Method of forming a high electron mobility semiconductor device and structure therefor
In one embodiment, a method of forming a semiconductor device can comprise; forming a HEM device on a semiconductor substrate. The semiconductor substrate provides a current carrying electrode for the semiconductor device and one or more internal conductor structures provide a vertical current path between the semiconductor substrate and regions of the HEM device.
1. A method of forming a semiconductor device comprising:
providing a base substrate of a first semiconductor material, wherein the base substrate defines a first current carrying electrode of the semiconductor device;
forming a III-nitride channel layer over the base substrate;
forming a III-nitride barrier layer over the channel layer;
forming a second current carrying electrode of the semiconductor device in the barrier layer;
forming a gate of the semiconductor device overlying a portion of the barrier layer and spaced apart from the second current carrying electrode; and
forming a first internal conductor structure extending from the barrier layer through the channel layer to the base substrate comprising a first conductor within the barrier layer, a second conductor extending from the first conductor to the base substrate and an insulator between the second conductor and the channel layer, wherein the first internal conductor structure forms a low resistance vertical electrical current path from the base substrate to the barrier layer.
2. The method of claim 1 , wherein forming the first internal conductor structure includes forming the internal conductor structure to electrically connect to the base substrate and to the barrier layer.
3. The method of claim 1 , wherein:
forming the III-nitride channel layer comprises forming a GaN channel layer; and
forming the III-nitride barrier layer comprises forming an AlGaN barrier layer.
4. The method of claim 1 , wherein forming the first conductor within the barrier layer includes forming a Schottky barrier connection between the first conductor and the barrier layer.
5. The method of claim 1 , wherein forming the first internal conductor structure includes electrically connecting to the base substrate and to a major surface of the barrier layer.
6. The method of claim 1 further including forming a first doped region of a first conductivity type in the base substrate and spaced apart from the first internal conductor structure, wherein the first conductivity type is opposite to a conductivity type of the base substrate;
forming a gate conductor of a MOS transistor overlying the first doped region, wherein a portion of the first doped region forms a channel region of the MOS transistor; and
forming a second internal conductor structure adjacent to but spaced apart from the first doped region, the second internal conductor structure extending from the III-nitride barrier layer through the III-nitride channel layer to the base substrate, wherein the second internal conductor structure forms a low resistance electrical current path.
7. The method of claim 6 , wherein forming the first internal conductor structure includes forming a first current carrying electrode of the MOS transistor as a portion of the base substrate underlying the first internal conductor structure.
8. The method of claim 6 further including forming an electrical path between the gate and the second internal conductor structure to form a low resistance electrical connection from the gate to the base substrate, wherein a portion of the base substrate underlying the second internal conductor structure forms a first current carrying electrode of the MOS transistor.
9. The method of claim 1 further comprising:
forming a first doped region of a first conductivity type in the base substrate and abutting the first internal conductor structure, wherein the first conductivity type is opposite to a conductivity type of the base substrate, and wherein the first doped region forms a first current carrying electrode of a MOS transistor;
forming a second doped region of the first conductivity type in the base substrate and spaced apart from the first doped region, wherein the second doped region forms a second current carrying electrode of the MOS transistor;
forming a gate conductor of the MOS transistor overlying a portion of the base substrate that is between the first and second doped regions, wherein the portion of the base substrate forms a channel region of the MOS transistor; and
forming a second internal conductor structure extending from the III-nitride barrier layer through the III-nitride channel layer to the second doped region, wherein the second internal conductor structure forms a low resistance electrical current path.
10. The method of claim 9 further including forming an electrical path between the gate and the second internal conductor structure to form a low resistance electrical connection from the gate to the second current carrying electrode of the MOS transistor.
11. A semiconductor device comprising: a base substrate of a first semiconductor material, wherein the base substrate forms a first current carrying electrode of the semiconductor device; a heterostructure comprising a III-nitride channel layer over the base substrate and a III-nitride barrier layer over the channel layer; a second current carrying electrode of the semiconductor device in the barrier layer; a gate of the semiconductor device overlying a portion of the barrier layer and spaced apart from the second current carrying electrode; and a first internal conductor structure extending from the barrier layer through the channel layer to the base substrate, wherein the first internal conductor comprises a first conductor within the barrier layer and a second conductor extending from the first conductor to the base substrate, and wherein the second conductor is insulated from at least the channel layer, and wherein the first internal conductor structure forms a low resistance electrical current path from the base substrate to the barrier layer.
