Imaging systems with through-oxide via connections
View Patent ↗An imaging system may include an image sensor package with through-oxide via connections between the image sensor die and the digital signal processing die in the image sensor package. The image sensor die and the digital signal processing die may be attached to each other. The through-oxide via may connect a bond pad on the image sensor die with metal routing paths in the image sensor and digital signal processing dies. The through-oxide via may simultaneously couple the image sensor die to the digital signal processing die. The through-oxide via may be formed through a shallow trench isolation structure in the image sensor die. The through-oxide via may be formed through selective etching of the image sensor and digital signal processing dies.
1. An integrated circuit package, comprising:
a first integrated circuit die;
a second integrated circuit die that is bonded to the first integrated circuit die;
a bond pad on the first integrated circuit die; and
a via that extends through the first integrated circuit die and into the second integrated circuit die and that couples the bond pad on the first integrated circuit die to the second integrated circuit die, wherein the first integrated circuit die includes a shallow trench isolation structure, wherein the via is formed through the shallow trench isolation structure, wherein the first integrated circuit die has a first metal interconnect, wherein the second integrated circuit die has a second metal interconnect, and wherein the via couples the first metal interconnect to the second metal interconnect.
2. The integrated circuit package defined in claim 1 , wherein the via has a first end that is connected to the bond pad and a second end that extends into the second integrated circuit die.
3. The integrated circuit package defined in claim 1 , wherein the first integrated circuit die comprises an image sensor integrated circuit, and wherein the second integrated circuit die comprises a digital signal processing integrated circuit.
4. The integrated circuit package defined in claim 1 , further comprising:
a via liner that surrounds the via.
5. The integrated circuit package defined in claim 1 , wherein the via comprises a given via in a plurality of vias that is formed through the first integrated circuit die and that contacts the bond pad, and wherein each via in the plurality of vias are circular.
6. The integrated circuit package defined in claim 1 , wherein the via comprises a rectangular slot.
7. The integrated circuit package defined in claim 1 , wherein the first integrated circuit includes metal routing paths and an image sensor pixel that is coupled to the via through the metal routing paths.
8. A method of forming an image sensor package, wherein the image sensor package comprises a first die and a second die, comprising:
attaching the first die to the second die;
performing selective etching to form a hole that extends only partially through the first die;
depositing a passivation layer in the hole that extends only partially through the first die;
performing selective etching to extend the hole into the second die after depositing the passivation layer;
depositing conductive material in the hole to form a via in the hole; and
forming a bond pad on the first die to contact the via.
9. The method defined in claim 8 , further comprising:
grinding the first die after attaching the first die to the second die; and
depositing a buffer layer on the first die prior to performing selective etching.
10. The method defined in claim 9 , wherein the first die comprises a silicon substrate, and wherein performing selective etching to form the hole comprises performing selective etching to form the hole through the silicon substrate.
11. The method defined in claim 10 further comprising:
depositing the passivation layer in the hole in the silicon substrate after performing selective etching to form the hole in the silicon substrate.
12. The method defined in claim 10 , wherein performing selective etching to extend the hole into the second die comprises extending the hole from the silicon substrate into the second die after depositing the passivation layer, wherein the via simultaneously provides a first connection between the first die and the second die and a second connection between the bond pad and the first die.
13. The method defined in claim 8 , wherein the first die comprises a shallow trench isolation structure, and wherein performing selective etching to form the hole further comprises forming the hole through the shallow trench isolation structure.
14. A system, comprising:
a central processing unit;
memory;
input-output circuitry; and
an imaging device, wherein the imaging device comprises:
a first die, wherein the first die comprises an image sensor integrated circuit and first metal routing paths;
a second die attached to the first die, wherein the second die comprises a digital signal processing integrated circuit and second metal routing paths;
a bond pad on the first die; and
a through-oxide via that extends through the first die and into the second die to electrically connect the first die to the second die, wherein the through-oxide via contacts the bond pad, and wherein the through-oxide via extends through and is electrically connected to the first metal routing paths in the first die and the second metal routing paths in the second die.
15. The system defined in claim 14 wherein the first die comprises a shallow trench isolation structure, and wherein the through-oxide via extends through the shallow trench isolation structure.
16. The integrated circuit defined in claim 1 , wherein the first integrated circuit die includes a silicon substrate, wherein the shallow trench isolation structure is formed in the silicon substrate, and wherein the via extends through the silicon substrate.
17. The integrated circuit package defined in claim 1 , wherein the via extends through the first and second metal interconnects.
18. The integrated circuit package defined in claim 1 , wherein the first integrated circuit die includes a silicon substrate having an opening and a passivation layer that at least partially fills the opening, and wherein the via extends through the opening in the silicon substrate and through the passivation layer.
19. The system defined in claim 14 , wherein the through-oxide via comprises a conductive via liner that extends through and is electrically connected to the first metal routing paths in the first die and the second metal routing paths in the second die, and wherein the conductive via liner electrically connects the bond pad to the first and second metal routing paths.
20. The system defined in claim 19 , wherein the first die comprises a silicon substrate having an opening through which the through-oxide via and the conductive via liner extend, and wherein the first die comprises a passivation layer that at least partially fills the opening in the silicon substrate and surrounds the conductive via liner.