Focused ion beam system, sample processing method using the same, and sample processing program using focused ion beam
View Patent ↗A focused ion beam system includes a focused ion beam irradiation mechanism which irradiates a sample, on which a protective film is formed, with a focused ion beam from above the sample, a processing control unit which performs a removal process on both sides of a region to be a thin piece portion of the sample by the focused ion beam and sequentially forms observation surfaces parallel to an irradiation direction of the focused ion beam so as to achieve the thin piece portion, and an observation surface image generation unit which generates an observation surface image. The processing control unit terminates the removal process when a height of the protective film in the irradiation direction of the focused ion beam becomes a predetermined threshold value or less in the observation surface image.
1. A focused ion beam system comprising:
a focused ion beam irradiation mechanism configured to irradiate a sample, on which a protective film is formed, with a focused ion beam from above the sample;
a processing control unit configured to perform a removal process on both sides of a region to be a thin piece portion of the sample by the focused ion beam and sequentially form observation surfaces parallel to an irradiation direction of the focused ion beam so as to process the thin piece portion to a target thickness; and
an observation surface image generation unit configured to generate an observation surface image of at least one of the observation surfaces,
wherein the processing control unit is configured to terminate the removal process when a height of the protective film becomes a predetermined threshold value in the observation surface image.
2. The focused ion beam system according to claim 1 , wherein the processing control unit is configured to determine a contrast of the protective film in the observation surface image.
3. The focused ion beam system according to claim 1 , wherein the protective film includes carbon.
4. A focused ion beam system comprising:
a focused ion beam irradiation mechanism configured to irradiate a sample with a focused ion beam from above the sample, wherein a first protective film is formed on a surface of the sample, and a second protective film is formed on the first protective film;
a processing control unit configured to perform a removal process on both sides of a region to be a thin piece portion of the sample by the focused ion beam and sequentially form observation surfaces parallel to an irradiation direction of the focused ion beam so as to process the thin piece portion to a target thickness; and
an observation surface image generation unit configured to generate an observation surface image of at least one of the observation surfaces,
wherein the processing control unit is configured to terminate the removal process when the second protective film is removed in the observation surface image during the removal process.
5. The focused ion beam system according to claim 4 , wherein the processing control unit is configured to determine a contrast of the second protective film in the observation surface image.
6. The focused ion beam system according to claim 4 , wherein the second protective film includes carbon.
7. A sample processing method using a focused ion beam system, the method comprising:
irradiating a sample, on which a protective film is formed, with a focused ion beam from above the sample,
performing a removal process on both sides of a region to be a thin piece portion of the sample by the focused ion beam and sequentially forming observation surfaces parallel to an irradiation direction of the focused ion beam so as to process the thin piece portion to a target thickness;
generating an observation surface image of at least one of the observation surfaces; and
terminating the removal process when a height of the protective film becomes a predetermined threshold value in the observation surface image.
8. A non-transitory computer-readable medium having a computer program stored thereon and readable by a computer for controlling a focused ion beam system, the computer program, when executed by the computer, causing the computer to perform operations comprising:
irradiating a sample, on which a protective film is formed, with a focused ion beam from above the sample,
performing a removal process on both sides of a region to be a thin piece portion of the sample by the focused ion beam and sequentially forming observation surfaces parallel to an irradiation direction of the focused ion beam so as to process the thin piece portion to a target thickness;
generating an observation surface image of at least one of the observation surfaces; and
terminating the removal process when a height of the protective film in the observation surface image becomes a predetermined threshold value.
9. The focused ion beam system according to claim 1 , further comprising a charged particle beam irradiation mechanism configured to irradiate the sample with a charged particle beam, different from the focused ion beam used to perform the removal process, to cause the sample to generate secondary charged particles that are used to generate the observation surface image.
10. The focused ion beam system according to claim 9 , wherein the irradiation direction of the charged particle beam is different from the irradiation direction of the focused ion beam.
11. The focused ion beam system according to claim 9 , wherein the charged particle beam irradiation mechanism comprises an electron beam irradiation mechanism that irradiates the sample with an electron beam.
12. The focused ion beam system according to claim 9 , wherein the charged particle beam irradiation mechanism comprises an ion beam irradiation mechanism having a gas electric field ionization ion source that irradiates the sample with an ion beam.
13. The focused ion beam system according to claim 4 , further comprising a charged particle beam irradiation mechanism configured to irradiate the sample with a charged particle beam, different from the focused ion beam used to perform the removal process, to cause the sample to generate secondary charged particles that are used to generate the observation surface image.
14. The focused ion beam system according to claim 13 , wherein the irradiation direction of the charged particle beam is different from the irradiation direction of the focused ion beam.
15. The focused ion beam system according to claim 13 , wherein the charged particle beam irradiation mechanism comprises an electron beam irradiation mechanism that irradiates the sample with an electron beam.
16. The focused ion beam system according to claim 13 , wherein the charged particle beam irradiation mechanism comprises an ion beam irradiation mechanism having a gas electric field ionization ion source that irradiates the sample with an ion beam.
17. The sample processing method according to claim 7 , wherein the observation surface image is generated by irradiating the observation surface with a charged particle beam different from the focused ion beam used for the removal process.
18. The sample processing method according to claim 17 , wherein the irradiation direction of the charged particle beam is different from the irradiation direction of the focused ion beam.
19. The non-transitory computer-readable medium according to claim 8 , wherein the observation surface image is generated by irradiating the observation surface with a charged particle beam different from the focused ion beam used for the removal process.
20. The non-transitory computer-readable medium according to claim 19 , wherein the irradiation direction of the charged particle beam is different from the irradiation direction of the focused ion beam.