Resistance change memory and test method of the same

1. A resistance change memory comprising:

a memory cell array in which memory cells comprising resistive storage elements and cell transistors are arrayed, the memory cells being connected to bit lines and source lines, the cell transistors being connected to word lines;

an address counter which outputs an address signal to select a bit line, a source line, and a word line;

a word line driver which drives the word line;

a power supply circuit which generates a stress voltage different from a power supply voltage used to write data into the memory cells in a normal operation; and

a write driver configured to apply the stress voltage to the memory cells connected between the bit lines and the source lines,

wherein the address counter selects a first word line from the word lines, and the word line driver drives the first word line,

the address counter selects a first bit line and a first source line from the bit lines and the source lines,

the write driver applies the stress voltage across the first bit line and the first source line to pass a stress current through the memory cell selected by the first word line,

the address counter is incremented to select a second word line from the word lines, and the word line driver drives the second word line,

the address counter is incremented to select a second bit line and a second source line from the bit lines and the source lines, and

the write driver applies the stress voltage across the second bit line and the second source line to pass a stress current through the memory cell selected by the second word line.

2. The resistance change memory according to claim 1 , further comprising a timer circuit which sets a time of applying the stress voltage,

wherein the write driver applies the stress voltage in accordance with the time set by the timer circuit.

3. The resistance change memory according to claim 1 , wherein

the write driver applies, to the memory cells, a write voltage different from a power supply voltage used to read data from the memory cells when writing data into the memory cells.

4. The resistance change memory according to claim 3 , wherein

the write voltage is lower than the power supply voltage.

5. The resistance change memory according to claim 1 , further comprising a multiplexer which is connected to the bit lines and which selects the first bit line from the bit lines,

wherein the address counter outputs a selection signal to the multiplexer to select the first bit line, and the write driver is connected to the first bit line via the multiplexer.

6. The resistance change memory according to claim 1 , further comprising:

multiplexers which are connected to the bit lines and which select the first bit line from the bit lines; and

global bit lines connected to the multiplexers,

wherein the address counter outputs a selection signal to the multiplexers to select the first bit line, and the write driver is connected to the first bit line via the multiplexers.

7. The resistance change memory according to claim 5 , wherein

the first word line is activated by the write driver, and the bit lines are then sequentially selected by the multiplexer, and

the second word line is then activated by the write driver.

8. The resistance change memory according to claim 5 , wherein

the first bit line is selected from the bit lines by the multiplexer, and the word lines are then sequentially selected by the address counter, and

the second bit line is then selected from the bit lines by the multiplexer, and the word lines are then sequentially selected by the address counter.

9. The resistance change memory according to claim 1 , wherein

the power supply circuit generates a first voltage and a second voltage as the stress voltage, and

the write driver applies the first voltage to the resistive storage elements, and the word line driver applies the second voltage to the cell transistors.

10. The resistance change memory according to claim 1 , wherein

the word lines include redundancy word lines, and the address counter counts the word lines.

11. The resistance change memory according to claim 1 , wherein

the bit lines and the source lines respectively include redundancy bit lines and redundancy source lines, and the address counter counts the bit lines and the source lines.

12. The resistance change memory according to claim 1 , wherein

a magnetic field is applied to the memory cells while the stress voltage is being applied to the memory cells.

13. The resistance change memory according to claim 1 , wherein

the resistive storage element includes a magnetic tunnel junction (MTJ) element.

14. The resistance change memory according to claim 13 , wherein

the MTJ element comprises a reference layer, a storage layer, and an insulating layer disposed between the reference layer and the storage layer, and

the magnetic field applied to the memory cells is antiparallel to the magnetization direction of the reference layer.

15. The resistance change memory according to claim 13 , wherein

the MTJ element comprises a reference layer, a storage layer, and an insulating layer disposed between the reference layer and the storage layer, and

the magnetic field applied to the memory cells is in a direction oblique to the magnetization direction of the reference layer.

16. A test method of a resistance change memory, the test method comprising:

selecting a first word line from word lines by an address counter;

driving the first word line by a word line driver;

selecting a first bit line and a first source line from bit lines and source lines by the address counter;

applying a stress voltage across the first bit line and the first source line by a write driver, and then passing a stress current through a first memory cell selected by the first word line;

incrementing the address counter to select a second word line from the word lines;

driving the second word line by the word line driver;

incrementing the address counter to select a second bit line and a second source line from the bit lines and the source lines; and

applying the stress voltage across the second bit line and the second source line by the write driver, and then passing a stress current through a second memory cell selected by the second word line.

17. The test method according to claim 16 , wherein

the first word line is activated by the write driver, and the bit lines are then sequentially selected by a multiplexer, and

the second word line is then activated by the write driver.

18. The test method according to claim 16 , wherein

the first bit line is selected from the bit lines by a multiplexer, and the word lines are then sequentially selected by the address counter, and

the second bit line is then selected from the bit lines by the multiplexer, and the word lines are then sequentially selected by the address counter.

19. The test method according to claim 16 , wherein

a first voltage is applied to a resistive storage element included in the first memory cell by the write driver, and

a second voltage is applied to a cell transistor included in the first memory cell by the word line driver.

20. The test method according to claim 16 , wherein

a magnetic field is applied to the first memory cell while the stress voltage is being applied to the first memory cell.

21. The test method according to claim 16 , wherein

the magnetic field applied to the first memory cell is antiparallel to the magnetization direction of a reference layer of a magnetic tunnel junction (MTJ) element included in the first memory cell.

22. The test method according to claim 16 , wherein

the magnetic field applied to the first memory cell is in a direction oblique to the magnetization direction of a reference layer of a magnetic tunnel junction (MTJ) element included in the first memory cell.