IP Library Granted Patent US 8,970,836
Granted Patent B2
US 8,970,836 · App. 14/235,916 · Granted Mar 3, 2015

Defect inspecting apparatus and defect inspecting method

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Quick Facts
Patent No.
US 8,970,836
App. No.
14/235,916
Granted
Mar 3, 2015
Kind
B2
Abstract

An invention being applied is a defect detecting apparatus that has: an illuminating optical system with a laser light source for irradiating a sample on whose surface a pattern is formed with light; a detecting optical system with a sensor for detecting light generated from the sample illuminated by the illuminating optical system; and a signal processing unit that extracts a defect from an image based on the light detected by the detecting optical system, in which an amplification rate of the sensor is dynamically changed during a time when the light is detected by the detecting optical system.

Claims (57)

1. A defect inspecting apparatus, comprising:

an illuminating optical system having a laser light source for irradiating a sample;

a detecting optical system having a sensor for detecting light generated from the sample; and

a signal processing unit that extracts a defect from an image generated from the light,

wherein an amplification rate of the sensor is set based on brightness information from a predetermined image, and

wherein the amplification rate is dynamically adjusted during a time the light is detected.

2. The defect inspecting apparatus according to claim 1 ,

wherein the amplification rate is adjusted based on the light.

3. The defect inspecting apparatus according to either claim 1 ,

wherein the amplification rate is adjusted based on a magnitude of the light.

4. The defect inspecting apparatus according to claim 1 ,

wherein the amplification rate is adjusted for predetermined areas of the sample based on the brightness information.

5. The defect inspecting apparatus according to claim 1 ,

wherein the amplification rate is dynamically adjusted based on an intensity of light from a predetermined number of pixels of the sample.

6. The defect inspecting apparatus according to claim 1 ,

wherein the sensor is an avalanche photodiode.

7. A defect inspecting apparatus, comprising:

an illuminating optical system having a laser light source for irradiating a sample on whose surface a pattern is formed with light;

a detecting optical system having a sensor for detecting light generated from the sample illuminated by the illuminating optical system; and

a signal processing unit that extracts a defect from an image based on the light detected by the detecting optical system,

wherein the laser light source is a pulsed light source,

wherein the sensor switches ON/OFF within a time shorter than a pulse interval of the pulsed light source, and

wherein an amplification rate of the sensor is dynamically changed during a time when the light is detected by the detecting optical system.

8. The defect inspecting apparatus according to claim 1 ,

wherein the laser light source is a pulsed light source, and

wherein the sensor performs sampling when a pulse of the pulsed light source reaches the sensor.

9. The defect inspecting apparatus according to claim 1 ,

wherein the detecting optical system comprises a plurality of sensors for detecting light scattered at different elevation angles with respect to a surface of the sample, and

wherein the signal processing unit performs integrated processing on the light, respectively.

10. An defect inspecting method, comprising:

irradiating a sample;

detecting light generated from the sample; and

extracting a defect from an image generated from the light,

wherein an amplification of a sensor is set based on brightness information from a predetermined image, and

wherein the amplification rate is dynamically adjusted during a time the light is detected.

11. The defect inspecting method according to claim 10 ,

wherein the amplification rate is adjusted based on the light.

12. The defect inspecting method according to claim 10 ,

wherein the amplification rate is adjusted based on a magnitude of the light.

13. The defect inspecting method according to claim 10 ,

wherein the amplification rate is adjusted for every predetermined areas of the sample based on the brightness information.

14. The defect inspecting method according to claim 10 ,

wherein the amplification rate is dynamically adjusted based on an intensity of light from a predetermined number of pixels of the sample.

15. The defect inspecting method according to claim 10 ,

wherein the sensor is an avalanche photodiode.

16. The defect inspecting method according to claim 10

wherein irradiating the sample is by a pulsed light source, and

wherein the sensor performs sampling when a pulse of the pulsed light source reaches the sensor.

17. The defect inspecting method according to claim 10 ,

wherein detecting light scattered at different elevation angles with respect to a surface of the sample, respectively, and

wherein integrated processing is performed on the scattered light.

18. The defect inspecting apparatus according to claim 1 ,

wherein the laser light source is a pulsed light source, and

wherein the sensor switches ON/OFF within a time shorter than a pulse interval of the pulsed light source.

19. The defect inspecting method according to claim 10 ,

wherein irradiating the sample by a pulsed light source, and

wherein the sensor switches ON/OFF within a time shorter than a pulse interval of the pulsed light source.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2014
From: TANIGUCHI, ATSUSHI; UENO, TAKETO; MATSUMOTO, SHUNICHI; SHIBATA, YUKIHIRO; HONDA, TOSHIFUMI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 032788/0488 →