Semiconductor wafer and method of concurrently testing circuits formed thereon
View Patent ↗A semiconductor wafer has an array of integrated circuit dies formed on it. Each die is enclosed by a respective seal ring. Each die has a group of bond pads and test pads coupled to the bond pads. A test pad region is formed on the wafer. The test pad region has probe pads and common electrical interconnects that selectively electrically couple each of the probe pads to a bond pad on each of the dies. The common electrical interconnects in the test pad region reduce the possibility of probe damage to the integrated circuits and allow the dies to be tested concurrently before being cut from the wafer.
1. A semiconductor wafer, comprising:
a semiconductor substrate;
an array comprising identical integrated circuits formed on the substrate, wherein each of the integrated circuits has a plurality of bond pads;
a plurality of seal rings, each seal ring enclosing a respective one of the integrated circuits;
at least one test pad region formed on the substrate, wherein the at least one test pad region includes at least a first probe pad and a second probe pad;
a first common electrical interconnect that electrically couples the first probe pad to a respective one of the bond pads of each of the integrated circuits of the array; and
a second common electrical interconnect that electrically couples the second probe pad to a respective one of the bond pads of each of the integrated circuits of the array.
2. The semiconductor wafer as claimed in claim 1 , wherein the each of the seal rings provide a rectangular boundary of four boundary edges and the first and second common electrical interconnects each include an interface runner region extending past each respective boundary edge.
3. The semiconductor wafer as claimed in claim 2 , wherein each interface runner region is aligned with and coupled to an interface runner region on an adjacent one of the identical circuits.
4. The semiconductor wafer as claimed in claim 1 , wherein the first common electrical interconnect and the second common electrical interconnect are on an active surface of each of the integrated circuits.
5. The semiconductor wafer as claimed in claim 1 , wherein a further one of the seal rings encloses the at least one test pad region.
6. The semiconductor wafer as claimed in claim 1 , wherein the at least one test pad region forms part of the array.
7. The semiconductor wafer as claimed in claim 1 , wherein each of the integrated circuits has at least one individual circuit test pad coupled to one of the bond pads, and wherein the individual circuit test pad is electrically isolated from all other integrated circuits.
8. A method of testing an array of identical integrated circuits formed on a semiconductor substrate, each of the integrated circuits being enclosed by a respective seal ring and each of the integrated circuits having a plurality of bond pads, wherein there is at least one test pad region formed on the substrate, and the at least one test pad region includes at least a first probe pad and a second probe pad, and wherein the array comprises a first common electrical interconnect that electrically couples the first probe pad to a respective one of the bond pads of each of the integrated circuits of the array, and the array further comprises a second common electrical interconnect that electrically couples the second probe pad to a respective one of the bond pads of each of the integrated circuits of the array, the method comprising:
selectively coupling test probes to the first and second probe pads;
selectively supplying input test patterns to the test probes to thereby concurrently supply the input test patterns to all the integrated circuits in the array; and
processing output test patterns from the test probes in response to the input test patterns, wherein the output test patterns are received by one or more of said test probes to thereby determine if any of the integrated circuits are faulty.
9. The method of testing as claimed in claim 8 , wherein each of the integrated circuits has at least one individual circuit test pad coupled to one of the bond pads, and wherein the at least one individual circuit test pad is electrically isolated from all other integrated circuits.
10. The method of testing as claimed in claim 9 , wherein the selectively coupling includes coupling at least one of the test probes to the at least one individual circuit test pad, and selectively supplying of the input test patterns to the probe pads and the at least one individual circuit test pad is performed concurrently.
11. The method of testing as claimed in claim 10 , wherein the processing identifies which, if any, of the integrated circuits are faulty.
12. The method of testing as claimed in claim 8 , wherein the each of the seal rings provide a rectangular boundary of four boundary edges and the first and second common electrical interconnects each include an interface runner region extending past each respective boundary edge.
13. The method of testing as claimed in claim 12 , wherein each interface runner region is aligned with and coupled to an interface runner region on an adjacent one of the identical integrated circuits.
14. The method of testing as claimed in claim 8 , wherein the probe pads include pads for supplying the input test input test patterns and at least one of the circuit test pads includes a pad for providing part of the output test patterns.
15. A method of assembling a packaged integrated circuit, the method including:
receiving a semiconductor wafer substrate with an array of identical fabricated semiconductor integrated circuits formed on the semiconductor wafer substrate, each of the integrated circuits being enclosed by a respective seal ring and each of the integrated circuits having a plurality of bond pads, wherein there is at least one test pad region formed on the substrate, and the at least one test pad region includes at least a first probe pad and a second probe pad, and wherein the array comprises a first common electrical interconnect that electrically couples the first probe pad to a respective one of the bond pads of each of the integrated circuits of the array, and the array further comprises a second common electrical interconnect that electrically couples the second probe pad to a respective one of the bond pads of each of the integrated circuits of the array, and wherein each of the integrated circuits has at least one individual circuit test pad coupled to one of the bond pads, and wherein the at least one individual circuit test pad is electrically isolated from all other integrated circuits;
testing concurrently each of the integrated circuits with input test patterns applied to the at least first and second probe pads and the at least one individual circuit test pads to identify which integrated circuits are fault free;
cutting one of the fault free integrated circuits from the semiconductor wafer substrate to provide a single integrated circuit enclosed by a said seal ring;
selectively electrically connecting the bond pads to external package connectors; and
enclosing the cut integrated circuit in a protective housing.
16. The method of claim 15 , wherein the first common electrical interconnect and the second common electrical interconnect are on an active surface of each of the integrated circuits.
17. The method of claim 15 , wherein the each of the seal rings provide a rectangular boundary of four boundary edges and the first and second common electrical interconnects each include an interface runner region extending past each respective boundary edge.
18. The method of claim 15 , wherein each integrated circuit includes more than one circuit test pad.
19. The method of claim 15 , wherein the probe pads include pads for supplying the input test patterns and at least one of the circuit test pads includes a pad for providing part of the output test patterns.
20. The method of claim 17 , wherein each interface runner region is aligned with and coupled to an interface runner region on an adjacent one of the integrated circuits.