IP Library › Granted Patent US 12,451,627
Granted Patent B2
US 12,451,627 · App. 18/137,984 · Granted Oct 21, 2025

High frequency midboard connector

Inventor: Arkady Y. Zerebilov (Lancaster, PA)
Assignee: FCI USA LLC
H01R12/53H01R12/716H01R13/502H01R13/6581H01R13/6592
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Quick Facts
Patent No.
US 12,451,627
App. No.
18/137,984
Granted
Oct 21, 2025
Kind
B2
Abstract

A midboard cable connector assembly with a board connector and a cable connector. The board connector has terminals precisely positioned with respect to engagement features. A cable connector likewise has terminals precisely positioned with respect to complementary engagement features. When the connectors are pressed together for mating, the terminals of one or both connectors deform, generating a force that separates the connectors until the engagement features engage and block further backward motion. As the mating position is defined by the locations of the engagement features, the connectors can be designed with low over travel and a resulting short stub length, which promotes high frequency performance. High frequency performance is further promoted by a ground conductor interconnecting the beams forming mating contact portions of ground terminals, reducing the length of unconnected segments and by a cable clamp plate with complaint compression features that reduce distortion of the cables.

Claims (42)

1. A method of constructing a connector, comprising:

stamping a terminal assembly, wherein the terminal assembly comprises:

a base extending in a first plane,

a plurality of connected terminals having a first portion parallel to the first plane, and a second portion disposed at an angle relative to the first plane,

a first wing including first projection receptacle, and

a second wing including a second projection receptacle;

overmolding portions of the plurality of connected terminals with a dielectric material; and

severing connected terminals of the plurality of connected terminals from one another.

2. The method of claim 1 , wherein overmolding portions of the plurality of connected terminals with the dielectric material further comprises overmolding portions of the base.

3. The method of claim 1 , wherein the first wing of the stamped terminal assembly comprises a first slot, and the second wing of the stamped terminal assembly comprises a second slot.

4. The method of claim 1 , wherein stamping the terminal assembly comprises spacing the first projection receptacle and the second projection receptacle a predetermined distance from each of the plurality of connected terminals with a tolerance within 0.25 mm.

5. The method of claim 1 , wherein stamping the terminal assembly comprises stamping the first wing with the first projection receptacle and the second wing with the second projection receptacle and the plurality of connected terminals from a unitary meal sheet in the same stamping operation.

6. The method of claim 1 , wherein overmolding portions of the plurality of connected terminals comprises forming an alignment post configured for insertion into a circuit board.

7. The method of claim 1 , wherein the first projection receptacle and the second projection receptacle of the stamped terminal assembly are circular.

8. The method of claim 1 , wherein each of the second portions of the plurality of connected terminals is angled at an angle between 15 and 45 degrees relative to the first plane.

9. A method of constructing a connector, comprising:

stamping a terminal assembly, wherein the terminal assembly comprises:

a cable clamp plate, and

a plurality of terminals extending from the cable clamp plate;

overmolding portions of the plurality of terminals with a dielectric material; and

for a first portion of the plurality of terminals, severing a connection between the terminal and each of the other of the plurality of terminals.

10. The method of claim 9 , wherein, prior to the severing, the plurality of terminals are electrically connected through the cable clamp plate, and wherein severing the connection, for each of the first portion of the plurality of terminals, comprises physically severing terminals of the first portion from the cable clamp plate such that a second portion of the plurality of terminals remain electrically connected through the cable clamp plate.

11. The method of claim 9 , further comprising connecting a plurality of cables to the cable clamp plate.

12. The method of claim 11 , wherein connecting the plurality of cables comprises compressing the plurality of cables against the cable clamp plate with a metal shield.

13. The method of claim 12 , wherein connecting the plurality of cables further comprises welding the metal shield to the cable clamp plate.

14. The method of claim 13 , wherein connecting the plurality of cables further comprises overmolding the metal shield, cable clamp plate and a portion of the plurality of cables.

15. The method of claim 12 , wherein compressing the plurality of cables against the cable clamp plate comprises deforming one or more strain relief portions of the cable clamp plate.

16. The method of claim 15 , wherein the one or more strain relief portions comprise an I-shaped opening in the cable clamp plate.

17. The method of claim 11 , wherein:

the plurality of terminals comprise beams extending from the dielectric material; and

the method further comprises welding an elongated conductor to the beams of a second portion of the plurality of terminals.

18. The method of claim 17 , wherein the first portion of the plurality of terminals is disjointed from the second portion of the plurality of terminals.

