Methods for removing adhesive layers from semiconductor wafers
Various embodiments of semiconductor manufacturing methods include releasing a transparent carrier from a semiconductor wafer assembly that includes a semiconductor wafer in which a plurality of semiconductor devices are formed, an adhesive layer coupled to the semiconductor wafer, a carrier release layer coupled to the adhesive layer, and the transparent carrier coupled to the carrier release layer. The method further includes controlling a laser system to emit a first beam characterized by first laser parameters toward the adhesive layer, where the first laser parameters are selected so that the first beam will compromise a physical integrity of the adhesive layer. The method further includes, after controlling the laser system to emit the first beam toward the adhesive layer, removing the adhesive layer from the semiconductor wafer.
1. A semiconductor manufacturing method comprising:
releasing a transparent carrier from a semiconductor wafer assembly, wherein the semiconductor wafer assembly includes a semiconductor wafer in which a plurality of semiconductor devices are formed, an adhesive layer coupled to the semiconductor wafer, a carrier release layer coupled to the adhesive layer, and the transparent carrier coupled to the carrier release layer;
controlling a laser system to emit a first beam characterized by first laser parameters toward the adhesive layer, wherein the first laser parameters are selected so that the first beam will compromise a physical integrity of the adhesive layer; and
after controlling the laser system to emit the first beam toward the adhesive layer, removing the adhesive layer from the semiconductor wafer.
2. The method of claim 1 , wherein controlling the laser system to emit the first beam toward the adhesive layer comprises directing the first beam only toward one or more portions of the adhesive layer that do not overlie the semiconductor devices.
3. The method of claim 2 , wherein the one or more portions of the adhesive layer include a portion of the adhesive layer that overlies an edge region of the semiconductor wafer.
4. The method of claim 3 , wherein the portion of the adhesive layer that overlies the edge region extends around an entire perimeter of the semiconductor wafer.
5. The method of claim 3 , wherein the portion of the adhesive layer that overlies the edge region extends around only a segment of a perimeter of the semiconductor wafer, wherein the segment of the perimeter of the semiconductor wafer is between 10 percent to 50 percent of the perimeter of the semiconductor wafer.
6. The method of claim 3 , wherein removing the adhesive layer comprises initiating removal of the adhesive layer at the portion of the adhesive layer that overlies the edge region of the semiconductor wafer.
7. The method of claim 2 , wherein the one or more portions of the adhesive layer include a portion of the adhesive layer that overlies an edge region of the semiconductor wafer, and is inset from a perimeter of the semiconductor wafer.
8. The method of claim 1 , wherein the first laser parameters comprise wavelengths in a range from 300 nanometers to 1100 nanometers, and power levels in a range from 100 watts to 300 watts.
9. The method of claim 1 , wherein releasing the carrier release layer comprises controlling the laser system to emit a second beam characterized by second laser parameters toward the carrier release layer, wherein the second laser parameters are different from the first laser parameters, and the second laser parameters are selected so that the second beam will compromise a physical integrity of the carrier release layer.
10. The method of claim 1 , further comprising:
after releasing the carrier layer and before controlling the laser system to emit the first beam toward the adhesive layer, removing the carrier from the semiconductor wafer.
11. The method of claim 1 , further comprising producing the semiconductor wafer assembly by:
applying the adhesive layer to the semiconductor wafer;
applying the carrier release layer to the transparent carrier;
connecting together the adhesive layer and the carrier release layer;
backgrinding the semiconductor wafer;
etching a backside of the semiconductor wafer; and
depositing a backside metal to the backside of the semiconductor wafer.
12. A semiconductor manufacturing method comprising:
controlling a laser system to emit a first beam characterized by first laser parameters toward a light to heat conversion (LTHC) release layer of a semiconductor wafer assembly that includes a semiconductor wafer, an adhesive layer coupled to the semiconductor wafer, the LTHC release layer coupled to the adhesive layer, and a transparent carrier coupled to the LTHC release layer, wherein the first laser parameters are selected so that the first beam will compromise a physical integrity of the LTHC layer; and
controlling the laser system to emit a second beam characterized by second laser parameters toward the adhesive layer, wherein the second laser parameters are different from the first laser parameters, and the second laser parameters are selected so that the second beam will compromise a physical integrity of the adhesive layer.
13. The method of claim 12 , wherein the first laser parameters comprise wavelengths in a range from 300 nanometers to 1100 nanometers, and power levels in a range from 20 watts to 120 watts.
14. The method of claim 12 , wherein the second laser parameters comprise wavelengths in a range from 300 nanometers to 1100 nanometers, and power levels in a range from 100 watts to 300 watts.
15. The method of claim 12 , wherein controlling the laser system to emit the first beam comprises directing the first beam toward a reflective surface, and moving the reflective surface to move the first beam across a surface of the LTHC release layer in a raster pattern.
16. The method of claim 12 , wherein controlling the laser system to emit the second beam comprises directing the second beam toward a reflective surface, and moving the reflective surface to move the second beam across a portion of a surface of the adhesive layer that does not overlie semiconductor devices formed in the semiconductor wafer.
17. The method of claim 16 , wherein the portion of the adhesive layer comprises a portion of the adhesive layer that overlies an edge region of the semiconductor wafer.
18. The method of claim 17 , further comprising removing the adhesive layer by initiating removal of the adhesive layer at the portion of the adhesive layer that overlies the edge region of the semiconductor wafer.
19. The method of claim 12 , wherein controlling the laser system to emit the second beam comprises operating the laser system in a continuous mode of operation.
20. The method of claim 12 , wherein controlling the laser system to emit the second beam comprises operating the laser system in a pulsed mode of operation.