Semiconductor package for a lateral device and related methods
A semiconductor package. Implementations may include a lateral device that may include a lateral semiconductor device including one of interspersed and interdigitated source and drain regions and one or more gate regions, a single layer clip, and a leadframe. The single layer clip may be coupled to the one of interspersed and interdigitated source and drain regions and the one or more gate regions and to the leadframe. The single layer clip may be configured to redistribute and to isolate source, drain, and gate signals passing into and out from the lateral semiconductor device during operation of the semiconductor device package.
1. A method of manufacturing a semiconductor device package, the method comprising:
coupling a single layer clip comprising at least one source finger, at least one drain finger, and at least one gate finger to a plurality of source standoff contacts, a plurality of drain standoff contacts, and one or more gate standoff contacts, respectively, comprised in a lateral semiconductor device;
coupling a leadframe to the single layer clip, the leadframe comprising at least one source section, at least one drain section, and at least one gate section;
one of overmolding and encapsulating the lateral semiconductor device, a majority of the single layer clip, and a face of the leadframe facing the lateral semiconductor device with a mold compound; and
singulating the at least one source finger, the at least one drain finger, and the at least one gate finger.
2. The method of claim 1 , wherein coupling a leadframe to the single layer clip further comprises coupling using a source clip contact, drain clip contact, and a gate clip contact comprised in each of the at least one source section, the at least one drain section, and the at least one gate section, respectively.
3. The method of claim 1 , further comprising isolating source, drain, and gate regions of the lateral semiconductor device through the at least one source finger, the at least one drain finger, and the at least one gate finger of the single layer clip.
4. The method of claim 3 , wherein isolating source, drain, and gate regions of the lateral semiconductor device further comprises isolating using the at least one source section, the at least one drain section, and the at least one gate section of the leadframe which are physically separated from each other.
5. The method of claim 1 , further comprising:
forming a plurality of source pads and a plurality of drain pads on the lateral semiconductor device, the plurality of source pads and plurality of drain pads arranged in one of an interspersed arrangement and an interdigitated arrangement with respect to each other;
forming a plurality of source tracks coupled to the plurality of source pads, the plurality of source tracks comprising the plurality of source standoff contacts;
forming a plurality of drain tracks coupled to the plurality of drain pads, the plurality of drain tracks comprising the plurality of drain standoff contacts;
forming at least one gate pad, the at least one gate pad is coupled to one or more gate standoff contacts.