IP Library Granted Patent US 9,292,380
Granted Patent B2
US 9,292,380 · App. 14/246,140 · Granted Mar 22, 2016

Memory access scheme for system on chip

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,292,380
App. No.
14/246,140
Granted
Mar 22, 2016
Kind
B2
Abstract

Hardware processors in an SOC integrated circuit logically swapping memories by remapping memory addresses, including tightly coupled and local memories, to enable a sequence of data-processing algorithms to execute more quickly by different hardware processors without having to copy the data between different memories using a relatively slow data crossbar switch. When a memory stores error-correction code (ECC) address information linking stored ECC data with stored user data, the hardware processor dynamically remaps the ECC address information, as needed.

Claims (32)

1. A method of processing data within an integrated circuit, the method comprising:

(a) processing a first set of data using a first hardware processor to generate a second set of data;

(b) storing the second set of data in a first memory;

(c) remapping addresses of the first memory with addresses of a second memory to swap the first and second memories; and

(d) accessing and processing the second set of data in the first memory by a second hardware processor using the remapped addresses of the first memory to generate a third set of data.

2. The method of claim 1 , wherein step (d) further comprises storing the third set of data into the first memory.

3. The method of claim 1 , wherein the second memory is a tightly coupled memory for the second hardware processor.

4. The method of claim 1 , wherein the first memory is part of system memory that can be accessed by the first and second hardware processors via a data crossbar switch.

5. The method of claim 4 , wherein step (d) comprises the second hardware processor bypassing the data crossbar switch to access the second set of data in the first memory.

6. The method of claim 5 , wherein the second memory is a tightly coupled memory for the second hardware processor.

7. The method of claim 1 , wherein:

the first memory stores second error correction code (ECC) data for the second set of data and second ECC address information linking the second ECC data to the second set of data; and

step (d) further comprises accessing the second ECC data and the second ECC address information in the first memory and remapping the second ECC address information on the fly.

8. The method of claim 7 , wherein step (d) further comprises storing, into the first memory, the third set of data, third ECC data for the third set of data, and third ECC address information linking the third ECC data to the third set of data.

9. The method of claim 8 , wherein the third ECC address information is remapped dynamically.

10. An integrated circuit, comprising:

a first hardware processor;

a first memory associated with the first hardware processor;

a second hardware processor; and

a second memory associated with the second hardware processor, wherein:

the first hardware processor is configured to (i) process a first set of data to generate a second set of data and (ii) store the second set of data in the first memory; and

the second hardware processor is configured to (i) remap addresses of the first memory with addresses of the second memory to swap the first and second memories and (ii) access and process the second set of data in the first memory using the remapped addresses of the first memory to generate a third set of data.

11. The integrated circuit of claim 10 , wherein the second hardware processor is configured to store the third set of data into the first memory.

12. The integrated circuit of claim 10 , wherein the second memory is a tightly coupled memory for the second hardware processor.

13. The integrated circuit of claim 10 , wherein the first memory is part of system memory that can be accessed by the first and second hardware processors via a data crossbar switch of the integrated circuit.

14. The integrated circuit of claim 13 , wherein the second hardware processor is configured to bypass the data crossbar switch to access the second set of data in the first memory.

15. The integrated circuit of claim 14 , wherein the second memory is a tightly coupled memory for the second hardware processor.

16. The integrated circuit of claim 10 , wherein:

the first memory is configured to store second ECC data for the second set of data and second ECC address information linking the second ECC data to the second set of data; and

the second hardware processor is configured to (i) access the second ECC data and the second ECC address information in the first memory and (ii) remap the second ECC address information dynamically.

17. The integrated circuit of claim 16 , wherein the second hardware processor is configured to store, into the first memory, the third set of data, third ECC data for the third set of data, and third ECC address information linking the third ECC data to the third set of data.

18. The integrated circuit of claim 17 , wherein the second hardware processor is configured to remap the third ECC address information dynamically.

Assignments (25)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
MERGER Recorded Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT OF INCORRECT APPLICATION 14/258,829 PREVIOUSLY RECORDED ON REEL 037444 FRAME 0109. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Aug 10, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039639/0208 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 14/258,829 AND REPLACE ITWITH 14/258,629 PREVIOUSLY RECORDED ON REEL 037444 FRAME 0082. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OFSECURITY INTEREST IN PATENTS. Recorded Aug 10, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039639/0332 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0082 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0109 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0903 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Aug 1, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 033460/0337 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Aug 1, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 033462/0293 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Aug 1, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 033462/0267 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2014
From: SINGH, NITIN; JAIN, GAURAV; JINDAL, AMIT; TOMAR, ROHIT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 032631/0063 →