IP Library Granted Patent US 9,683,937
Granted Patent B2
US 9,683,937 · App. 14/290,615 · Granted Jun 20, 2017

Imaging devices for molecule detection

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,683,937
App. No.
14/290,615
Granted
Jun 20, 2017
Kind
B2
Abstract

An imager may include an array of pixels formed on a substrate. A chemisorption layer such as a planar chemisorption layer may be deposited over the array of pixels. The chemisorption layer may include active sites that bond with anchoring molecules. The anchoring molecules may be bonded to the planar chemisorption layer in only localized regions each covering a respective pixel of the array of pixels. The image sensor may include a photoresist layer that covers the chemisorption layer. Openings in the photoresist layer may define the boundaries of the localized regions. The anchoring molecules may be bonded only with the chemisorption layer without bonding to the photoresist layer. The anchoring molecules may serve to bond with analyte molecules. By forming the anchoring molecules within only localized regions centered over respective pixels, spatial resolution of the imager when imaging the analyte molecules may be improved.

Claims (30)

1. An imager, comprising:

a substrate;

an array of pixels on the substrate;

a planar chemisorption layer over the array of pixels;

anchoring molecules that are bonded to the planar chemisorption layer in only localized regions each covering a respective pixel of the array of pixels; and

a photoresist layer that covers the planar chemisorption layer and is formed separately from the planar chemisorption layer, wherein openings in the photoresist layer define the localized regions.

2. The imager defined in claim 1 wherein the planar chemisorption layer comprises a polymer having active sites that chemically bond with the anchoring molecules.

3. The imager defined in claim 2 wherein the anchoring molecules are bonded only to the planar chemisorption layer.

4. The imager defined in claim 2 wherein the photoresist layer comprises a material that is chemically stable during alkaline conditions.

5. The imager defined in claim 4 wherein the photoresist layer comprises a polymer.

6. The imager defined in claim 5 wherein the active sites of the polymer comprise hydroxyl groups.

7. The imager defined in claim 5 wherein the planar chemisorption layer comprises a polymer having functional groups that bond with the anchoring molecules, wherein the functional groups are selected from the group consisting of: benzyl halides, alkyl halides, alkoxide, olefin, dienyl, thiol, amino, amido, and ester groups.

8. The imager defined in claim 1 further comprising:

a color filter layer interposed between the array of pixels and the planar chemisorption layer.

9. A method, comprising:

fabricating a pixel array on a substrate;

depositing a chemisorption layer having bonding sites;

after depositing the chemisorption layer, depositing a photoresist layer over the chemisorption layer, wherein depositing the photoresist layer comprises depositing a continuous photoresist layer across the entire pixel array;

after depositing the photoresist layer, patterning the photoresist layer using photolithography to remove portions of the photoresist layer, wherein remaining portions of the photoresist layer after patterning define localized openings in the photoresist layer over underlying pixels of the pixel array, wherein the openings do not include material of the photoresist layer, and wherein the localized openings in the photoresist layer expose the chemisorption layer; and

depositing anchoring molecules that bond with the bonding sites of the chemisorption layer in the localized openings of the photoresist layer.

10. The method defined in claim 9 wherein depositing the chemisorption layer having bonding sites comprises depositing a polymer layer having hydroxyl groups.

11. The method defined in claim 10 wherein depositing the anchoring molecules comprises depositing anchoring molecules having silicon oxide groups that chemically bond with the hydroxyl groups of the chemisorption layer.

12. The method defined in claim 9 wherein depositing the chemisorption layer comprises depositing a layer of silicon oxide having surface hydroxyl groups.

13. An imager, comprising:

a substrate;

an array of pixels on the substrate;

a planar chemisorption layer over the array of pixels, wherein the planar chemisorption layer covers the entire array of pixels;

anchoring molecules that are bonded to the planar chemisorption layer in only localized regions each covering a respective pixel of the array of pixels; and

a photoresist layer that covers the planar chemisorption layer and is formed separately from the planar chemisorption layer, wherein the anchoring molecules are not bonded to the photoresist layer, wherein the photoresist layer has portions that define openings in which no material from the photoresist layer is formed, and wherein the openings define the localized regions.

14. The imager defined in claim 13 wherein the planar chemisorption layer comprises a polymer having active sites that chemically bond with the anchoring molecules.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2014
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034673/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2014
From: VAARTSTRA, BRIAN
To: APTINA IMAGING CORPORATION
Reel/Frame 032991/0344 →