Power supply system, plasma etching apparatus, and plasma etching method
A power supply system 90 includes high frequency power supplies 92 and 93 that supply a high frequency power for plasma generation; a DC power supply 91 that supplies a DC voltage to be applied to an electrode; and control unit 94 that controls the high frequency power supplies 92 and 93 and the DC power supply 91 including a first DC power supply unit 101 that supplies a first negative DC voltage V 1 , a second DC power supply unit 102 that supplies a second negative DC voltage V 2 having a higher absolute value than the first negative DC voltage V 1 , and a selecting circuit 103 that selectively connects the first DC power supply unit 101 and the second DC power supply unit 102 to the electrode; and a discharging circuit 104 connected with a node 109 between the first DC power supply unit 101 and the selecting circuit 103.
1. A power supply system in a plasma etching apparatus in which a lower electrode included in a mounting table that mounts a target substrate thereon and an upper electrode facing the lower electrode are provided within a processing chamber, the power supply system comprising:
a high frequency power supply which is electrically connected with the lower electrode and configured to generate a high frequency power for plasma generation;
a DC power supply, configured to apply an output voltage as a negative DC voltage to the upper electrode, having a first DC power supply unit configured to supply a first negative DC voltage, a second DC power supply unit configured to supply a second negative DC voltage having a higher absolute value than that of the first negative DC voltage, and a selecting circuit configured to selectively connect the first DC power supply unit and the second DC power supply unit to the upper electrode; and
a control unit configured to control the high frequency power supply and the DC power supply,
wherein the control unit is configured to alternately repeat an output of the high frequency power and a stop of the output thereof at a certain frequency by outputting a first control signal to the high frequency power supply,
the control unit is configured to connect the first DC power supply unit to the upper electrode during a period where the high frequency power is outputted and connect the second DC power supply unit to the upper electrode during a period where the output of the high frequency power is stopped by outputting a second control signal to the DC power supply,
the DC power supply further includes a discharging circuit connected with a node between the first DC power supply unit and the selecting circuit, and a switch circuit provided between the discharging circuit and the node,
the control unit is configured to control the switch circuit such that the switch circuit is closed when alternation between the first DC power supply unit being connected with the upper electrode and the second DC power supply unit being connected with the upper electrode occurs, and the switch circuit is opened when only one of the first DC power supply unit and the second DC power supply unit is continuously connected with the upper electrode, and
the discharging circuit is configured to discharge electric charges accumulated in the processing chamber to a ground potential when the DC power supply unit connected with the upper electrode is switched from the second DC power supply unit to the first DC power supply unit.
2. The power supply system of claim 1 ,
wherein the discharging circuit includes a resistance element.
3. The power supply system of claim 2 ,
wherein the discharging circuit serves as a current limiting circuit configured to limit a value of a current flowing through the resistance element.
4. The power supply system of claim 1 ,
wherein the first control signal is a pulse signal configured to switch between the output of the high frequency power and the stop of the output thereof, and the second control signal is a pulse signal configured to switch the DC power supply unit connected with the upper electrode between the first DC power supply unit and the second DC power supply unit, and
the control unit is configured to control frequencies and duty ratios of the first control signal and the second control signal and configured to control a phase difference between the first control signal and the second control signal.
5. The power supply system of claim 1 ,
wherein the control unit is configured to monitor the first control signal and the second control signal outputted from the control unit, and the control unit is configured to stop the outputs of the first control signal and the second control signal when the first control signal and the second control signal contain preset abnormalities.
6. The power supply system of claim 1 ,
wherein the DC power supply is configured to monitor the inputted second control signal, and the DC power supply stops the output of the output voltage when the second control signal contains a preset abnormality.
7. The power supply system of claim 1 ,
wherein the second control signal is a pulse signal configured to switch the DC power supply unit connected with the upper electrode between the first DC power supply unit and the second DC power supply unit, and
the DC power supply compares the output voltage from the DC power supply with the inputted second control signal, and the DC power supply stops the output of the output voltage when there is a difference equal to or higher than a preset value between a frequency of the output voltage and a frequency of the second control signal or when there is a difference equal to or higher than a preset value between a duty ratio of the output voltage and a duty ratio of the second control signal.
8. The power supply system of claim 1 ,
wherein the high frequency power supply monitors the inputted first control signal, and the high frequency power supply stops the output of the high frequency power when the first control signal contains a preset abnormality.
9. The power supply system of claim 8 ,
wherein the high frequency power supply monitors the high frequency power from the high frequency power supply during a period set between a preset period from when the output of the high frequency power is started and a preset period from the timing before the output of the high frequency power is stopped and to the timing when the output of the high frequency power is stopped in the period where the high frequency power is outputted, and the high frequency power supply controls the output of the high frequency power based on the monitored high frequency power.
10. The power supply system of claim 1 ,
wherein the first control signal is a pulse signal configured to switch between the output of the high frequency power and the stop of the output thereof, and
the high frequency power supply compares the high frequency power from the high frequency power supply with the inputted first control signal, and the high frequency power supply stops the output of the high frequency power when there is a difference equal to or higher than a preset value between a frequency of the high frequency power and a frequency of the first control signal or when there is a difference equal to or higher than a preset value between a duty ratio of the high frequency power and a duty ratio of the first control signal.
11. A plasma etching apparatus comprising:
a processing chamber;
a gas supply unit configured to supply a processing gas into the processing chamber;
a mounting table, configured to mount a target substrate thereon, having a lower electrode;
an upper electrode which is provided within the processing chamber to face the lower electrode; and
a power supply system claimed in claim 1 .