12. The semiconductor device of claim 11 , wherein the first internal conductor structure electrically connects to the base substrate and to the barrier layer.
13. The semiconductor device of claim 11 , wherein side surfaces of the first conductor make electrical contact with at least the barrier layer.
14. The semiconductor device of claim 11 , wherein the heterostructure comprises:
an AlGaN buffer layer on the base substrate;
a GaN channel layer on the AlGaN buffer region; and
an AlGaN barrier layer on the GaN channel layer.
15. The semiconductor device of claim 11 further comprising:
a first doped region of a first conductivity type in the base substrate and spaced apart from the first internal conductor structure, wherein the first conductivity type is opposite to a conductivity type of the base substrate;
a gate conductor of a MOS transistor overlying the first doped region, wherein a portion of the first doped region forms a channel region of the MOS transistor; and
a second internal conductor structure adjacent to but spaced apart from the first doped region, the second internal conductor structure extending from the barrier layer through the channel layer to the base substrate, wherein the second internal conductor structure forms a low resistance electrical current path.
16. The semiconductor device of claim 11 further comprising:
a first doped region of a first conductivity type in the base substrate and abutting the first internal conductor structure, wherein the first conductivity type is opposite to a conductivity type of the base substrate, and wherein the first doped region forms a first current carrying electrode of an MOS transistor;
a second doped region of the first conductivity type in the base substrate and spaced apart from the first doped region, wherein the second doped region forms a second current carrying electrode of the MOS transistor;
a gate conductor of the MOS transistor overlying a portion of the base substrate that is between the first and second doped regions, wherein the portion of the base substrate forms a channel region of the MOS transistor; and
a second internal conductor structure extending from the barrier layer through the channel layer to the second doped region, wherein the second internal conductor structure forms a low resistance electrical current path.
17. A semiconductor device comprising: a base substrate of a first semiconductor material, wherein the base substrate forms a first current carrying electrode of the semiconductor device; a heterostructure comprising a III-nitride channel layer over the base substrate and a III-nitride barrier layer over the channel layer; a second current carrying electrode of the semiconductor device in the barrier layer; a gate of the semiconductor device overlying a portion of the barrier layer and spaced apart from the second current carrying electrode; and a first internal conductor structure extending from the barrier layer through the channel layer to the base substrate, wherein the first internal conductor comprises a first conductor within the barrier layer and a second conductor extending from the first conductor to the base substrate, and wherein the second conductor is insulated from at least the channel layer, and wherein the first conductor has a side surface in electrical contact with at least the III-nitride barrier layer, and wherein the first internal conductor structure forms a low resistance electrical current path from the base substrate to the barrier layer.
18. The semiconductor device of claim 17 , wherein the side surface of the first conductor further makes electrical contact to at least a portion of the III-nitride channel layer.
19. The semiconductor device of claim 17 further comprising:
a first doped region of a first conductivity type in the base substrate and spaced apart from the first internal conductor structure, wherein the first conductivity type is opposite to a conductivity type of the base substrate;
a gate conductor of a MOS transistor overlying the first doped region, wherein a portion of the first doped region forms a channel region of the MOS transistor; and
a second internal conductor structure adjacent to but spaced apart from the first doped region, the second internal conductor structure extending from the barrier layer through the channel layer to the base substrate, wherein the second internal conductor structure forms a low resistance electrical current path.
20. The semiconductor device of claim 17 further comprising:
a first doped region of a first conductivity type in the base substrate and abutting the first internal conductor structure, wherein the first conductivity type is opposite to a conductivity type of the base substrate, and wherein the first doped region forms a first current carrying electrode of an MOS transistor;
a second doped region of the first conductivity type in the base substrate and spaced apart from the first doped region, wherein the second doped region forms a second current carrying electrode of the MOS transistor;
a gate conductor of the MOS transistor overlying a portion of the base substrate that is between the first and second doped regions, wherein the portion of the base substrate forms a channel region of the MOS transistor; and
a second internal conductor structure extending from the barrier layer through the channel layer to the second doped region, wherein the second internal conductor structure forms a low resistance electrical current path.