Stackable via package and method

1. An electronic component assembly comprising:

a first component comprising:

a first substrate;

a plurality of first terminals on the first substrate; and

a plurality of solder structures, each of which is formed on a respective one of the plurality of first terminals; and

a second component comprising:

a second substrate;

a plurality of second terminals on the second substrate; and

a plurality of pins extending from the second component, wherein:

each of the plurality of pins is formed on and extends from a respective one of the plurality of second terminals; and

each of plurality of pins is formed of a material that has a higher melting temperature than solder; and

a semiconductor die positioned between the first substrate and the second substrate,

wherein the second component is positioned relative to the first component such that each of the plurality of pins extends into but not past a respective one of the plurality of solder structures, and at least a first pin of the plurality of pins extending from the second component is entirely covered by solder from the respective solder structure into which it extends.

2. The electronic component of claim 1 , wherein at least a portion of the plurality of pins serve as a standoff to maintain a gap between the second component and the first component.

3. The electronic component of claim 1 , wherein each of the plurality of pins extends through a respective aperture in over-molding and into a respective one of the plurality of solder structures.

4. The electronic component of claim 1 , wherein each solder structure of the plurality of solder structures contacts a sidewall of a respective aperture that blocks solder flow from the respective solder structure.

5. The electronic component of claim 1 , wherein the first pin is covered by solder along its entire length from its respective second terminal.

6. The electronic component of claim 1 , wherein at least one of the plurality of pins of the second component contacts a respective one of the first terminals of the first component.

7. An electronic component assembly comprising:

a lower component comprising:

a plurality of lower terminals; and

a plurality of pins extending upward from the lower component, each of which extending upward from a respective one of the plurality of lower terminals, and

an upper component comprising:

a plurality of upper terminals; and

a plurality of reflowable conductive structures, each of which extending downward from a respective one of the plurality of upper terminals;

wherein each of the plurality of pins extending upward from the lower component extends into, and is substantially covered by, a respective one of the plurality of reflowable conductive structures, such that a first end of the respective reflowable conductive structure toward the upper component is wider than a second end of the respective reflowable conductive structure toward the lower component.

8. The electronic component of claim 7 , wherein the plurality of pins are formed of a material that has a higher melting temperature than that of the plurality of reflowable conductive structures.

9. The electronic component of claim 8 , wherein the plurality of pins are formed of a conductive metal wire, and the plurality of reflowable conductive structures are formed of solder.

10. The electronic component of claim 9 , wherein the plurality of pins are formed of at least one of gold and/or copper.

11. The electronic component of claim 8 , wherein at least a portion of the plurality of pins serve as standoffs between the upper and lower components.

12. The electronic component of claim 8 , comprising a semiconductor die positioned between the upper and lower components.

13. The electronic component of claim 8 , wherein at least one of the plurality of pins extending upward from the lower component is completely covered in material from its respective reflowable conductive structure.

14. The electronic component of claim 8 , wherein each of the plurality of pins extending upward from a respective one of the plurality of lower terminals is substantially narrower than its respective lower terminal.

15. The electronic component of claim 8 , wherein at least one of the plurality of pins of the lower component contacts a lower surface of a respective one of the upper terminals.

16. The electronic component of claim 8 , wherein each of the plurality of pins comprises a gold pin.

17. The electronic component of claim 8 , wherein the lower component comprises a printed circuit board.

18. A method for making an electronic component assembly, the method comprising:

receiving a lower component comprising a substrate and a plurality of lower component terminals formed on an upper surface of the substrate;

forming a plurality of pins extending upward from the lower component, said forming comprising forming a respective pin extending upward from each of the plurality of lower component terminals;

receiving an upper component comprising a plurality of upper component terminals and a respective reflowable conductive structure on each of the plurality of upper component terminals;

stacking the upper component on the lower component, such that each of the reflowable conductive structures of the upper component is positioned over a respective one of the pins of the lower component; and

after said stacking, reflowing the reflowable conductive structures, but not the pins, to bond the pins to the reflowable conductive structures,

wherein each of the plurality of pins extending upward from the lower component is substantially covered by its respective reflowable conductive structure, such that a first end of the respective reflowable conductive structure toward the upper component is wider than a second end of the respective reflowable conductive structure toward the lower component.

19. The method of claim 18 , wherein each of the reflowable conductive structures comprises a solder ball, and said stacking comprises stacking the upper component on the lower component such that each of the solder balls contacts a respective one of the pins.

20. The method of claim 18 , wherein said stacking comprises positioning a semiconductor die in a gap between the upper component and the lower component, and said reflowing comprises reflowing the plurality of conductive structures to allow the plurality of pins to serve as standoffs to maintain the gap between the second component and the first component.