IP Library Granted Patent US 9,263,441
Granted Patent B2
US 9,263,441 · App. 14/244,330 · Granted Feb 16, 2016

Implant for performance enhancement of selected transistors in an integrated circuit

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,263,441
App. No.
14/244,330
Granted
Feb 16, 2016
Kind
B2
Abstract

A first implant is performed into a substrate to form a well in which a plurality of transistors will be formed. Each transistor of a first subset of the plurality of transistors to be formed has a width that satisfies a predetermined width constraint and each transistor of a second subset has a width that does not satisfy the constraint. A second implant is performed at locations in the well in which transistors of the first subset will be formed and not at locations in the well in which transistors of the second subset will be formed. The transistors are formed, wherein a channel region of each transistor of the first subset is formed in a portion of the substrate which received the second implant and a channel region of each transistor of the second subset is formed in a portion of the substrate which did not receive the second implant.

Claims (39)

1. A semiconductor structure comprising:

a well; and

a plurality of transistors formed within the well, wherein:

each transistor of the plurality of transistors is of a same conductivity type, and

the plurality of transistors comprises:

a first subset of transistors, wherein each transistor in the first subset of transistors has a transistor width that does not satisfy a predetermined width constraint; and

a second subset of transistors, mutually exclusive with the first subset of transistors, wherein each transistor in the second subset of transistors has a transistor width that satisfies the predetermined width constraint, wherein each transistor in the second subset of transistors has a channel region which includes an additional dopant as compared to the channel regions of the first subset of transistors, and wherein the channel region of each transistor of the plurality of transistors has a dopant of a first conductivity type and the additional dopant in the channel region of each transistor of the second subset of transistors is of a second conductivity type opposite the first conductivity type.

2. The semiconductor structure of claim 1 , wherein the transistor width of each transistor in the second subset of transistors is less than a predetermined transistor width and the transistor width of each transistor in the first subset of transistors is not less than a predetermined transistor width.

3. The semiconductor structure of claim 1 , wherein each transistor of the first subset of the plurality of transistors has a first threshold voltage and each transistor of the second subset has a second threshold voltage greater than the first threshold voltage.

4. The semiconductor structure of claim 1 , wherein each transistor of the plurality of transistors has

a gate electrode,

a first source/drain region adjacent a first sidewall of the gate electrode, and

a second source/drain region adjacent a second sidewall of the gate electrode, wherein the channel region of each transistor of the plurality of transistors is located under the gate electrode of each transistor, between the first and second source/drain regions of each transistor.

5. The semiconductor structure of claim 4 , wherein a first transistor of the first subset of transistors is immediately adjacent a second transistor of the second subset of transistors, wherein the first transistor and the second transistor share a source/drain region.

6. The semiconductor structure of claim 1 , wherein a resultant dopant concentration of the channel regions of the transistors of the first subset of the plurality of transistors is less than a resultant dopant concentration of the channel regions of the transistors of the second subset of the plurality of transistors.

7. A semiconductor structure comprising:

a well; and

a plurality of transistors formed within the well, wherein:

each transistor of the plurality of transistors is of a same conductivity type, and

the plurality of transistors comprises:

a first subset of transistors, wherein each transistor in the first subset of transistors has a transistor width not less than a predetermined width; and

a second subset of transistors, mutually exclusive with the first subset of transistors, wherein each transistor in the second subset of transistors has a transistor width less than the predetermined width, wherein each transistor in the first subset of transistors has a channel region which comprises a first dopant, wherein each transistor in the second subset of transistors has a channel region which comprises a second dopant, wherein each transistor of the first subset of transistors has a first threshold voltage, wherein each transistor of the second subset of transistors has a second threshold voltage, and wherein the first threshold voltage is greater than the second threshold voltage.

8. The semiconductor structure of claim 7 , wherein the first dopant is of a first conductivity type and the second dopant is of a second conductivity type opposite the first conductivity type.

9. The semiconductor structure of claim 7 , wherein the channel region of each transistor of the plurality of transistors comprises the first dopant.

10. The semiconductor structure of claim 7 , wherein the transistor width of each transistor in the second subset of transistors satisfies a predetermined transistor width constraint and the transistor width of each transistor in the first subset of transistors does not satisfy a predetermined transistor width constraint.

11. The semiconductor structure of claim 7 , wherein the first dopant is of a first conductivity type and the second dopant is of a same conductivity type.

12. The semiconductor structure of claim 7 , wherein each transistor of the plurality of transistors has

a gate electrode,

a first source/drain region adjacent a first sidewall of the gate electrode, and

a second source/drain region adjacent a second sidewall of the gate electrode, wherein the channel region of each transistor of the plurality of transistors is located under the gate electrode of each transistor, between the first and second source/drain regions of each transistor.

13. The semiconductor structure of claim 12 , wherein a first transistor of the first subset of transistors is immediately adjacent a second transistor of the second subset of transistors, wherein the first transistor and the second transistor share a source/drain region.

14. The semiconductor structure of claim 7 , wherein a resultant dopant concentration of the channel regions of the transistors of the first subset of the plurality of transistors is less than a resultant dopant concentration of the channel regions of the transistors of the second subset of the plurality of transistors.

15. A semiconductor structure comprising:

a well; and

a plurality of transistors formed within the well, wherein:

each transistor of the plurality of transistors is of a same conductivity type, and

the plurality of transistors comprises:

a first subset of transistors, wherein each transistor in the first subset of transistors has a transistor width that does not satisfy a predetermined width constraint; and

a second subset of transistors, mutually exclusive with the first subset of transistors, wherein each transistor in the second subset of transistors has a transistor width that satisfies the predetermined width constraint, wherein each transistor in the second subset of transistors has a channel region which includes an additional dopant as compared to the channel regions of the first subset of transistors, and wherein the channel region of each transistor of the plurality of transistors has a dopant of a first conductivity type and the additional dopant in each channel region of each transistor of the second subset of transistors is of a same conductivity type.

Assignments (24)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
MERGER Recorded Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT OF INCORRECT APPLICATION 14/258,829 PREVIOUSLY RECORDED ON REEL 037444 FRAME 0109. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Aug 10, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039639/0208 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 14/258,829 AND REPLACE ITWITH 14/258,629 PREVIOUSLY RECORDED ON REEL 037444 FRAME 0082. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OFSECURITY INTEREST IN PATENTS. Recorded Aug 10, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039639/0332 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0082 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0109 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0903 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Aug 1, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 033462/0267 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Aug 1, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 033462/0293 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Aug 1, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 033460/0337 →