19. The method of claim 11 , further comprising inserting the terminal assembly, overmolded dielectric, and secured cables into a connector housing.

20. The method of claim 19 , wherein the connector housing is formed of a dielectric material.

21. The method of claim 19 , wherein the connector housing has a bottom face disposed in a first plane, and wherein the terminal assembly is inclined relative to the first plane.

22. The method of claim 21 , wherein the terminal assembly is inclined at an angle between approximately 30 and 45 degrees relative to the first plane.

23. The method of claim 19 , further comprising securing the terminal assembly in the connector housing by inserting a tab of the cable clamp plate into a tab receptacle of the connector housing.

24. The method of claim 19 , wherein the connector housing comprises at least two guides disposed on opposite sides of the connector housing.

25. The method of claim 24 , wherein the at least two guides extend in a direction parallel to the plurality of terminals.

26. The method of claim 19 , wherein the connector housing comprises at least two projections configured to engage a connector receptacle.

27. The method of claim 26 , wherein each of the at least two projections comprises a lead-in configured to engage the connector receptacle first when the connector housing is moved into the connector receptacle.

28. The method of claim 9 , further comprising laser welding a ground conductor to a second portion of the plurality of terminals, separate from the first portion of the plurality of terminals.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2023
From: ZEREBILOV, ARKADY Y.
To: FCI USA LLC
Reel/Frame 065980/0420 →
Continuity (3)
Continuation 17160229 · Jan 27, 2021
Provisional Application 62966892 · Jan 28, 2020
Related Publication 20230253722A1 · Aug 10, 2023
References Cited (400)
US 5060372A · Capp · 1991 [cited by examiner]
US 5722861A · Wetter · 1998 [cited by examiner]
US 5848920A · Klein · 1998 [cited by examiner]
US 6453552B1 · Chavez, Jr · 2002 [cited by examiner]
US 6764336B2 · Ma · 2004 [cited by examiner]
US 7112072B2 · Korsunsky · 2006 [cited by examiner]
US 7422483B2 · Avery et al. · 2008 [cited by applicant]
US 7431608B2 · Sakaguchi et al. · 2008 [cited by applicant]
US 7445471B1 · Scherer et al. · 2008 [cited by applicant]
US 7448897B2 · Dawiedczyk et al. · 2008 [cited by applicant]
US 7462942B2 · Tan et al. · 2008 [cited by applicant]
US 7485012B2 · Daugherty et al. · 2009 [cited by applicant]
US 7494383B2 · Cohen et al. · 2009 [cited by applicant]
US 7497693B1 · Wu · 2009 [cited by applicant]
US 7534142B2 · Avery et al. · 2009 [cited by applicant]
US 7540747B2 · Ice et al. · 2009 [cited by applicant]
US 7540781B2 · Kenny et al. · 2009 [cited by applicant]
US 7549897B2 · Fedder et al. · 2009 [cited by applicant]
US 7553190B2 · Laurx · 2009 [cited by examiner]
US 7575471B2 · Long · 2009 [cited by applicant]
US 7581990B2 · Kirk et al. · 2009 [cited by applicant]
US 7585188B2 · Regnier · 2009 [cited by applicant]
US 7588464B2 · Kim · 2009 [cited by applicant]
US 7613011B2 · Grundy et al. · 2009 [cited by applicant]
US 7621779B2 · Laurx et al. · 2009 [cited by applicant]
US 7628617B2 · Brown et al. · 2009 [cited by applicant]
US 7649368B2 · Eldridge et al. · 2010 [cited by applicant]
US 7652381B2 · Grundy et al. · 2010 [cited by applicant]
US 7654831B1 · Wu · 2010 [cited by applicant]
US 7658654B2 · Ohyama et al. · 2010 [cited by applicant]
