Magnetic tunnel junction for MRAM applications
View Patent ↗A MTJ in an MRAM array is disclosed with a composite free layer having a lower crystalline layer contacting a tunnel barrier and an upper amorphous NiFeX layer for improved bit switching performance. The crystalline layer is Fe, Ni, or FeB with a thickness of at least 6 Angstroms which affords a high magnetoresistive ratio. The X element in the NiFeX layer is Mg, Hf, Zr, Nb, or Ta with a content of 5 to 30 atomic %. NiFeX thickness is preferably between 20 to 40 Angstroms to substantially reduce bit line switching current and number of shorted bits. In an alternative embodiment, the crystalline layer may be a Fe/NiFe bilayer. Optionally, the amorphous layer may have a NiFeM 1 /NiFeM 2 configuration where M 1 and M 2 are Mg, Hf, Zr, Nb, or Ta, and M1 is unequal to M2. Annealing at 300° C. to 360° C. provides a high magnetoresistive ratio of about 150%.
1. A MTJ element in a magnetic device, comprising:
at least a pinned layer/tunnel barrier layer/free layer configuration wherein the tunnel barrier layer has a first interface with the pinned layer, and the free layer is a stack of three layers with a Fe/NiFe/NiFeX configuration wherein Fe and NiFe are crystalline magnetic layers, the Fe layer interfaces with the tunnel barrier layer, and the NiFeX layer wherein X is one of Hf, Zr, Nb, Ta, or Mg, is amorphous and contacts a surface of the NiFe layer that is opposite to an NiFe interface with the Fe layer.
2. The MTJ element of claim 1 wherein the amorphous NiFeX layer has a composition wherein X has a content between about 5 and 30 atomic %.
3. The MTJ element of claim 1 wherein the Fe layer has a thickness of at least 6 Angstroms.
4. A MTJ element in a magnetic device, comprising:
(a) a synthetic anti-ferromagnetic (SyAF) pinned layer formed on a substrate;
(b) a tunnel barrier layer on the SyAF pinned layer; and
(c) a free layer with a Fe/NiFe/NiFeX configuration on the tunnel barrier layer, comprising:
(1) a Fe/NiFe stack of crystalline magnetic layers wherein the Fe layer contacts a top surface of the tunnel barrier layer; and
(2) an amorphous NiFeX layer contacting a top surface of the NiFe layer wherein X is one of Hf, Zr, Nb, Ta, or Mg.
5. The MTJ element of claim 4 wherein the amorphous NiFeX layer has a thickness between about 20 and 40 Angstroms.
6. The MTJ element of claim 4 wherein the amorphous NiFeX layer has a composition wherein X has a content from about 5 to 30 atomic %.
7. The MTJ element of claim 4 wherein the Fe layer has a thickness of at least 6 Angstroms.