Plasma processing apparatus and plasma processing method
There is provided a plasma processing apparatus which compares a plurality of patterns detected using an interference light intensity pattern using a wavelength from at least one preset film of the plurality of film layers as a parameter and an intensity pattern using a wavelength of light from the other film as a parameter and an light intensity pattern from inside the processing chamber which is detected during processing of the film to be processed; and compares a film thickness corresponding to one of the plurality of patterns having a minimum difference obtained by the comparison and a target film thickness; and determines that the thickness of the film to be processed reaches the target film thickness.
1. A plasma processing apparatus having a wafer disposed in a processing chamber inside a vacuum container, the plasma processing apparatus being configured to process a film structure disposed on the wafer using a plasma generated in the processing chamber, the film structure having a plurality of film layers disposed on the wafer including a film layer to be processed and a mask layer disposed on the film layer to be processed,
the plasma processing apparatus comprising a determination unit configured to:
compare a plurality of synthesized light intensity patterns with a light intensity pattern of light from the processing chamber detected during processing of the film layer to be processed;
compare a film thickness corresponding to a synthesized light intensity pattern, which has a minimum difference from the light intensity pattern detected during processing, with a target film thickness; and
determine whether the film thickness of the film to be processed reached the target film thickness,
wherein the synthesized light intensity patterns use wavelength as a parameter, and the light intensity pattern detected during processing uses wavelength as a parameter, and
wherein the plurality of synthesized light intensity patterns are obtained by synthesizing interference light intensity patterns with light intensity patterns obtained from interference light detected from the mask layer,
the interference light intensity patterns having been obtained from interference light detected from a previous processing of the film layer to be processed on another wafer,
wherein the interference light intensity patterns use wavelength as a parameter, and the light intensity patterns obtained from interference light detected from the mask layer use wavelength as a parameter.
2. The plasma processing apparatus according to claim 1 , wherein the mask layer is composed of a material which transmits light.
3. The plasma processing apparatus according to claim 1 , wherein, during processing, the mask layer has a smaller change in film thickness than a change in the film thickness of the film layer to be processed.
4. The plasma processing apparatus according to claim 3 , wherein the mask layer is composed of a material which transmits light.
5. A plasma processing method of processing a film structure disposed on a wafer in processing chamber, the film structure including a film layer to be processed and a mask layer on the film layer, the plasma processing method comprising the steps of:
comparing a plurality of synthesized light intensity patterns with a light intensity pattern of a light detected from the processing chamber during processing of the film layer to be processed;
comparing a film thickness corresponding to a synthesized light intensity pattern, which has a minimum difference from the light intensity pattern detected during processing, with a target film thickness; and
determining whether the film thickness of the film to be processed reached the target film thickness,
wherein the synthesized light intensity patterns use wavelength as a parameter, and the light intensity pattern detected during processing uses wavelength as a parameter, and
wherein the plurality of synthesized light intensity patterns are obtained by synthesizing interference light intensity patterns with light intensity patterns obtained from interference light detected from the mask layer,
the interference light intensity patterns having been obtained from interference light detected from a previous processing of the film layer to be processed on another wafer,
wherein the interference light intensity patterns use wavelength as a parameter, and the light intensity patterns obtained from interference light detected from the mask layer use wavelength as a parameter.
6. The plasma processing method according to claim 5 , wherein the mask layer composed of a material which transmits light.
7. The plasma processing method according to claim 5 , wherein, during processing, the mask layer has a smaller change in film thickness than a change in the film thickness of the film layer to be processed.
8. The plasma processing method according to claim 7 , wherein the mask layer is composed of a material which transmits light.