IP Library Granted Patent US 9,449,842
Granted Patent B2
US 9,449,842 · App. 14/447,615 · Granted Sep 20, 2016

Plasma etching method

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,449,842
App. No.
14/447,615
Granted
Sep 20, 2016
Kind
B2
Abstract

A plasma etching method for plasma etching a film to be etched to a size smaller than a prescribed size using a mask patterned to the prescribed size performs etching on the film to be etched to the size smaller than the prescribed size while forming a protection film on side walls of the film to be etched.

Claims (10)

1. A plasma etching method for plasma etching a film to be etched to a size smaller than a prescribed size using a mask which is patterned to the prescribed size, wherein the plasma etching is conducted in an induction coupling plasma etching apparatus provided with a Faraday shield, the method comprising:

etching the film to be etched to the size smaller than the prescribed size; and

hardening side walls of the mask by applying a radio frequency voltage to the Faraday shield to positively deposit a protection film on the side walls, the radio frequency voltage being in a range of 50 V to 250 V.

2. The plasma etching method according to claim 1 , wherein the film to be etched is a metallic film.

3. The plasma etching method according to claim 1 , wherein the radio frequency voltage to be applied to the Faraday shield is controlled such that deposit on the side walls of the mask is balanced to the etching of the side walls of the mask.

4. The plasma etching method according to claim 3 , wherein the film to be etched is a metallic film.

5. A plasma etching method for plasma etching a chromium film, wherein the plasma etching is conducted in an induction coupling plasma etching apparatus provided with a Faraday shield, the method comprising:

after generating a plasma using a mixed gas of chlorine gas and oxygen gas, etching the chromium film with the mixed gas; and

hardening side walls of the mask by applying a radio frequency voltage to the Faraday shield to positively deposit a protection film on the side walls, the radio frequency voltage being in a range of 50 V to 250 V.

6. The plasma etching method according to claim 5 , wherein the radio frequency voltage to be applied to the Faraday shield is controlled such that deposit on the side walls of the mask is balanced to the etching of the side walls of the mask.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 31, 2014
From: ISHIMARU, MASATO; ABE, TAKAHIRO; SUYAMA, MAKOTO; SHIMADA, TAKESHI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 033440/0425 →