US 7682207B2 · Clark · 2010 [cited by examiner]
US 7686659B2 · Peng · 2010 [cited by applicant]
US 7690930B2 · Chen et al. · 2010 [cited by applicant]
US 7713077B1 · McGowan et al. · 2010 [cited by applicant]
US 7719843B2 · Dunham · 2010 [cited by applicant]
US 7722398B2 · Ma · 2010 [cited by applicant]
US 7722401B2 · Kirk et al. · 2010 [cited by applicant]
US 7722404B2 · Neumetzler · 2010 [cited by applicant]
US 7731537B2 · Amleshi et al. · 2010 [cited by applicant]
US 7744414B2 · Scherer et al. · 2010 [cited by applicant]
US 7753731B2 · Cohen et al. · 2010 [cited by applicant]
US 7764504B2 · Phillips et al. · 2010 [cited by applicant]
US 7766668B1 · Bishop · 2010 [cited by applicant]
US 7771233B2 · Gailus · 2010 [cited by applicant]
US 7775802B2 · Defibaugh et al. · 2010 [cited by applicant]
US 7781294B2 · Mauder et al. · 2010 [cited by applicant]
US 7789676B2 · Morgan et al. · 2010 [cited by applicant]
US 7794240B2 · Cohen et al. · 2010 [cited by applicant]
US 7794278B2 · Cohen et al. · 2010 [cited by applicant]
US 7806698B2 · Regnier · 2010 [cited by applicant]
US 7811129B2 · Glover et al. · 2010 [cited by applicant]
US 7819675B2 · Ko et al. · 2010 [cited by applicant]
US 7824197B1 · Westman et al. · 2010 [cited by applicant]
US 7828560B2 · Wu et al. · 2010 [cited by applicant]
US 7857630B2 · Hermant et al. · 2010 [cited by applicant]
US 7862344B2 · Morgan et al. · 2011 [cited by applicant]
US 7871294B2 · Long · 2011 [cited by applicant]
US 7871296B2 · Fowler et al. · 2011 [cited by applicant]
US 7874873B2 · Do et al. · 2011 [cited by applicant]
US 7887371B2 · Kenny et al. · 2011 [cited by applicant]
US 7906730B2 · Atkinson et al. · 2011 [cited by applicant]
US 7914302B1 · Zhu · 2011 [cited by applicant]
US 7914304B2 · Cartier et al. · 2011 [cited by applicant]
US 7976318B2 · Fedder et al. · 2011 [cited by applicant]
US 7985097B2 · Gulla · 2011 [cited by applicant]
US 7993147B2 · Cole et al. · 2011 [cited by applicant]
US 8002581B1 · Whiteman, Jr. et al. · 2011 [cited by applicant]
US 8016616B2 · Glover et al. · 2011 [cited by applicant]
US 8018733B2 · Jia · 2011 [cited by applicant]
US 8036500B2 · McColloch · 2011 [cited by applicant]
US 8057266B1 · Roitberg · 2011 [cited by applicant]
US 8057267B2 · Johnescu · 2011 [cited by applicant]
US 8083553B2 · Manter et al. · 2011 [cited by applicant]
US 8092235B2 · Frantum, Jr. et al. · 2012 [cited by applicant]
US 8092254B2 · Miyazaki et al. · 2012 [cited by applicant]
US 8100699B1 · Costello · 2012 [cited by applicant]
US 8157573B2 · Tanaka · 2012 [cited by applicant]
US 8162675B2 · Regnier et al. · 2012 [cited by applicant]
US RE43427E · Dawiedczyk et al. · 2012 [cited by applicant]
US 8167651B2 · Glover et al. · 2012 [cited by applicant]
US 8182289B2 · Stokoe et al. · 2012 [cited by applicant]
US 8192222B2 · Kameyama · 2012 [cited by applicant]
US 8195017B2 · Kaneshiro et al. · 2012 [cited by applicant]
US 8197285B2 · Farmer · 2012 [cited by applicant]
US 8210877B2 · Droesbeke · 2012 [cited by applicant]
US 8215968B2 · Cartier et al. · 2012 [cited by applicant]
US 8226441B2 · Regnier et al. · 2012 [cited by applicant]
US 8251745B2 · Johnescu · 2012 [cited by applicant]
US 8272877B2 · Stokoe et al. · 2012 [cited by applicant]
US 8282402B2 · Ngo · 2012 [cited by applicant]
US 8292669B2 · Wang · 2012 [cited by applicant]
US 8308491B2 · Nichols et al. · 2012 [cited by applicant]
US 8308512B2 · Ritter et al. · 2012 [cited by applicant]
