of said content data.
2. The method according to claim 1 , wherein said direct-write lithography is e-beam lithography.
3. The method according to claim 1 , wherein said direct-write lithography is laser-beam lithography.
4. The method according to claim 1 , wherein said direct-write lithography is focused ion-beam lithography.
5. The method according to claim 1 , wherein said printing means is photo-lithography.
6. The method according to claim 1 , wherein said printing means is imprint-lithography.
7. The method according to claim 1 , wherein step 3) is performed during step 2).
8. The method according to claim 1 , wherein step 3) is performed before step 2).
9. The method according to claim 1 , wherein the minimum feature size of the data-coding layer of said writable memory array is larger than the minimum feature size of the data-coding layer of said memory levels.