Method and system for junction termination in GaN materials using conductivity modulation
View Patent ↗A semiconductor structure includes a GaN substrate having a first surface and a second surface opposing the first surface. The GaN substrate is characterized by a first conductivity type and a first dopant concentration. The semiconductor structure also includes a first GaN epitaxial layer of the first conductivity type coupled to the second surface of the GaN substrate and a second GaN epitaxial layer of a second conductivity type coupled to the first GaN epitaxial layer. The second GaN epitaxial layer includes an active device region, a first junction termination region characterized by an implantation region having a first implantation profile, and a second junction termination region characterized by an implantation region having a second implantation profile.
1. A method for fabricating a junction termination structure, the method comprising:
providing a substrate of a first conductivity type, the substrate having a first surface and a second surface;
forming a first GaN epitaxial layer of the first conductivity type coupled to the first surface of the substrate;
forming a second GaN epitaxial layer of a second conductivity type opposite to the first conductivity type, the second GaN epitaxial layer being coupled to the first GaN epitaxial layer; and
after forming the second GaN epitaxial layer:
implanting ions into a first region of the second GaN epitaxial layer to form a first junction termination element characterized by a first conductivity less than a conductivity of the second GaN epitaxial layer; and
implanting ions into a second region of the second GaN epitaxial layer to form a second junction termination element characterized by a second conductivity less than the first conductivity.
2. The method of claim 1 further comprising forming a first metallic structure electrically coupled to the second surface of the substrate.
3. The method of claim 2 further comprising forming a second metallic structure electrically coupled to a portion of the second GaN epitaxial layer and the first GaN epitaxial layer, wherein the second metallic structure comprises a Schottky contact to the first GaN epitaxial layer.
4. The method of claim 1 further comprising:
forming a dielectric layer coupled to the junction termination structure and the second metallic structure;
removing a portion of the dielectric layer to expose a portion of the second metallic structure; and
forming a field plate coupled to the exposed portion of the second metallic structure.
5. The method of claim 1 wherein implanting ions into the second region comprises performing a multi-energy ion implantation process.
6. The method of claim 5 wherein a first step of the multi-energy ion implantation process is concurrent with implanting ions into the first region.
7. The method of claim 1 further comprising forming a metallic field plate coupled to the junction termination structure.
8. The method of claim 1 further comprising forming an active device coupled to the second GaN epitaxial layer, wherein the first junction termination element circumscribes the active device and the second junction termination element circumscribes the first junction termination element.
9. The method of claim 1 wherein a net active charge in the first junction termination element is between 1×1012 cm-2 and 1×1014 cm-2.
10. A method of fabricating a vertical power device structure, the method comprising:
forming an epitaxial structure by:
providing a III-nitride substrate of a first conductivity type characterized by a first dopant concentration;
forming a first III-nitride epitaxial layer of the first conductivity type coupled to a first surface of the III-nitride substrate; and
forming a second III-nitride epitaxial layer of a second conductivity type coupled to the first III-nitride epitaxial layer, wherein the second III-nitride epitaxial layer has a surface opposing the first III-nitride epitaxial layer; and
after forming the second III-nitride epitaxial layer:
defining regions of differing conductivity by implanting ions into the surface of the second III-nitride epitaxial layer to form a set of implantation regions of the epitaxial structure; and
forming one or more active devices using at least a device region of the epitaxial structure.
11. The method of claim 10 wherein the regions of differing conductivity comprise junction termination elements of a junction termination structure.
12. The method of claim 11 wherein the junction termination structure circumscribes the one or more active devices.
13. The method of claim 10 further comprising forming a Schottky metallic structure coupled to the first III-nitride epitaxial layer.
14. The method of claim 10 further comprising forming a metallic field plate coupled to the one or more active devices.
15. The method of claim 10 wherein a first implantation region of the set of implantation regions is electrically connected to a second implantation region of the set of implantation regions.