IP Library Granted Patent US 10,551,580
Granted Patent B2
US 10,551,580 · App. 14/392,284 · Granted Feb 4, 2020

Connector system with air flow

Inventors: Kent E. Regnier (Lombard, IL); Jerry D. Kachlic (Shanghai, CN)
Assignee: Molex, LLC
G02B6/4269G02B6/3885G02B6/3897G02B6/428
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Quick Facts
Patent No.
US 10,551,580
App. No.
14/392,284
Granted
Feb 4, 2020
Kind
B2
Abstract

A receptacle includes a cooling channel that is positioned between a top port and a bottom port. A transfer member is positioned in the cooling channel and is configured to direct heat from an inserted plug module into the cooling channel. Air flowing through the cooling channel acts to remove thermal energy from the receptacle. A connector system may include a plug module that can be inserted into such a receptacle and the plug module can include grooves to help allow for direct cooling of the plug module, even when inserted into the receptacle.

Claims (18)

1. A receptacle, comprising:

a wafer set defining a first mating interface and a second mating interface, the wafer set supporting a plurality of terminals, the terminals having tails for mounting to a circuit board and contacts configured to engage a mating connector, the contacts extending to a first mating interface and a second mating interface;

a cage having a front face and a rear face, the cage defining a top port and a bottom port, the top port aligned with the first mating interface and the bottom port aligned with the second mating interface, the cage further including a cooling channel positioned between the top and bottom port, the cooling channel having a wall adjacent the top port, the cage having at least one of a rear grill on the rear face or a side grill and having a front grill on the front face;

a thermal coupling plate provided proximate the bottom port, the thermal coupling plate thermally coupled to a transfer member positioned in the cooling channel, wherein the front grill is in communication with the at least one rear grill or side grill via the cooling channel and the thermal coupling plate is configured to conduct thermal energy from an inserted plug module to the transfer member, wherein the transfer member is a plurality of fins; and

a biasing element positioned between the cooling channel wall adjacent the top port and the transfer member, the biasing element configured to urge the transfer member toward the bottom port.

2. The receptacle of claim 1 , further comprising a housing supporting the wafer set and a communication channel provided on a side of the housing, the communication channel allowing the rear grill to be in communication with the cooling channel.

3. The receptacle of claim 1 , wherein the thermal coupling plate includes a plurality of spring fingers configured to mate with a top surface of a mating plug connector.

4. The receptacle of claim 1 , wherein the thermal coupling plate is configured to press against a top surface of a mating plug connector.

5. The receptacle of claim 1 , wherein the biasing element comprises a plurality of spring fingers.

6. The receptacle of claim 5 , wherein the biasing element is part of a mounting bracket configured to urge the thermal coupling plate into the bottom port.

7. A plug module, comprising:

a body having a main portion and a mating portion, the mating portion having a first flange extending toward a distal end, a second flange extending toward the distal end and a plurality of channels provided on a top surface of the mating portion;

a plurality of contacts positioned near the distal end of the mating portion and supported by a substrate having a top surface and a bottom surface, the contacts being arranged so as to be at least partially shielded by the first flange, the first flange being positioned above the top surface of the substrate and the second flange being positioned below the bottom surface of the substrate with a surface facing the bottom surface of the substrate, the first flange having a surface facing the top surface of the substrate that has a greater surface area than the surface of the second flange facing the bottom surface of the substrate;

a latch provided on a side of the mating portion; and

an actuator supported by the main portion, the actuator configured to actuate the latch.

8. The plug module of claim 7 , wherein the substrate is a circuit board.

9. The plug module of claim 7 , wherein the main portion is larger than the mating portion.

10. The plug module of claim 7 , wherein at least one optical fiber is connected to the body.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2017
From: REGNIER, KENT E.
To: MOLEX INCORPORATED
Reel/Frame 042782/0605 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2017
From: KACHLIC, JERRY D.
To: MOLEX, LLC
Reel/Frame 042782/0632 →
CHANGE OF NAME Recorded Jun 22, 2017
From: MOLEX INCORPORATED
To: MOLEX, LLC
Reel/Frame 042942/0020 →
Continuity (3)
Provisional Application 62096054 · Dec 23, 2014
Provisional Application 62206598 · Aug 18, 2015
Related Publication 20170285282A1 · Oct 5, 2017
Cited By (12)
US 1,119,817 US 1,131,415 US 1,131,416 US 12,212,100 US 12,272,917 US 12,362,505 US 12,362,514 US 12,374,814 US 12,451,627 US 12,567,687 US 12,625,332 US 12,700,687