Methods for bonding a die and a substrate
View Patent ↗Embodiments of methods for forming a semiconductor device that includes a die and a substrate include pressing together the die and the substrate such that a first gold layer and one or more additional material layers are between the die and the substrate, and performing a bonding operation to form a die attach layer between the die and the substrate. The die attach layer includes a gold interface layer that includes gold and a plurality of first precipitates in the gold. Each of the first precipitates includes a combination of nickel, cobalt, palladium, gold, and silicon.
1. A method for forming a semiconductor device that includes a die and a substrate, the method comprising:
forming a barrier layer over a first surface of a portion of the substrate;
forming a palladium layer over the barrier layer;
forming a first gold layer over a first surface of the die; and
bonding the die and the substrate by
pressing together the die and the substrate such that the first gold layer and the palladium layer are between the die and the substrate, and
heating the first gold layer and the palladium layer to form a die attach layer between the die and the substrate, the die attach layer comprising a gold interface layer that includes gold and a plurality of first precipitates in the gold, wherein each of the first precipitates comprises a combination of nickel, cobalt, palladium, gold, and silicon.
2. The method of forming a semiconductor device according to claim 1 , wherein the barrier layer comprises cobalt and nickel.
3. The method of forming a semiconductor device according to claim 1 , wherein forming the barrier layer comprises forming the barrier layer to have a thickness in a range of 1 micron to 10 microns.
4. The method of forming a semiconductor device according to claim 1 , wherein forming the palladium layer comprises forming the palladium layer to have a thickness in a range of 0.03 micron to 0.5 micron.
5. The method for forming a semiconductor device according to claim 1 , wherein forming the first gold layer comprises forming the first gold layer to have a thickness in a range of 1.2 microns to 2.0 microns.
6. The method for forming a semiconductor device according to claim 1 , wherein forming the first gold layer comprises forming the first gold layer to have a thickness of up to 2.5 microns.
7. The method of forming a semiconductor device according to claim 1 , further comprising:
forming a second gold layer over the palladium layer prior to bonding the die and the substrate.
8. The method for forming a semiconductor device according to claim 7 , wherein forming the second gold layer comprises forming the second gold layer to have a thickness in a range of at least 0.03 microns.
9. The method for forming a semiconductor device according to claim 1 , wherein heating the first gold layer and the palladium layer comprises heating the substrate and the die to a temperature of 430 degrees Celsius or less.
10. The method for forming a semiconductor device according to claim 1 , wherein pressing together the die and the substrate comprises applying a force between the die and the substrate.
11. The method for forming a semiconductor device according to claim 1 , wherein bonding the die and the substrate further comprises scrubbing together the die and the substrate.
12. The method for forming a semiconductor device according to claim 1 , wherein the step of bonding is further characterized in that the die attach layer has a thickness in a range of 0.1 microns to 10 microns.
13. The method for forming a semiconductor device according to claim 1 , wherein the step of bonding is further characterized in that, after the step of bonding, the first gold layer is in contact with a silicon portion of the die.
14. The method for forming a semiconductor device according to claim 1 , further comprising:
coupling a plurality of leads to the substrate; and
forming electrical connections between the die and the plurality of leads.
15. The method for forming a semiconductor device according to claim 14 , further comprising:
coupling insulating layers between the primary portion of the substrate and the leads.
16. A method for forming a semiconductor device that includes a die and a substrate, the method comprising:
pressing together the die and the substrate such that a first gold layer and one or more additional material layers are between the die and the substrate; and
performing a bonding operation to form a die attach layer between the die and the substrate, the die attach layer comprising a gold interface layer that includes gold and a plurality of first precipitates in the gold, wherein each of the first precipitates comprises a combination of nickel, cobalt, palladium, gold, and silicon.
17. The method for forming a semiconductor device according to claim 16 , further comprising the steps, performed before pressing together the die and the substrate, of:
forming a barrier layer comprising cobalt and nickel over a first surface of a portion of the substrate;
forming a palladium layer over the barrier layer; and
forming the first gold layer over a first surface of the die.
18. The method for forming a semiconductor device according to claim 17 , wherein forming the first gold layer comprises forming the first gold layer to have a thickness up to 2.5 microns.
19. The method of forming a semiconductor device according to claim 17 , further comprising:
forming a second gold layer over the palladium layer prior to pressing together the die and the substrate.
20. The method for forming a semiconductor device according to claim 19 , wherein forming the second gold layer comprises forming the second gold layer to have a thickness of at least 0.03 microns.