US 8337243B2 · Elkhatib et al. · 2012 [cited by applicant]
US 8338713B2 · Fjelstad et al. · 2012 [cited by applicant]
US 8358504B2 · McColloch et al. · 2013 [cited by applicant]
US 8371875B2 · Gailus · 2013 [cited by applicant]
US 8371876B2 · Davis · 2013 [cited by applicant]
US 8382524B2 · Khilchenko et al. · 2013 [cited by applicant]
US 8398433B1 · Yang · 2013 [cited by applicant]
US 8419472B1 · Swanger et al. · 2013 [cited by applicant]
US 8439704B2 · Reed · 2013 [cited by applicant]
US 8449312B2 · Lang et al. · 2013 [cited by applicant]
US 8449330B1 · Schroll et al. · 2013 [cited by applicant]
US 8465302B2 · Regnier et al. · 2013 [cited by applicant]
US 8465320B2 · Long · 2013 [cited by applicant]
US 8469738B2 · Long · 2013 [cited by applicant]
US 8469745B2 · Davis et al. · 2013 [cited by applicant]
US 8475210B2 · Wang · 2013 [cited by applicant]
US 8535065B2 · Costello · 2013 [cited by applicant]
US 8540525B2 · Regnier et al. · 2013 [cited by applicant]
US 8545240B2 · Casher et al. · 2013 [cited by applicant]
US 8550861B2 · Cohen et al. · 2013 [cited by applicant]
US 8553102B2 · Yamada · 2013 [cited by applicant]
US 8556657B1 · Nichols · 2013 [cited by applicant]
US 8588561B2 · Zbinden et al. · 2013 [cited by applicant]
US 8588562B2 · Zbinden et al. · 2013 [cited by applicant]
US 8597045B2 · Zhu · 2013 [cited by applicant]
US 8597055B2 · Regnier et al. · 2013 [cited by applicant]
US 8597056B2 · Blanchfield · 2013 [cited by applicant]
US 8632365B2 · Ngo · 2014 [cited by applicant]
US 8647141B2 · Lee et al. · 2014 [cited by applicant]
US 8651880B2 · Wu et al. · 2014 [cited by applicant]
US 8657627B2 · McNamara et al. · 2014 [cited by applicant]
US 8662923B2 · Wu · 2014 [cited by applicant]
US 8672707B2 · Nichols et al. · 2014 [cited by applicant]
US 8678860B2 · Minich et al. · 2014 [cited by applicant]
US 8690589B2 · Ngo · 2014 [cited by applicant]
US 8690604B2 · Davis · 2014 [cited by applicant]
US 8715003B2 · Buck et al. · 2014 [cited by applicant]
US 8740644B2 · Long · 2014 [cited by applicant]
US 8753145B2 · Lang et al. · 2014 [cited by applicant]
US 8758051B2 · Nonen et al. · 2014 [cited by applicant]
US 8764460B2 · Smink et al. · 2014 [cited by applicant]
US 8764464B2 · Buck et al. · 2014 [cited by applicant]
US 8771016B2 · Atkinson et al. · 2014 [cited by applicant]
US 8780581B2 · Merz et al. · 2014 [cited by applicant]
US 8787711B2 · Zbinden et al. · 2014 [cited by applicant]
US 8804342B2 · Behziz et al. · 2014 [cited by applicant]
US 8814595B2 · Cohen et al. · 2014 [cited by applicant]
US 8830679B2 · Scholeno · 2014 [cited by applicant]
US 8845364B2 · Wanha et al. · 2014 [cited by applicant]
US 8858243B2 · Luo et al. · 2014 [cited by applicant]
US 8860454B2 · Oniyama et al. · 2014 [cited by applicant]
US 8864521B2 · Atkinson et al. · 2014 [cited by applicant]
US 8870471B2 · Ito et al. · 2014 [cited by applicant]
US 8888531B2 · Jeon · 2014 [cited by applicant]
US 8888533B2 · Westman et al. · 2014 [cited by applicant]
US 8905767B2 · Putt, Jr. et al. · 2014 [cited by applicant]
US 8911255B2 · Scherer et al. · 2014 [cited by applicant]
US 8926377B2 · Kirk et al. · 2015 [cited by applicant]
US 8944831B2 · Stoner et al. · 2015 [cited by applicant]
US 8992236B2 · Wittig et al. · 2015 [cited by applicant]
US 8992237B2 · Regnier et al. · 2015 [cited by applicant]
US 8998642B2 · Manter et al. · 2015 [cited by applicant]
US 9004942B2 · Paniauqa · 2015 [cited by applicant]
US 9011177B2 · Lloyd et al. · 2015 [cited by applicant]
