Apparatus for processing surface of substrate and nozzle head
The invention relates to an apparatus and nozzle head for processing a surface of a substrate. The apparatus includes a substrate support mechanism for supporting the substrate on a substrate support plane in a process zone, a nozzle head for subjecting the surface of the substrate to successive surface reactions of at least a first precursor and a second precursor and a nozzle head support mechanism for supporting the nozzle head at a predetermined distance from the substrate support plane. The nozzle head support mechanism includes a nozzle head support surface and, that the nozzle head is supported to the nozzle head support surface.
1. An apparatus for processing a surface of a substrate, the apparatus comprising:
a substrate support mechanism for supporting the substrate on a substrate support plane in a process zone;
a nozzle head for subjecting the surface of the substrate to successive surface reactions of at least a first precursor and a second precursor, the nozzle head having an output face via which the at least first and second precursors are supplied to the surface of the substrate; and
a nozzle head support mechanism for supporting the nozzle head over the substrate support plane,
the nozzle head being arranged to be moved in the process zone over the substrate support plane in relation to the substrate for subjecting the surface of the substrate to successive surface reactions of at least the first precursor and the second precursor,
wherein the apparatus further comprises a nozzle head positioning mechanism comprising:
a nozzle head support surface; and
nozzle head support elements extending from the nozzle head and from the level of the output face for supporting the nozzle head against the nozzle head support surface,
the nozzle head being supported against the nozzle head support surface such that the nozzle head support elements are in contact with and against the nozzle head support surface such that a predetermined distance between the substrate support plane and the nozzle head is maintained as the nozzle head is moved in the process zone in relation to the substrate, the nozzle head support elements of the nozzle head positioning mechanism being moved against and in relation to the nozzle head support surface.
2. An apparatus according to claim 1 , wherein the nozzle head support surface substantially conforms to the substrate support plane for determining the predetermined distance between the substrate support plane and the nozzle head.
3. An apparatus according to claim 2 , wherein the substrate support plane is provided as substrate support surface on which the substrate is supported in the process zone, and that the substrate support surface and the nozzle head support surface are arranged at a substantially constant distance from each other in the process zone for determining the predetermined distance between the substrate support plane and the nozzle head.
4. An apparatus according to claim 2 , wherein the substrate support mechanism comprises two or more substrate support elements between which the substrate is supported for placing the substrate on the support plane, and that the substrate support plane and the nozzle head support surface are arranged at a substantially constant distance from each other in the process zone for determining the predetermined distance between the substrate support plane and the nozzle head.
5. An apparatus according to claim 4 , wherein the nozzle head support surface is:
a separate surface to which the nozzle head is supported; or
the substrate support surface for supporting the nozzle head to the substrate support surface; or
the surface of the substrate for supporting the nozzle head to the substrate support surface.
6. An apparatus according to claim 2 , wherein the substrate support mechanism comprises a substrate support cylinder having an outer cylinder surface provided as the substrate support surface on which the substrate is supported in the process zone.
7. An apparatus according to claim 6 , wherein the substrate support cylinder is provided with:
a cylindrical nozzle head support surface arranged a coaxially with the outer cylinder surface and fixedly connected to the outer cylinder surface;
a cylindrical nozzle head support surface arranged a coaxially with the outer cylinder surface and rotatably in relation to the outer cylinder surface.
8. An apparatus according to claim 6 , wherein the nozzle head support mechanism comprises one or more suspension members for engaging the nozzle head to central axis of the substrate support cylinder.
9. An apparatus according to claim 6 , wherein the substrate support cylinder is arranged to be rotated around the central axis for transporting the substrate along the outer cylinder surface through the process zone, and that the nozzle head support mechanism is arranged to move in pendulum movement at the predetermined distance from the outer cylinder surface.
10. An apparatus according to claim 1 , wherein nozzle head support element comprises a contact part arranged in contact with and against he nozzle head support surface, the contact part comprising a sliding surface, a bearing, a wheel or roll for enabling movement of the nozzle head against and in relation to the nozzle head support surface.
11. An apparatus according to claim 1 , wherein the nozzle head support mechanism comprises pre-stress means arranged to press the nozzle head against the nozzle head support surface.
12. An apparatus according to claim 11 , wherein pre-stress means comprises:
one or more spring elements,
one or more hydraulic elements,
one or more magnetic elements,
a weight, or
one or more electrical elements arranged to press the nozzle head against the nozzle head support surface.
13. An apparatus according to claim 11 , wherein the nozzle head support mechanism comprises nozzle head displacing means arranged to displace the nozzle head in opposite direction to the pressing direction of the pre-stress means for temporarily increasing the predetermined gap and for disengaging the nozzle head from the nozzle head support surface.
14. A nozzle head for processing a surface of a substrate, the nozzle head having an output face comprising at least one first precursor nozzle and at least one second precursor nozzle for subjecting the surface of the substrate successively to the first and second precursor,
wherein the nozzle head further comprises nozzle head positioning mechanism provided with nozzle head support elements extending from the nozzle head and from the level of the output face arranged to support the nozzle head in contact against a nozzle head support surface and to move against the nozzle head support surface for providing a predetermined gap between the output face and the nozzle head support surface.
15. A nozzle head according to claim 14 , wherein nozzle head support element comprises a contact part arranged to be in contact with and against the nozzle head support surface, the contact part comprising a sliding surface, a bearing, a wheel or roll for enabling movement of the nozzle head against and in relation to the nozzle head support surface.
16. A nozzle head according to claim 14 , wherein the nozzle head comprises a nozzle head support mechanism comprises pre-stress means for pressing the nozzle head against the nozzle head support surface.
17. A nozzle head according to claim 16 , wherein the pre-stress means comprises:
one or more spring elements,
one or more hydraulic elements,
one or more magnetic elements,
a weight, or
one or more electrical elements for pressing the nozzle head against the nozzle head support surface.
18. A nozzle head according to claim 16 , wherein the nozzle head support mechanism comprises nozzle head displacing means for displacing the nozzle head in opposite direction to the pressing direction of the pre-stress means.
19. A nozzle head according to claim 16 , wherein the nozzle head support mechanism is provided with moving means for moving the nozzle head in pendulum motion, rotation motion and/or reciprocating motion.