Methods of inspecting a semiconductor device and semiconductor inspection systems

1. A method of inspecting a semiconductor device, the method comprising:

obtaining inspection image data of an inspection pattern of an inspection layer on a substrate;

extracting inspection contour data including an inspection pattern contour from the inspection image data by an electronic system;

merging the inspection contour data with comparison contour data of a comparison layer to obtain merged data, the comparison layer overlapping the inspection layer; and

determining a horizontal distance between the inspection pattern contour and a comparison pattern contour of the comparison contour data based on the merged data.

2. The method of claim 1 , wherein the comparison layer is not visible during the obtaining operation.

3. The method of claim 1 , wherein the comparison layer is disposed under the inspection layer,

wherein a film is on the comparison layer, and

wherein the inspection pattern of the inspection layer is on the film.

4. The method of claim 3 , further comprising:

obtaining comparison image data of a comparison pattern included in the comparison layer before formation of the inspection layer; and

extracting the comparison contour data from the comparison image data.

5. The method of claim 3 , wherein the comparison contour data is from design layout data of the comparison layer.

6. The method of claim 1 , wherein the comparison layer is an upper layer formed on the inspection layer.

7. The method of claim 6 , wherein the comparison contour data is from design layout data of the comparison layer.

8. The method of claim 1 , further comprising:

comparing the determined horizontal distance with a reference distance.

9. The method of claim 8 , further comprising:

performing a rework process if the determined horizontal distance is outside a tolerance range of the reference distance, wherein the inspection pattern is a photoresist pattern.

10. The method of claim 8 , wherein the inspection pattern includes a plurality of inspection patterns,

wherein the inspection contour data includes a plurality of inspection pattern contours corresponding to the plurality of inspection patterns, respectively,

wherein the comparison contour data includes a plurality of comparison pattern contours corresponding to the plurality of inspection pattern contours, respectively,

wherein the determining a horizontal distance determines a horizontal distance between each of the inspection pattern contours and each of the comparison pattern contours corresponding to the inspection pattern contours, and

wherein the comparing the determined horizontal distance with the reference distance compares the determined horizontal distances with reference distances corresponding to the determined horizontal distances, respectively.

11. The method of claim 10 , further comprising:

identifying a hotspot of the inspection patterns by comparing the determined horizontal distances with the reference distances.

12. The method of claim 1 , wherein the inspection contour data is in a geometric database standard (GDS) format.

13. A semiconductor inspection system comprising:

an image detection apparatus configured to obtain inspection image data of an inspection pattern of an inspection layer formed on a substrate; and

an electronic system including a controller, the controller being configured to,

extract inspection contour data including an inspection pattern contour from the inspection image data,

merge the inspection contour data with comparison contour data of a comparison layer, and

determine a horizontal distance between the inspection pattern contour and a comparison pattern contour of the comparison contour data based on the merged data,

wherein the comparison layer overlaps with the inspection layer.

14. The semiconductor inspection system of claim 13 , wherein the electronic system further comprises:

a memory device configured to store the obtained inspection image data, the extracted inspection contour data, the merged data, the comparison contour data, and the determined horizontal distance.

15. The semiconductor inspection system of claim 13 , wherein the image detection apparatus is one of a nano geometry research (NGR) apparatus and a scanning electron microscope (SEM) apparatus.

16. A method of inspecting a semiconductor device, the method comprising:

receiving image data of a first pattern on a substrate;

extracting at least one first contour of the first pattern from the image data;

merging the at least one first contour with at least one second contour of a second pattern, the second pattern and the first pattern being at different vertical levels within the semiconductor device; and

determining at least one lateral distance between the at least one first contour and the at least one second contour based on the merging.

17. The method of claim 16 , wherein the at least one second contour corresponds to at least one active region in the substrate, and the at least one determined lateral distance is a lateral distance between the at least one first contour and the at least one active region.

18. The method of claim 16 , wherein the at least one second contour corresponds to at least one contact hole of the semiconductor device, and the at least one determined lateral distance is a lateral distance between the at least one first contour and the at least one contact hole.

19. The method of claim 16 , further comprising:

comparing the at least one determined lateral distance to at least one reference distance; and

performing additional processing on the semiconductor device based on the comparing.

20. The method of claim 16 , further comprising:

extracting the second contour from one of image data of the second pattern and a design layout of the semiconductor device.