US 9022806B2 · Cartier, Jr. et al. · 2015 [cited by applicant]
US 9028201B2 · Kirk et al. · 2015 [cited by applicant]
US 9028281B2 · Kirk et al. · 2015 [cited by applicant]
US 9035183B2 · Kodama et al. · 2015 [cited by applicant]
US 9040824B2 · Guetig et al. · 2015 [cited by applicant]
US 9071001B2 · Scherer et al. · 2015 [cited by applicant]
US 9077118B2 · Szu et al. · 2015 [cited by applicant]
US 9118151B2 · Tran et al. · 2015 [cited by applicant]
US 9119292B2 · Gundel · 2015 [cited by applicant]
US 9124009B2 · Atkinson et al. · 2015 [cited by applicant]
US 9136634B2 · De Geest et al. · 2015 [cited by applicant]
US 9142921B2 · Wanha et al. · 2015 [cited by applicant]
US 9172161B2 · Walden et al. · 2015 [cited by applicant]
US 9190776B2 · Lee et al. · 2015 [cited by applicant]
US 9203171B2 · Yu et al. · 2015 [cited by applicant]
US 9210817B2 · Briant · 2015 [cited by applicant]
US 9214768B2 · Pao et al. · 2015 [cited by applicant]
US 9219335B2 · Atkinson et al. · 2015 [cited by applicant]
US 9225085B2 · Cartier, Jr. et al. · 2015 [cited by applicant]
US 9232676B2 · Sechrist et al. · 2016 [cited by applicant]
US 9246251B2 · Regnier et al. · 2016 [cited by applicant]
US 9246262B2 · Brown · 2016 [cited by applicant]
US 9246280B2 · Neer · 2016 [cited by applicant]
US 9257778B2 · Buck et al. · 2016 [cited by applicant]
US 9257794B2 · Wanha et al. · 2016 [cited by applicant]
US 9276358B2 · Ista · 2016 [cited by applicant]
US 9277649B2 · Ellison · 2016 [cited by applicant]
US 9281636B1 · Schmitt · 2016 [cited by applicant]
US 9300067B2 · Yokoo · 2016 [cited by applicant]
US 9306334B2 · Zhu · 2016 [cited by applicant]
US 9312618B2 · Regnier et al. · 2016 [cited by applicant]
US 9337585B1 · Yang · 2016 [cited by applicant]
US 9350108B2 · Long · 2016 [cited by applicant]
US 9356401B1 · Horning et al. · 2016 [cited by applicant]
US 9362678B2 · Wanha et al. · 2016 [cited by applicant]
US 9368916B2 · Heyvaert et al. · 2016 [cited by applicant]
US 9373917B2 · Sypolt et al. · 2016 [cited by applicant]
US 9374165B2 · Zbinden et al. · 2016 [cited by applicant]
US 9385455B2 · Regnier et al. · 2016 [cited by applicant]
US 9389368B1 · Sharf · 2016 [cited by applicant]
US 9391407B1 · Bucher et al. · 2016 [cited by applicant]
US 9413112B2 · Helster et al. · 2016 [cited by applicant]
US 9425525B2 · Walden et al. · 2016 [cited by applicant]
US 9450344B2 · Cartier, Jr. et al. · 2016 [cited by applicant]
US 9472900B1 · Phillips et al. · 2016 [cited by applicant]
US 9490558B2 · Wanha et al. · 2016 [cited by applicant]
US 9509089B2 · Mathews et al. · 2016 [cited by applicant]
US 9509094B2 · Mathews et al. · 2016 [cited by applicant]
US 9509101B2 · Cartier, Jr. et al. · 2016 [cited by applicant]
US 9509102B2 · Sharf et al. · 2016 [cited by applicant]
US 9520680B2 · Hsu et al. · 2016 [cited by applicant]
US 9520689B2 · Cartier, Jr. et al. · 2016 [cited by applicant]
US 9531133B1 · Horning et al. · 2016 [cited by applicant]
US 9553381B2 · Regnier · 2017 [cited by applicant]
US 9553401B2 · Mathews et al. · 2017 [cited by applicant]
US 9559446B1 · Wetzel et al. · 2017 [cited by applicant]
US 9560760B2 · Wig · 2017 [cited by applicant]
US 9564696B2 · Gulla · 2017 [cited by applicant]
US 9608348B2 · Wanha et al. · 2017 [cited by applicant]
US 9651752B2 · Zbinden et al. · 2017 [cited by applicant]
US 9653829B2 · Long · 2017 [cited by applicant]
US 9660364B2 · Wig et al. · 2017 [cited by applicant]
US 9666961B2 · Horning et al. · 2017 [cited by applicant]
