IP Library Granted Patent US 9,584,800
Granted Patent B2
US 9,584,800 · App. 14/231,694 · Granted Feb 28, 2017

Imaging systems with pixel array verification circuitry

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Quick Facts
Patent No.
US 9,584,800
App. No.
14/231,694
Granted
Feb 28, 2017
Kind
B2
Abstract

An imaging system may include an array of image pixels and verification circuitry. The verification circuitry may inject test voltages into the image pixel array during the photodiode reset operation. The test signals may then be read out using a correlated double sampling operation. Verification circuitry may compare the test signals to reference data to determine whether the imaging system is functioning properly (e.g., to determine whether the array of image pixels satisfies performance criteria). If the amount of mismatch between the test signals and the reference data exceed a predetermined threshold, the imaging system may be disabled and/or a warning signal may be presented to a user of the system.

Claims (42)

1. A method of operating an imaging system having an image sensor that includes an array of image pixels arranged in rows and columns, comprising:

loading a test image into the array, wherein each image pixel in the array includes a photodiode, and wherein loading the test image into the array comprises:

asserting a single control signal at the gate of at least one transistor coupled between the array of image pixels and verification circuitry that provides test voltage signals; and

in response to the single control signal, injecting a test voltage signal from the verification circuitry into at least one of the photodiodes in each of the columns in the array, wherein the test voltage signal comprises an analog signal having an intermediate voltage level;

reading out the test image from the array; and

comparing the test image that has been read out from the array to a reference image to determine whether the array of image pixels satisfies performance criteria.

2. The method defined in claim 1 , further comprising:

bypassing an exposure period by reading out the test image from the array immediately after loading the test image.

3. The method defined in claim 1 , wherein reading out the test image from the array comprises performing correlated double sampling (CDS).

4. The method defined in claim 1 , wherein loading the test image into the array comprises injecting different test voltage signals into respective columns in the array.

5. The method defined in claim 1 , wherein loading the test image into the array comprises injecting different test voltage signals into respective rows in the array.

6. The method defined in claim 1 , further comprising:

capturing an image of the environment with the image sensor, wherein determining whether the array of image pixels satisfies performance criteria is performed immediately prior to capturing the image of the environment.

7. The method defined in claim 1 , further comprising:

capturing an image of the environment with the image sensor, wherein determining whether the array of image pixels satisfies performance criteria is performed immediately after capturing the image of the environment.

8. A method of operating an imaging system having an image sensor that includes an array of image pixels, wherein each image pixel includes a reset transistor and a photodiode, the method comprising:

during a first time period, loading a first pattern of test voltages into a first row in the array of image pixels, wherein loading a test voltage in the first pattern of test voltages into an image pixel in the first row comprises:

turning off a first switch that routes a power supply voltage to the reset transistor in the image pixel;

while the first switch is turned off, turning on a second switch that routes the test voltage to the reset transistor in the image pixel; and

while the second switch is turned on, turning on the reset transistor in the image pixel to route the test voltage to the photodiode in the image pixel;

during a second time period, loading a second pattern of test voltages into a second row in the array of image pixels;

reading out the first pattern of test voltages from the first row in the array of image pixels and reading out the second pattern of test voltages from the second row in the array of image pixels; and

during a third time period, comparing the first and second patterns of test voltages that have been read out from the array of image pixels to predetermined test voltages to determine whether the array of image pixels satisfies design criteria.

9. The method defined in claim 8 , wherein loading the first pattern of test voltages comprises loading identical test voltage values into each image pixel in the first row via a common switch.

10. The method defined in claim 8 , wherein loading the first pattern of test voltages comprises loading different test voltage values into corresponding image pixels in the first row via respective switches.

11. The method defined claim 8 , wherein reading out the first pattern of test voltages comprises reading out the first pattern of test voltages immediately after the first time period to bypass an exposure period.

12. The method defined in claim 8 , wherein the second time period occurs after the first time period.

13. The method defined in claim 8 , wherein the second time period occurs at the same time as the first time period, and wherein the first and second patterns of test voltages are identical.

14. A system, comprising:

a central processing unit;

memory;

input-output circuitry; and

an imaging device, wherein the imaging device comprises:

an array of image pixels arranged in rows and columns, wherein each image pixel in the array comprises a reset transistor, a floating diffusion node, and a photodiode;

a first switch configured to pass a reset voltage to each respective floating diffusion node in a given column of image pixels in the array when the respective reset transistors in the image pixels in the column are turned on; and

a second switch configured to pass a test voltage to a respective photodiode in each column of image pixels in the array when the respective reset transistors in the image pixels are turned on, wherein the test voltage is immediately read out from the array after it has been loaded into the array to bypass an exposure period.

15. The system defined in claim 14 , wherein the first and second switches comprise n-channel transistors.

16. The system defined in claim 14 , wherein the first and second switches comprise p-channel transistors.

17. The system defined in claim 14 , wherein the second switch is also configured to pass the test voltage to another column in the array of image pixels.

18. The system defined in claim 14 , wherein the second switch is configured to pass the test voltage to a first image pixel in the column during a first time period, and wherein the second switch is further configured to pass a different test voltage to a second image pixel in the column during a second time period.

19. The system defined in claim 14 , wherein the imaging device is operable in a rolling shutter mode.

20. The system defined in claim 14 , wherein the imaging device is operable in a global shutter mode.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2014
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034673/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2014
From: BECK, JEFFERY; MCCORD, CHARLES; SILSBY, CHRISTOPHER
To: APTINA IMAGING CORPORATION
Reel/Frame 033909/0777 →