Substrate support chuck cooling for deposition chamber
A substrate support chuck for use in a substrate processing system is provided herein. In some embodiments, a substrate support for use in a substrate processing chamber may include an electrostatic chuck having a top substrate support surface and a bottom surface, and a cooling ring assembly having a central opening disposed proximate the bottom surface of the electrostatic chuck, the cooling ring assembly including, a cooling section having a top surface thermally coupled to the bottom surface of the electrostatic chuck, the cooling section having a cooling channel formed in a bottom surface of the cooling section, and a cap coupled to a bottom surface of the cooling section and fluidly sealing the cooling channel formed in the cooling section.
1. A substrate support for use in a substrate processing chamber, comprising:
an electrostatic chuck having a top substrate support surface and a bottom surface, wherein the electrostatic chuck is formed from a low operating temperature aluminum nitride that has a thermal conductivity of greater or equal than 150 W/m-K; and
a cooling ring assembly disposed proximate the bottom surface of the electrostatic chuck, the cooling ring assembly including:
a cooling section having a first central opening and a top surface thermally coupled to the bottom surface of the electrostatic chuck, the cooling section having a cooling channel formed in a bottom surface of the cooling section, wherein the cooling section is formed from a material having a thermal conductivity of greater or equal than 300 W/m-K; and
a cap coupled to the bottom surface of the cooling section that directly covers and fluidly sealing the cooling channel formed in the cooling section, wherein the cap includes a second central opening,
wherein the first and second central openings have a non-circular shape configured to accommodate a plurality of piping and/or connections to pass through, wherein the second central opening aligns with and has the same shape and size as the first central opening in the cooling section, and wherein the cooling channel is formed about a periphery of the non-circular first central opening, wherein the cooling ring assembly is thermally coupled to the electrostatic chuck via a thermal gasket, and wherein the thermal gasket is a layer of vertically conductive graphite material.
2. The substrate support of claim 1 , wherein the cooling channel formed about a periphery of the first central opening in the cooling section.
3. The substrate support of claim 1 , further comprising:
a coolant supply tube fluidly coupled to a first end of the cooling channel; and
a coolant outlet tube fluidly coupled to a second end of the cooling channel.
4. The substrate support of claim 1 , wherein the cap is formed from stainless steel.
5. The substrate support of claim 1 , wherein the cooling section is formed from one of copper, steel, or aluminum.
6. The substrate support of claim 1 , the cooling section and cap are one of bolted, brazed, welded, or pinned together.
7. The substrate support of claim 1 , further comprising alignment pins that align the cooling section and cap.
8. The substrate support of claim 1 , wherein the top surface of the cooling section includes a plurality of openings with alignments pins disposed therein that align the cooling ring assembly to the electrostatic chuck.
9. The substrate support of claim 1 , further comprising at least one thermocouple disposed through the first and second central openings and coupled to the bottom surface of the electrostatic chuck.
10. The substrate support of claim 9 , wherein the at least one thermocouple is a spring-retained thermocouple.
11. The substrate support of claim 1 , further comprising a plurality of thermocouples disposed through the first and second central openings and coupled to the bottom surface of the electrostatic chuck.