Heat dissipation system
View Patent ↗An electronic component includes a component enclosure. At least one subcomponent is positioned within the component enclosure. The at least one subcomponent is configured to be thermally coupled to the component enclosure.
1. An electronic component comprising:
a component enclosure;
at least one subcomponent positioned within the component enclosure;
wherein the at least one subcomponent is configured to be thermally coupled to the component enclosure, wherein the at least one subcomponent includes a plurality of subcomponents, wherein at least a portion of a plurality of thermal pads are positioned between each of the plurality of subcomponents, wherein the thermal pads are configured to thermally couple each of the plurality of subcomponents, wherein at least one of the plurality of subcomponents is individually an electronic RF shielded subcomponent, wherein at least a first subcomponent of the plurality of subcomponents is configured to be thermally coupled to an upper surface of the component enclosure via a first thermal pad of the plurality of thermal pads, wherein at least a second subcomponent of the plurality of subcomponents is configured to be thermally coupled to a lower surface of the component enclosure via a second thermal pad of the plurality of thermal pads.
2. The electronic component of claim 1 wherein the component enclosure is configured to dissipate heat.
3. The electronic component of claim 1 wherein the electronic component is an automated testing electronic component.
4. The electronic component of claim 1 further comprising:
a fan assembly configured to circulate cooling air throughout the component enclosure.
5. An electronic component comprising:
a component enclosure;
a plurality of subcomponents positioned within the component enclosure;
wherein the plurality of subcomponents are configured to be thermally coupled to the plurality of subcomponents via at least a portion of a plurality of thermal pads positioned between each of the plurality of subcomponents, and wherein at least one of the plurality of subcomponents is individually an electronic RF shielded subcomponent;
wherein the plurality of subcomponents are configured to be thermally coupled to the component enclosure, wherein at least a first subcomponent of the plurality of subcomponents is configured to be thermally coupled to an upper surface of the component enclosure via a first thermal pad of the plurality of thermal pads, wherein at least a second subcomponent of the plurality of subcomponents is configured to be thermally coupled to a lower surface of the component enclosure via a second thermal pad of the plurality of thermal pads.
6. An electronic component comprising:
a component enclosure;
a plurality of subcomponents positioned within the component enclosure, wherein at least one of the plurality of subcomponents includes an individual electronic RF shielded subcomponent; and
a plurality of thermal pads configured to thermally couple the plurality of subcomponents and the component enclosure, wherein at least a portion of the plurality of thermal pads is positioned between each of the plurality of subcomponents, an upper surface of the component enclosure, and a lower surface of the component enclosure.
7. The electronic component of claim 6 wherein the component enclosure is configured to dissipate heat.
8. The electronic component of claim 6 wherein the electronic component is an automated testing electronic component.
9. The electronic component of claim 6 further comprising:
a fan assembly configured to circulate cooling air throughout the component enclosure.