Granted Patent B2

US 9,638,596 · App. 14/248,324 · Granted May 2, 2017

Abstract

Claims (25)

1. A sensor device, comprising:

a lead frame having a die paddle;

a master control unit (MCU) attached to the die paddle of the lead frame;

a P-cell mounted on an active side of the MCU, wherein the P-cell has a pressure-sensing active region facing and electrically connected to the active side of the MCU;

a substrate having a central opening attached to the lead frame, wherein the central opening forms a cavity, the die paddle is exposed through the central opening, and the MCU and the P-cell are located within the cavity;

a pressure-sensitive gel covering the active region of the P-cell;

bond wires electrically connecting the MCU to the substrate; and

conductive balls attached to the substrate, wherein the conductive balls are electrically connected to the MCU by way of conductive traces in the substrate and the bond wires.

2. The sensor device of claim 1 , wherein the P-cell is electrically connected to the MCU without using any bond wires.

3. The sensor device of claim 1 , wherein the pressure-sensing active region of the P-cell and the MCU are electrically connected with conductive bumps.

4. The sensor device of claim 1 , further comprising a G-cell mounted on and electrically connected to the MCU.

5. The sensor device of claim 1 , wherein the central opening allows atmospheric pressure outside of the sensor device to reach the pressure-sensing active region of the P-cell.

6. The sensor device of claim 1 , wherein lead frame includes a hole that enables atmospheric pressure to reach the pressure-sensing active region of the P-cell via the pressure-sensitive gel.

7. A method for assembling a sensor device, comprising:

attaching a master control unit (MCU) to a die paddle of a lead frame, wherein a bottom side of the MCU is attached to the die paddle; and

electrically connecting a P-cell having a pressure-sensing active region to the MCU, wherein the pressure-sensing active region faces an active side of the MCU;

attaching a substrate having a central opening to the lead frame, wherein the die paddle is exposed through the central opening, and the MCU and P-cell are disposed within the cavity;

at least partially filling the cavity with pressure-sensitive gel such that the gel covers the MCU and the P-cell;

electrically connecting the MCU with the substrate with bond wires, wherein the gel also covers the bond wires; and

attaching a plurality of conductive balls to the substrate, wherein the conductive balls are in electrical communication with the MCU by way of conductive traces in the substrate and the bond wires.

8. The method of claim 7 , further comprising forming a dam around the cavity on a first surface of the substrate prior to dispensing the pressure-sensitive gel.

9. The method of claim 7 , wherein electrically connecting the P-cell to the MCU comprises face-to-face bonding the P-cell to the MCU.

10. The method of claim 7 , wherein electrically connecting the P-cell to the MCU comprises electrically connecting the P-cell to the MCU using bumps.

11. The method of claim 7 , further comprising electrically connecting a G-cell to the MCU using face-to-face bonding.

12. The sensor device assembled in accordance with the method of claim 7 .

Assignments (26)