Photodetector and method of forming the photodetector on stacked trench isolation regions
Disclosed are structures and methods of forming the structures so as to have a photodetector isolated from a substrate by stacked trench isolation regions. In one structure, a first trench isolation region is in and at the top surface of a substrate and a second trench isolation region is in the substrate below the first. A photodetector is on the substrate aligned above the first and second trench isolation regions. In another structure, a semiconductor layer is on an insulator layer and laterally surrounded by a first trench isolation region. A second trench isolation region is in and at the top surface of a substrate below the insulator layer and first trench isolation region. A photodetector is on the semiconductor layer and extends laterally onto the first trench isolation region. The stacked trench isolation regions provide sufficient isolation below the photodetector to allow for direct coupling with an off-chip optical fiber.
1. A semiconductor structure comprising:
a semiconductor substrate having a top surface;
a first trench isolation region in said semiconductor substrate at said top surface, said first trench isolation region having a first opening;
a photodetector above said first trench isolation region, the photodetector having at least one layer extending laterally across said first opening so as to have portions immediately adjacent to a top surface of the first trench isolation region on opposite sides of said first opening; and,
a second trench isolation region in said semiconductor substrate aligned below said photodetector and said first opening in said first trench isolation region, said first opening extending vertically between said photodetector and said second trench isolation region, said first opening having an upper portion adjacent to said photodetector and filled with semiconductor material and a lower portion adjacent to said second trench isolation region and filled with isolation material.
2. The semiconductor structure of claim 1 , said photodetector comprising a light-absorbing layer comprising any of a germanium layer and a germanium-tin layer.
3. The semiconductor structure of claim 2 , said photodetector further comprising a buffer layer between said semiconductor substrate and said light-absorbing layer.
4. The semiconductor structure of claim 1 , further comprising:
a dielectric layer on said photodetector and further extending laterally onto said first trench isolation region; and,
a plurality of second openings extending vertically through said dielectric layer and said first trench isolation region to said second trench isolation region, said second openings being positioned adjacent to multiple sides of said photodetector and being filled with said isolation material.
5. The semiconductor structure of claim 1 , said photodetector having a first end and a second end opposite said first end and said semiconductor structure further comprising:
an antireflective spacer positioned laterally adjacent to said first end; and,
an optical fiber on said semiconductor substrate and in end-to-end alignment with said first end of said photodetector, said antireflective spacer being positioned laterally between said optical fiber to said photodetector,
said optical fiber transmitting optical signals to said photodetector, and
said first trench isolation region and said second trench isolation region preventing loss of said optical signals into said semiconductor substrate during said transmitting of said optical signals by said optical fiber.
6. The semiconductor structure of claim 5 , said optical fiber comprising a core and cladding around said core, said photodetector having a height that is any one of less than a diameter of said core and approximately equal to said diameter of said core.
7. A semiconductor structure comprising:
a semiconductor substrate having a top surface;
a first trench isolation region in said semiconductor substrate at said top surface;
a photodetector above said first trench isolation region; and,
a second trench isolation region in said semiconductor substrate aligned below said photodetector and said first trench isolation region,
said first trench isolation region having a first opening that extends vertically between said photodetector and said second trench isolation region, said first opening having an upper portion adjacent to said photodetector and filled with semiconductor material and a lower portion adjacent to said second trench isolation region and filled with isolation material.
8. The semiconductor structure of claim 7 , said photodetector comprising a light-absorbing layer comprising any of a germanium layer and a germanium-tin layer.
9. The semiconductor structure of claim 8 , said photodetector further comprising a buffer layer between said semiconductor substrate and said light-absorbing layer.
10. The semiconductor structure of claim 7 , further comprising:
a dielectric layer on said photodetector and further extending laterally onto said first trench isolation region; and,
a plurality of second openings extending vertically through said dielectric layer and said first trench isolation region to said second trench isolation region, said second openings being positioned adjacent to multiple sides of said photodetector and being filled with said isolation material.
11. The semiconductor structure of claim 7 , said photodetector having a first end and a second end opposite said first end and said semiconductor structure further comprising:
an antireflective spacer positioned laterally adjacent to said first end; and,
an optical fiber on said semiconductor substrate and in end-to-end alignment with said first end of said photodetector, said antireflective spacer being positioned laterally between said optical fiber to said photodetector,
said optical fiber transmitting optical signals to said photodetector, and
said first trench isolation region and said second trench isolation region preventing loss of said optical signals into said semiconductor substrate during said transmitting of said optical signals by said optical fiber.
12. The semiconductor structure of claim 11 , said optical fiber comprising a core and cladding around said core, said photodetector having a height that is any one of less than a diameter of said core and approximately equal to said diameter of said core.
13. A semiconductor structure comprising:
a semiconductor substrate having a top surface;
a first trench isolation region in said semiconductor substrate at said top surface;
a photodetector above said first trench isolation region, said photodetector having a first end and a second end opposite said first end;
a second trench isolation region in said semiconductor substrate aligned below said photodetector and said first trench isolation region;
an antireflective spacer positioned laterally adjacent to said first end; and,
an optical fiber on said semiconductor substrate and in end-to-end alignment with said first end of said photodetector,
said antireflective spacer being positioned laterally between said optical fiber to said photodetector,
said optical fiber transmitting optical signals to said photodetector, and
said first trench isolation region and said second trench isolation region preventing loss of said optical signals into said semiconductor substrate during said transmitting of said optical signals by said optical fiber.
14. The semiconductor structure of claim 13 , said photodetector comprising a light-absorbing layer comprising any of a germanium layer and a germanium-tin layer.
15. The semiconductor structure of claim 14 , said photodetector further comprising a buffer layer between said semiconductor substrate and said light-absorbing layer.
16. The semiconductor structure of claim 13 , said first trench isolation region having a first opening that extends vertically between said photodetector and said second trench isolation region, said first opening being at least partially filled with isolation material.