Integrated circuit packaging system with void prevention mechanism and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a mold chase having an air vent;

providing a singulation substrate having an air vent portion, a dielectric layer, and metallic blocks embedded in the dielectric layer;

forming longitudinal grooves in the air vent portion of the singulation substrate, the longitudinal grooves all parallel to each other and oriented parallel to an air flow direction out of the mold chase;

forming transverse grooves in the air vent portion and across the longitudinal grooves, the transverse grooves oriented perpendicular to the longitudinal grooves, the longitudinal grooves and the transverse grooves partially overlapping the metallic blocks;

positioning the air vent portion of the singulation substrate within the air vent of the mold chase;

attaching an integrated circuit die to the singulation substrate; and

flowing a molding compound on the singulation substrate and the integrated circuit die, the molding compound flowing over the air vent portion of the singulation substrate and into a portion of the longitudinal grooves, the molding compound pushing air out of the mold chase in the air flow direction through the longitudinal grooves.

2. The method as claimed in claim 1 wherein forming the longitudinal grooves includes cutting the longitudinal grooves in the dielectric layer and over the metallic blocks.

3. The method as claimed in claim 1 wherein forming the transverse grooves includes cutting the transverse grooves in the dielectric layer and over the metallic blocks.

4. The method as claimed in claim 1 wherein forming the transverse grooves includes cutting the transverse grooves in the dielectric layer and between the metallic blocks.

5. The method as claimed in claim 1 wherein forming the longitudinal grooves includes cutting the longitudinal grooves in the dielectric layer and between the metallic blocks.

6. An integrated circuit packaging system comprising:

a singulation substrate having an air vent portion having longitudinal grooves in the air vent portion, the longitudinal grooves all parallel to each other;

an integrated circuit die attached to the singulation substrate; and

a molding compound on the singulation substrate, on the air vent portion, in a portion of the longitudinal grooves, and on the integrated circuit die;

a mold chase having an air vent, the singulation substrate positioned in the mold chase with the air vent portion in the air vent of the mold chase; and

wherein: the air vent portion of the singulation substrate has transverse grooves across the longitudinal grooves, the transverse grooves oriented perpendicular to the longitudinal grooves;

the longitudinal grooves are oriented parallel to an air flow direction out of the mold chase; and

the singulation substrate includes a dielectric layer and metallic blocks embedded in the dielectric layer and partially overlapping the longitudinal grooves, the transverse grooves.

7. The system as claimed in claim 6 wherein the longitudinal grooves are in the dielectric layer and over the metallic blocks.

8. The system as claimed in claim 6 wherein the transverse grooves are in the dielectric layer and over the metallic blocks.

9. The system as claimed in claim 6 wherein the longitudinal grooves are in the dielectric layer and between the metallic blocks.

10. The system as claimed in claim 6 wherein the transverse grooves are in the dielectric layer and between the metallic blocks.