US 9668378B2 · Phillips · 2017 [cited by applicant]
US 9671582B2 · Yeh · 2017 [cited by applicant]
US 9680266B2 · Tomada · 2017 [cited by applicant]
US 9680273B2 · Light et al. · 2017 [cited by applicant]
US 9685724B2 · Tojo · 2017 [cited by applicant]
US 9685736B2 · Gailus et al. · 2017 [cited by applicant]
US 9711901B2 · Scholeno · 2017 [cited by applicant]
US 9735495B2 · Gross · 2017 [cited by applicant]
US 9761974B2 · L'Esperance et al. · 2017 [cited by applicant]
US 9774144B2 · Cartier, Jr. et al. · 2017 [cited by applicant]
US 9780496B2 · Guo · 2017 [cited by examiner]
US 9801301B1 · Costello · 2017 [cited by applicant]
US 9829662B2 · Kurashima · 2017 [cited by applicant]
US 9841572B2 · Zbinden et al. · 2017 [cited by applicant]
US 9843135B2 · Guetig et al. · 2017 [cited by applicant]
US 9882303B1 · Chalas et al. · 2018 [cited by applicant]
US 9929500B1 · Ista · 2018 [cited by applicant]
US 9929512B1 · Trout et al. · 2018 [cited by applicant]
US 9948026B2 · Mathews et al. · 2018 [cited by applicant]
US 9985367B2 · Wanha et al. · 2018 [cited by applicant]
US 9985389B1 · Morgan et al. · 2018 [cited by applicant]
US 10020614B1 · Bucher · 2018 [cited by applicant]
US 10056706B2 · Wanha et al. · 2018 [cited by applicant]
US 10062984B2 · Regnier · 2018 [cited by applicant]
US 10062988B1 · Vinther et al. · 2018 [cited by applicant]
US 10069225B2 · Wanha et al. · 2018 [cited by applicant]
US 10096945B2 · Cartier, Jr. et al. · 2018 [cited by applicant]
US 10109968B2 · Khazen · 2018 [cited by applicant]
US 10114182B2 · Zbinden et al. · 2018 [cited by applicant]
US 10116080B1 · Ju et al. · 2018 [cited by applicant]
US 10128627B1 · Kazav · 2018 [cited by applicant]
US 10135199B1 · Ju · 2018 [cited by applicant]
US 10135204B2 · Zhang · 2018 [cited by examiner]
US 10135211B2 · Lloyd et al. · 2018 [cited by applicant]
US 10136517B2 · Shirasaki · 2018 [cited by applicant]
US 10148024B2 · Ju et al. · 2018 [cited by applicant]
US 10153571B2 · Kachlic · 2018 [cited by applicant]
US 10170869B2 · Gailus et al. · 2019 [cited by applicant]
US 10181663B2 · Regnier · 2019 [cited by applicant]
US 10205286B2 · Provencher et al. · 2019 [cited by applicant]
US 10243305B1 · Pan et al. · 2019 [cited by applicant]
US 10249988B2 · Craton · 2019 [cited by applicant]
US 10276995B2 · Little · 2019 [cited by applicant]
US 10305224B2 · Girard, Jr. · 2019 [cited by applicant]
US RE47459E · Vinther et al. · 2019 [cited by applicant]
US 10348007B2 · Kataoka et al. · 2019 [cited by applicant]
US 10367280B2 · Lloyd et al. · 2019 [cited by applicant]
US 10367283B2 · L'Esperance et al. · 2019 [cited by applicant]
US 10367308B2 · Little et al. · 2019 [cited by applicant]
US 10374355B2 · Ayzenberg et al. · 2019 [cited by applicant]
US 10381767B1 · Milbrand, Jr. et al. · 2019 [cited by applicant]
US 10446960B2 · Guy Ritter et al. · 2019 [cited by applicant]
US 10461475B2 · Little · 2019 [cited by applicant]
US 10462904B2 · Shirasaki · 2019 [cited by applicant]
US 10511118B2 · Beltran et al. · 2019 [cited by applicant]
US 10551580B2 · Regnier et al. · 2020 [cited by applicant]
US 10555437B2 · Little · 2020 [cited by applicant]
US 10588243B2 · Little et al. · 2020 [cited by applicant]
US 10651606B2 · Little · 2020 [cited by applicant]
US 10680364B2 · Champion et al. · 2020 [cited by applicant]
US 10699823B2 · Blackburn et al. · 2020 [cited by applicant]
US 10716213B2 · Kim et al. · 2020 [cited by applicant]
US 10797417B2 · Scholeno et al. · 2020 [cited by applicant]
