IP Library Granted Patent US 8,987,847
Granted Patent B2
US 8,987,847 · App. 14/244,937 · Granted Mar 24, 2015

Co/Ni multilayers with improved out-of-plane anisotropy for magnetic device applications

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Quick Facts
Patent No.
US 8,987,847
App. No.
14/244,937
Granted
Mar 24, 2015
Kind
B2
Abstract

A MTJ for a spintronic device is disclosed and includes a thin seed layer that enhances perpendicular magnetic anisotropy (PMA) in an overlying laminated layer with a (Co/X) n or (CoX) n composition where n is from 2 to 30, X is one of V, Rh, Ir, Os, Ru, Au, Cr, Mo, Cu, Ti, Re, Mg, or Si, and CoX is a disordered alloy. The seed layer is preferably NiCr, NiFeCr, Hf, or a composite thereof with a thickness from 10 to 100 Angstroms. Furthermore, a magnetic layer such as CoFeB may be formed between the laminated layer and a tunnel barrier layer to serve as a transitional layer between a (111) laminate and (100) MgO tunnel barrier. The laminated layer may be used as a reference layer, dipole layer, or free layer in a MTJ. Annealing between 300° C. and 400° C. may be used to further enhance PMA in the laminated layer.

Claims (10)

1. A magnetic tunnel junction (MTJ), comprising:

(a) a seed layer formed on a substrate;

(b) a free layer comprising a laminated stack that contacts a top surface of the seed layer, the laminated layer has intrinsic perpendicular magnetic anisotropy (PMA) and comprises a (Co/X) n or (CoX) n structure wherein X is one of V, Rh, Ir, Os, Ru, Au, Cr, Mo, Cu, Ti, Re, Mg, and Si, CoX is a disordered alloy, and n is the number of laminates in the stack;

(c) a tunnel barrier layer formed on the free layer;

(d) a reference layer formed on the tunnel barrier layer; and

(e) and a capping layer formed on the reference layer.

2. The MTJ of claim 1 wherein the seed layer is Hf, NiFeCr, or NiCr, or a composite with a Hf/NiCr, Hf/NiFeCr, NiFeCr/Hf, or NiCr/Hf configuration and having a thickness between about 5 and 100 Angstroms.

3. The MTJ of claim 1 further comprised of a magnetic layer made of CoFeB, CoFe, or combinations thereof formed between the laminated stack and the tunnel barrier layer.

4. The MTJ of claim 1 wherein n is from 2 to 30.

5. The MTJ of claim 1 wherein each of the Co layers in the (Co/X) n structure has a thickness from about 1.5 to 4 Angstroms, and each of the plurality of X layers has a thickness from about 4 to 10 Angstroms.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 25, 2019
From: HEADWAY TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 048692/0917 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2018
From: MAGIC TECHNOLOGIES, INC.
To: HEADWAY TECHNOLOGIES, INC.
Reel/Frame 047604/0081 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 22, 2018
From: JAN, GUENOLE; TONG, RU-YING; WANG, YU-JEN
To: MAGIC TECHNOLOGIES, INC.
Reel/Frame 047257/0345 →