IDENTIFICATION MECHANISM FOR SEMICONDUCTOR DEVICE DIE
A method and system for uniquely identifying each semiconductor device die from a wafer is provided. Identifying features are associated with device die bond pads. In one embodiment, one or more tab features are patterned and associated with each of one or more device die bond pads. These features can represent a code (e.g., binary or ternary) that uniquely identifies each device die on the wafer. Each tab feature can be the same shape or different shapes, depending upon the nature of coding desired. Alternatively, portions of the one or more device die bond pads can be omitted as a mechanism for providing coded information, rather than adding portions to the device die bond pads.
1 - 12 . (canceled)
13 . A die located on a semiconductor wafer, the die comprising:
a first bond pad located in a bond pad region; and
one or more bond pad features coupled to the first bond pad, wherein an aspect of the one or more bond pad features provides information associated with the die.
14 . The die of claim 13 further comprising:
a first set of one or more bond pads in the bond pad region, wherein
the first set of bond pads comprises the first bond pad,
the first set of bond pads is configured to provide the information associated with the die, and
one or more of the first set of bond pads each comprises one or more bond pad features.
15 . The die of claim 14 wherein the information associated with the die uniquely identifies the die on the semiconductor wafer.
16 . The die of claim 14 wherein the information associated with the die uniquely identifies a location of the die on the semiconductor wafer.
17 . The die of claim 16 wherein the information associated with the die comprises:
an X-coordinate associated with a grid square, corresponding to the die, on a wafer map associated with the semiconductor wafer; and
a Y-coordinate associated with the grid square.
18 . The die of claim 17 further comprising:
a first set of the one or more bond pad features corresponding to each digit of a binary representation of the X-coordinate; and
a second set of the one or more bond pad features corresponding to each digit of a binary representation of the Y-coordinate.
19 . The die of claim 13 wherein the aspect of the one or more bond pad features comprises one or more of a number of the bond pad features associated with the first bond pad, a shape of each bond pad feature, and indentations formed in the first bond pad.
20 . A semiconductor wafer comprising:
a plurality of integrated circuit dies formed on the semiconductor wafer, wherein each integrated circuit die comprises
one or more bond pads located on the integrated circuit die,
a first set of the one or more bond pads configured to provide unique information associated with the integrated circuit die by virtue of comprising one or more bond pad features associated with one or more bond pads of the first set of bond pads.
21 . The semiconductor wafer of claim 20 wherein the information associated with the integrated circuit die uniquely identifies the integrated circuit die on the semiconductor wafer.
22 . The semiconductor wafer of claim 20 wherein the information associated with the die uniquely identifies a location of the integrated circuit die on the semiconductor wafer.
23 . The semiconductor wafer of claim 22 wherein the information associated with the integrated circuit die comprises:
an X-coordinate associated with a grid square, corresponding to the die, on a wafer map associated with the semiconductor wafer; and
a Y-coordinate associated with the grid square.
24 . The semiconductor wafer of claim 23 further comprising:
a first set of the one or more bond pad features corresponding to each digit of a binary representation of the X-coordinate; and
a second set of the one or more bond pad features corresponding to each digit of a binary representation of the Y-coordinate.
25 . The semiconductor wafer of claim 20 wherein the aspect of the one or more bond pad features comprises one or more of a number of the bond pad features associated with the first bond pad, a shape of each bond pad feature, and indentations formed in the first bond pad.