US 10840622B2 · Sasame et al. · 2020 [cited by applicant]
US 10847930B2 · Ayzenberg et al. · 2020 [cited by applicant]
US 10847937B2 · Cartier, Jr. et al. · 2020 [cited by applicant]
US 10879643B2 · Astbury et al. · 2020 [cited by applicant]
US 10910770B2 · Winey · 2021 [cited by applicant]
US 10944215B2 · Chua et al. · 2021 [cited by applicant]
US 10958005B1 · Dube · 2021 [cited by applicant]
US 11050176B2 · Yang et al. · 2021 [cited by applicant]
US 11070006B2 · Gailus et al. · 2021 [cited by applicant]
US 11101611B2 · Winey et al. · 2021 [cited by applicant]
US 11143830B2 · Luo et al. · 2021 [cited by applicant]
US 11177592B2 · Scholeno et al. · 2021 [cited by applicant]
US 11189943B2 · Zerebilov et al. · 2021 [cited by applicant]
US 11205877B2 · Diaz et al. · 2021 [cited by applicant]
US 11271348B1 · Chen et al. · 2022 [cited by applicant]
US 11309655B2 · Avery et al. · 2022 [cited by applicant]
US 11372178B2 · Zbinden et al. · 2022 [cited by applicant]
US 11437762B2 · Manter et al. · 2022 [cited by applicant]
US 11444404B2 · Si et al. · 2022 [cited by applicant]
US 11509100B2 · Chen et al. · 2022 [cited by applicant]
US 11626697B2 · Streckewald et al. · 2023 [cited by applicant]
US 11637390B2 · Zerebilov et al. · 2023 [cited by applicant]
US 11670879B2 · Zerebilov · 2023 [cited by applicant]
US 11677188B2 · Diaz et al. · 2023 [cited by applicant]
US 11715922B2 · Winey et al. · 2023 [cited by applicant]
US 11735852B2 · Cartier, Jr. et al. · 2023 [cited by applicant]
US 11757228B2 · Lai et al. · 2023 [cited by applicant]
US 11824311B2 · Gailus et al. · 2023 [cited by applicant]
US 11984678B2 · Zerebilov et al. · 2024 [cited by applicant]
US 11996654B2 · Diaz et al. · 2024 [cited by applicant]
US 20080207023A1 · Tuin et al. · 2008 [cited by applicant]
US 20080246555A1 · Kirk et al. · 2008 [cited by applicant]
US 20080248658A1 · Cohen et al. · 2008 [cited by applicant]
US 20080248659A1 · Cohen et al. · 2008 [cited by applicant]
US 20080248660A1 · Kirk et al. · 2008 [cited by applicant]
US 20080264673A1 · Chi et al. · 2008 [cited by applicant]
US 20080267620A1 · Cole et al. · 2008 [cited by applicant]
US 20080297988A1 · Chau · 2008 [cited by applicant]
US 20080305689A1 · Zhang et al. · 2008 [cited by applicant]
US 20090011641A1 · Cohen et al. · 2009 [cited by applicant]
US 20090011645A1 · Laurx et al. · 2009 [cited by applicant]
US 20090011664A1 · Laurx et al. · 2009 [cited by applicant]
US 20090017682A1 · Amleshi et al. · 2009 [cited by applicant]
US 20090023330A1 · Stoner et al. · 2009 [cited by applicant]
US 20090051558A1 · Dorval · 2009 [cited by applicant]
US 20090098767A1 · Long · 2009 [cited by applicant]
US 20090117386A1 · Vacanti et al. · 2009 [cited by applicant]
US 20090130913A1 · Yi et al. · 2009 [cited by applicant]
US 20090130918A1 · Nguyen et al. · 2009 [cited by applicant]
US 20090134895A1 · Miller · 2009 [cited by applicant]
US 20090166082A1 · Liu et al. · 2009 [cited by applicant]
US 20090176400A1 · Davis et al. · 2009 [cited by applicant]
US 20090205194A1 · Semba et al. · 2009 [cited by applicant]
US 20090215309A1 · Mongold et al. · 2009 [cited by applicant]
US 20090227141A1 · Pan · 2009 [cited by applicant]
US 20090239395A1 · Cohen et al. · 2009 [cited by applicant]
US 20090247012A1 · Pan · 2009 [cited by applicant]
US 20090269971A1 · Tamura et al. · 2009 [cited by applicant]
US 20090291593A1 · Atkinson et al. · 2009 [cited by applicant]
US 20090291596A1 · Miyazoe · 2009 [cited by applicant]
