Compositions and methods for making silicon containing films
Described herein are low temperature processed high quality silicon containing films. Also disclosed are methods of forming silicon containing films at low temperatures. In one aspect, there are provided silicon-containing film having a thickness of about 2 nm to about 200 nm and a density of about 2.2 g/cm 3 or greater wherein the silicon-containing thin film is deposited by a deposition process selected from a group consisting of chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), cyclic chemical vapor deposition (CCVD), plasma enhanced cyclic chemical vapor deposition (PECCVD, atomic layer deposition (ALD), and plasma enhanced atomic layer deposition (PEALD), and the vapor deposition is conducted at one or more temperatures ranging from about 25° C. to about 400° C. using an alkylsilane precursor selected from the group consisting of diethylsilane, triethylsilane, and combinations thereof.
1. A method for depositing a silicon-containing film on at least one surface of a device comprising a metal oxide, the method comprising:
providing the at least one surface of the device in a reaction chamber;
introducing an alkylsilane precursor selected from the group consisting of diethylsilane and triethylsilane into the reaction chamber;
introducing into the reaction chamber an oxygen source; and
depositing by a PECVD deposition process the silicon containing film on the at least one surface of the device at one or more reaction temperatures ranging from 25° C. to 150° C. wherein the silicon containing film comprises a thickness ranging from about 2 nanometers to about 200 nanometers and a density of about 2.25 g/cm 3 or greater,
wherein the metal oxide comprises at least one member selected from the group consisting of indium gallium zinc oxide, indium tin oxide, aluminum indium oxide, zinc tin oxide, zinc oxynitride, magnesium zinc oxide, zinc oxide, lnGaZnON, ZnON, ZnSnO, CdSnO, GaSnO, TiSnO, CuAlO, SrCuO, and LaCuOS,
wherein the silicon-containing film has a hydrogen content of about 5 atomic % or less, and
wherein the silicon-containing film has a O/Si ratio that ranges from about 1.9 to about 2.1.
2. The method of claim 1 wherein the device further comprises a gate electrode.
3. The method of claim 1 wherein the alkylsilane precursor comprises diethylsilane.
4. The method of claim 1 wherein the oxygen source is selected from the group consisting of water (H 2 O), oxygen (O 2 ), oxygen plasma, ozone (O 3 ), NO, N 2 O, carbon monoxide (CO), carbon dioxide (CO 2 ) and combinations thereof.
5. The method of claim 1 , wherein the deposition process is plasma enhanced chemical vapor deposition (PECVD) with dual RF frequency sources.
6. The method of claim 1 , wherein the alkylsilane precursor comprises triethylsilane.
7. The method of claim 1 wherein the silicon-containing film having a leakage current less than 10 −7 A/cm 2 below electric field 6 MV/cm and the breakdown voltage is higher than 7 MV/cm.
8. A method for depositing a silicon containing film on at least one surface in a thin film transistor device, comprising:
providing the at least one surface of the thin film transistor in a reaction chamber;
introducing an alkylsilane precursor selected from the group consisting of diethylsilane and triethylsilane into the reaction chamber;
introducing into the reaction chamber an oxygen source; and
depositing via a PECVD deposition process the silicon containing film on the at least one surface of the thin film transistor device at one or more reaction temperatures ranging from 25° C. to 150° C. wherein the silicon containing film comprises a thickness ranging from about 2 nanometers to about 200 nanometers and a density of about 2.2 g/cm 3 or greater, and
wherein the silicon-containing film having a leakage current less than 10 −7 A/cm 2 below electric field 6 MV/cm and the breakdown voltage is higher than 7 MV/cm.
9. The method of claim 8 , wherein the alkylsilane precursor comprises diethylsilane.
10. The method of claim 8 , wherein the oxygen source is selected from the group consisting of water (H 2 O), oxygen (O 2 ), oxygen plasma, ozone (O 3 ), NO, N 2 O, carbon monoxide (CO), carbon dioxide (CO 2 ) and combinations thereof.
11. The method of claim 8 , wherein the deposition process comprises plasma enhanced chemical vapor deposition (PECVD) with dual RF frequency sources.
12. The method of claim 8 , wherein the silicon containing layer is a gate insulation layer in a thin film transistor device.
13. The method of claim 8 wherein the silicon-containing film has a O/Si ratio which ranges from about 1.9 to about 2.1.