METHOD OF CONTROLLING A THERMAL BUDGET OF AN INTEGRATED CIRCUIT DEVICE, AN INTEGRATED CIRCUIT, A THERMAL CONTROL MODULE AND AN ELECTRONIC DEVICE THEREFOR
A method of controlling a thermal budget of an integrated circuit device is described. The method comprises obtaining a first junction temperature measurement value for the integrated circuit device at a first time instant, and a further junction temperature measurement value for the integrated circuit device at a further time instant. The method further comprises calculating a prospective junction temperature value for the integrated circuit device at a future time instant based at least partly on the first and further junction temperature measurement values; and configuring an operating condition of the integrated circuit device based at least partly on the calculated prospective junction temperature value.
1 . A method of controlling a thermal budget of an integrated circuit device; the method comprising:
obtaining a first junction temperature measurement value for the integrated circuit device at a first time instant;
obtaining at least one further junction temperature measurement value for the integrated circuit device at an at least one further time instant;
calculating a prospective junction temperature value for the integrated circuit device at a future time instant based at least partly on the first junction temperature measurement value and the at least one further junction temperature measurement value; and
configuring at least one operating condition of the integrated circuit device based at least partly on the calculated prospective junction temperature value.
2 . The method of claim 1 , wherein the first time instant and the at least one further time instant are spaced a constant, pre-defined interval apart.
3 . The method of claim 2 , wherein an interval between the at least one further time instant and the future time instant is substantially equal to the constant pre-defined interval that the first time instant and the at least one further time instant are apart.
4 . The method of claim 1 , wherein the method comprises performing a steady state calculation for the calculated prospective junction temperature value.
5 . The method of claim 1 , wherein the method further comprises:
comparing the calculated prospective junction temperature value with a threshold temperature value; and
if the prospective junction temperature value exceeds the threshold temperature value, configuring the at least one operating condition for the integrated circuit device to reduce a thermal budget therefor.
6 . The method of claim 5 , wherein the method further comprises:
determining a configuration for the at least one operating condition of the integrated circuit device required for a junction temperature of the integrated circuit device to be below the threshold temperature at the future time instant; and
configuring the at least one operating condition accordingly, if the prospective junction temperature value exceeds the threshold temperature value.
7 . The method of claim 6 , wherein the method further comprises determining an optimal configuration for the at least one operating condition of the integrated circuit device required to increase performance of the integrated circuit device while remaining within a maximum thermal budget.
8 . The method of claim 1 , wherein the at least one operating condition comprises at least one from a group of:
an operating frequency of the integrated circuit device;
power gating configuration;
clock gating configuration; and
a power supply voltage level of the integrated circuit device.
9 . An integrated circuit device comprising:
a temperature sensor;
at least one thermal control module comprising
an input, coupled to the temperature sensor, and configured to receive:
a first junction temperature measurement value for the integrated circuit device at a first time instant and
at least one further junction temperature measurement value for the integrated circuit device at at least one further time instant, wherein the at least one thermal control module is configured to
calculate a prospective junction temperature value for the integrated circuit device at a future time instant based at least partly on the first and at least one further junction temperature measurement values, and
a control output for configuring at least one operating condition of the integrated circuit device based at least partly on the calculated prospective junction temperature value.
10 . A thermal control module comprising an input connectable to a temperature sensor for receiving:
a first junction temperature measurement value for the integrated circuit device at a first time instant; and
at least one further junction temperature measurement value for the integrated circuit device at at least one further time instant;
the at least one thermal control module being arranged to calculate a prospective junction temperature value for the integrated circuit device at a future time instant based at least partly on the first and at least one further junction temperature measurement values; and further comprising a control output for configuring at least one operating condition of the integrated circuit device based at least partly on the calculated prospective junction temperature value.
11 . An electronic device comprising an integrated circuit device according to claim 9 .
12 - 13 . (canceled)