US 20090305533A1 · Feldman et al. · 2009 [cited by applicant]
US 20090311908A1 · Fogg et al. · 2009 [cited by applicant]
US 20100009571A1 · Scherer et al. · 2010 [cited by applicant]
US 20100018738A1 · Chen et al. · 2010 [cited by applicant]
US 20100078738A1 · Chambers et al. · 2010 [cited by applicant]
US 20100081302A1 · Atkinson et al. · 2010 [cited by applicant]
US 20100087084A1 · George · 2010 [cited by applicant]
US 20100099299A1 · Moriyama et al. · 2010 [cited by applicant]
US 20100112850A1 · Rao et al. · 2010 [cited by applicant]
US 20100144167A1 · Fedder et al. · 2010 [cited by applicant]
US 20100144168A1 · Glover et al. · 2010 [cited by applicant]
US 20100144175A1 · Helster et al. · 2010 [cited by applicant]
US 20100144201A1 · Defibaugh et al. · 2010 [cited by applicant]
US 20100144203A1 · Glover et al. · 2010 [cited by applicant]
US 20100177489A1 · Yagisawa · 2010 [cited by applicant]
US 20100183141A1 · Arai et al. · 2010 [cited by applicant]
US 20100203768A1 · Kondo et al. · 2010 [cited by applicant]
US 20100221951A1 · Pepe et al. · 2010 [cited by applicant]
US 20100248544A1 · Xu et al. · 2010 [cited by applicant]
US 20100291806A1 · Minich et al. · 2010 [cited by applicant]
US 20100294530A1 · Atkinson et al. · 2010 [cited by applicant]
US 20110003509A1 · Gailus · 2011 [cited by applicant]
US 20110034075A1 · Feldman et al. · 2011 [cited by applicant]
US 20110067237A1 · Cohen et al. · 2011 [cited by applicant]
US 20110074213A1 · Schaffer et al. · 2011 [cited by applicant]
US 20110081114A1 · Togami · 2011 [cited by applicant]
US 20110100694A1 · Regnier et al. · 2011 [cited by applicant]
US 20110104948A1 · Girard, Jr. et al. · 2011 [cited by applicant]
US 20110130038A1 · Cohen et al. · 2011 [cited by applicant]
US 20110136387A1 · Matsuura et al. · 2011 [cited by applicant]
US 20110177699A1 · Crofoot et al. · 2011 [cited by applicant]
US 20110212632A1 · Stokoe et al. · 2011 [cited by applicant]
US 20110212633A1 · Regnier et al. · 2011 [cited by applicant]
US 20110212649A1 · Stokoe et al. · 2011 [cited by applicant]
US 20110212650A1 · Amleshi et al. · 2011 [cited by applicant]
US 20110223807A1 · Jeon et al. · 2011 [cited by applicant]
US 20110230095A1 · Atkinson et al. · 2011 [cited by applicant]
US 20110230096A1 · Atkinson et al. · 2011 [cited by applicant]
US 20110230104A1 · Lang et al. · 2011 [cited by applicant]
US 20110263156A1 · Ko · 2011 [cited by applicant]
US 20110287663A1 · Gailus et al. · 2011 [cited by applicant]
US 20110300757A1 · Regnier et al. · 2011 [cited by applicant]
US 20110300760A1 · Ngo · 2011 [cited by applicant]
US 20120003848A1 · Casher et al. · 2012 [cited by applicant]
US 20120034798A1 · Khemakhem et al. · 2012 [cited by applicant]
US 20120034820A1 · Lang et al. · 2012 [cited by applicant]
US 20120040563A1 · Wang et al. · 2012 [cited by applicant]
US 20120052712A1 · Wang · 2012 [cited by applicant]
US 20120058665A1 · Zerebilov · 2012 [cited by applicant]
US 20120058670A1 · Regnier et al. · 2012 [cited by applicant]
US 20120077369A1 · Andersen · 2012 [cited by applicant]
US 20120077380A1 · Minich et al. · 2012 [cited by applicant]
US 20120094536A1 · Khilchenko et al. · 2012 [cited by applicant]
US 20120135643A1 · Lange et al. · 2012 [cited by applicant]
US 20120148198A1 · Togami et al. · 2012 [cited by applicant]
US 20120156929A1 · Manter et al. · 2012 [cited by applicant]
US 20120156938A1 · Zhang · 2012 [cited by applicant]
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