FinFET device

1. A method for fabricating a field effect transistor device on a semiconductor on insulator (SOI) wafer including a substrate layer, a second insulator layer disposed on the substrate layer, a second semiconductor layer disposed on the second insulator layer, a first insulator layer disposed on the second semiconductor layer, and a first semiconductor layer disposed on the first insulator layer, the method comprising:

prior to performing any fin patterning, patterning a first lithographic mask so as to cover a first portion of the first semiconductor layer and expose a second portion of the first semiconductor layer;

with the first patterned lithographic mask in place, completely removing the exposed second portion of the first semiconductor layer and completely removing a second portion of the first insulator layer to expose a second portion of the second semiconductor layer;

removing the first patterned lithographic mask and conformally forming a hardmask layer over a top surface of the first portion of the first semiconductor layer, over an exposed side surface of the first portion of the first semiconductor layer, over an exposed side surface of a first portion of the first insulator layer, and over a top surface of the second portion of the second semiconductor layer;

forming a second patterned lithographic mask on the hardmask layer, the second patterned lithographic mask comprising fin patterns disposed over both the first portion of the first semiconductor layer and over the second portion of the second semiconductor layer;

transferring the fin patterns into the hardmask layer by etching so as to remove exposed portions of the hardmask layer;

simultaneously transferring the fin patterns into the first portion of the first semiconductor layer and the second portion of the second semiconductor layer to simultaneously completely form a first fin disposed on the first insulator layer and a second fin disposed on the second insulator layer; and

forming a first gate stack over a portion of the first fin and forming a second gate stack over a portion of the second fin.

2. The method of claim 1 , further comprising removing exposed portions of the hardmask layer following the simultaneous first fin and second fin formation.

3. The method of claim 1 , wherein the forming the first gate stack over the portion of the first fin and forming the second gate stack over the portion of the second fin comprises:

depositing a dielectric layer over exposed portions of the first insulator layer, the first fin, the second insulator layer, and the second fin;

depositing a gate conductor layer over the dielectric layer;

patterning a mask over portions of the gate conductor layer; and

removing exposed portions of the gate conductor layer and the dielectric layer.

4. The method of claim 3 , further comprising performing a planarization process on the gate conductor layer prior to patterning the mask over portions of the gate conductor layer.

5. The method of claim 1 , wherein the first semiconductor layer is arranged with a first crystalline orientation, and the second semiconductor layer is arranged with a second crystalline orientation, the first crystalline orientation is dissimilar from the second crystalline orientation.

6. The method of claim 1 , wherein the first semiconductor layer is dissimilar from the second semiconductor layer.

7. The method of claim 1 , wherein a top surface of the second fin is disposed below a top surface of the first fin.

8. The method of claim 7 , wherein a top surface of the second gate stack is disposed below a top surface of the first gate stack.

9. The method of claim 7 , wherein a top surface of the second gate stack is at a same height as a top surface of the first gate stack.

10. The method of claim 1 , further comprising leaving exposed portions of the hardmask layer in place prior to forming the first and second gate stacks.