Process of forming a semiconductor wafer

1. A process of forming a semiconductor wafer comprising:

providing a substrate having a primary surface and including a central region, an edge region including a side surface adjacent to the primary surface, and an intermediate region disposed between the central region and the edge region;

forming a patterned poly template layer over the primary surface within the edge region wherein the central region is not covered by the patterned poly template layer; and

forming a semiconductor layer over all of the primary surface and along the side surface, wherein the semiconductor layer is monocrystalline within the central region and polycrystalline where formed over the patterned poly template layer; and

removing a portion of the semiconductor layer from over the intermediate region, wherein after removing the part of the semiconductor layer:

a first remaining portion of the semiconductor layer is monocrystalline and lies within the central region,

a second remaining portion of the semiconductor layer is polycrystalline and lies along the side surface, and

the first remaining portion of the semiconductor layer is laterally spaced apart from the second remaining portion of the semiconductor layer, wherein the intermediate region is disposed between the first and second remaining portions of the semiconductor layer and does not include any portion of each of the semiconductor layer and the patterned poly template layer.

2. The process of claim 1 , wherein forming the patterned poly template layer comprises:

forming a poly template layer over the primary surface within the central and edge regions; and

etching a portion of the poly template layer before forming the semiconductor layer, wherein after etching, none of the poly template layer lies within the central region.

3. The process of claim 1 , wherein forming the semiconductor layer comprises forming a GaN film.

4. The process of claim 3 , wherein forming the semiconductor layer comprises:

forming a buffer film over the primary surface of the substrate;

forming the GaN layer over the buffer layer; and

forming a barrier layer over the GaN layer,

wherein the buffer film, the barrier film, or each of the buffer film and the barrier film includes aluminum.

5. The process of claim 1 , further comprising forming a gate dielectric layer over the semiconductor layer.

6. The process of claim 5 , further comprising removing a portion of the gate dielectric layer such that the gate dielectric layer has a sloped edge.

7. The process of claim 5 , further comprising: removing a portion of the gate dielectric layer from over the edge region, wherein:

a first remaining portion of the gate dielectric layer lies within the central region, and

after removing the portion of the gate dielectric layer, the first remaining portion of the gate dielectric layer is laterally spaced apart from the patterned poly template layer by the intermediate region that does not include any portion of the gate dielectric layer.

8. The process of claim 3 , wherein forming the semiconductor layer further comprises forming a first AlGaN film.

9. The process of claim 8 , wherein forming the semiconductor layer further comprises forming a second AlGaN film, wherein forming the GaN film is performed between forming the first AlGaN film and forming the second AlGaN film.

10. The process of claim 8 , further comprising forming an aluminum nitride layer over the substrate and before forming the first AlGaN layer.

11. The process of claim 1 , wherein removing the portion of the semiconductor layer over the intermediate region is performed such that the semiconductor layer within the first remaining portion has a sloped edge adjacent to the intermediate region.

12. The process of claim 11 , wherein the sloped edge lies along a plane that intersects the primary surface at an angle no greater than 30°.

13. The process of claim 1 , wherein the intermediate region, the edge region, or each of the intermediate and edge regions is no greater than 9 mm wide.

14. The process of claim 1 , wherein forming the patterned poly template layer comprises:

forming a pad layer; and

forming a template layer after forming the pad layer.

15. The process of claim 14 , wherein:

forming the pad layer comprises thermally growing a silicon dioxide layer; and

forming the template layer comprises forming a silicon nitride layer.

16. The process of claim 1 , further comprising forming a resist member over the semiconductor layer before removing the portion of the semiconductor layer.

17. The process of claim 16 , wherein the resist member has a sloped sidewall.

18. The process of claim 17 , wherein removing the portion of the semiconductor layer is performed using reactive ion etching.

19. The process of claim 1 , further comprising forming an AlN layer and forming a gate dielectric layer wherein:

the substrate is a monocrystalline silicon wafer;

the patterned poly template layer includes a silicon dioxide film disposed along a peripheral edge of the substrate, and a silicon nitride film over the silicon dioxide film, and the patterned poly template layer is spaced apart from the central region;

the AlN layer is disposed between the substrate and the semiconductor layer;

the semiconductor layer includes a buffer film over the AlN layer, a GaN film over the buffer film, and a barrier film over the GaN film; and

the gate dielectric layer overlies the barrier film and includes one or more nitride films.

20. The process of claim 19 , wherein the semiconductor layer and the gate dielectric layer are located only within the central region and define a sloped edge lying along a plane that intersects the primary surface at an angle no greater than 30°.