Fabricated electrical circuit on touch sensor substrate
In one embodiment, a device includes a flexible substrate, a touch sensor made of flexible conductive material disposed on the flexible substrate, and conductive tracks made of flexible conductive material disposed on the flexible substrate. The device also includes an electrical component bonded to the conductive tracks. The conductive tracks electrically couple the electrical component to the touch sensor.
1. A device comprising:
a flexible substrate comprising a main portion and a tail portion;
a touch sensor comprising flexible conductive material disposed on the main portion of the flexible substrate, wherein the flexible conductive material comprises at least one of anisotropic conductive paste (ACP), anisotropic conductive film (ACF), and conductive epoxy;
conductive tracks comprising flexible conductive material disposed on the flexible substrate, wherein the flexible conductive material comprises at least one of ACP, ACF, and conductive epoxy;
an electrical component bonded to the tail portion of the flexible substrate such that the electrical component is bonded to the flexible substrate on which the touch sensor is disposed, wherein the conductive tracks electrically couple the electrical component to the touch sensor;
a stiffener positioned opposite the electrical component on a side of the flexible substrate opposite a side of the flexible substrate on which the electrical component is disposed;
an electrically conductive material comprising at least one of a copper-based material, a silver-based material, and a carbon-based material, the electrically conductive material disposed above at least a portion of the conductive tracks and below the electrical component;
a plurality of bonding pads arranged on the flexible substrate in a pattern associated with a plurality of pins of the electrical component, wherein the bonding pads are bonded to the pins using the electrically conductive material; and
a plurality of electrical interconnects formed between the bonding pads and the pins by a plurality of conductive particles of the electrically conductive material;
wherein the touch sensor comprises a double-layer configuration with one or more electrodes disposed on a first surface of the flexible substrate and one or more electrodes disposed on a second surface of the flexible substrate opposite the first surface.
2. The device of claim 1 , wherein the flexible substrate comprises polyethylene terephthalate (PET).
3. The device of claim 1 , wherein the electrical component is bonded to the conductive tracks using the electrically conductive material.
4. The device of claim 1 , wherein the electrical component is an integrated circuit (IC) encased in packaging, and wherein pins fix electrically coupling the IC to the conductive tracks extend outside the packaging.
5. The device of claim 1 , wherein the electrical component is a touch-sensor controller.
6. The device of claim 1 , wherein the electrical component is an active electrical component.
7. The device of claim 1 , wherein the electrical component is a passive electrical component.
8. The device of claim 1 , wherein at least some of the flexible conductive material comprises a mesh of conductive lines.
9. The device of claim 1 , further comprising a via in the flexible substrate for coupling the electrical component to a first surface of the flexible substrate and to a second surface of the flexible substrate opposite the first surface.
10. The device of claim 1 , wherein at least some of the conductive tracks comprise a plurality of bonding pads.
11. A method comprising:
disposing flexible conductive material on a flexible substrate, wherein the flexible substrate is double-sided and comprises a main portion and a tail portion, wherein the flexible conductive material comprises at least one of anisotropic conductive paste (ACP), anisotropic conductive film (ACF), and conductive epoxy;
forming a touch sensor on the main portion of the flexible substrate with a first portion of the flexible conductive material;
forming conductive tracks on the flexible substrate with a second portion of the flexible conductive material;
bonding an electrical component to the tail portion of the flexible substrate such that the electrical component is bonded to the flexible substrate on which the touch sensor is formed, wherein the conductive tracks:
electrically couple the electrical component to the touch sensor; and
extend along a first side of the flexible substrate;
applying a stiffener positioned opposite the electrical component on a side of the flexible substrate opposite a side of the flexible substrate on which the electrical component is positioned; and
applying an electrically conductive material above at least a portion of the conductive tracks such that the electrical component is positioned above the electrically conductive material, wherein the electrically conductive material comprises at least one of a copper-based material, a silver-based material, and a carbon-based material;
arranging a plurality of bonding pads on the flexible substrate in a pattern associated with a plurality of pins of the electrical component, wherein the bonding pads are bonded to the pins using the electrically conductive material; and
forming a plurality of electrical interconnects between the bonding pads and the pins by a plurality of conductive particles of the electrically conductive material;
wherein the touch sensor comprises a double-layer configuration with one or more electrodes disposed on a first surface of the flexible substrate and one or more electrodes disposed on a second surface of the flexible substrate opposite the first surface.
12. The method of claim 11 , wherein the flexible substrate comprises polyethylene terephthalate (PET).
13. The method of claim 11 , wherein the electrical component is bonded to the conductive tracks using the electrically conductive material.
14. The method of claim 11 , wherein the electrical component is an integrated circuit (IC) encased in packaging, and wherein pins fix electrically coupling the IC to the conductive tracks extend outside the packaging.
15. The method of claim 11 , wherein bonding the electrical component to the conductive tracks comprises:
applying a pre-determined pressure and one or more pre-determined elevated temperature cycles to the electrical component; and
encapsulating the electrical component.
16. A device comprising:
a flexible substrate comprising a main portion and a tail portion;
a touch sensor comprising flexible conductive material disposed on the main portion of the flexible substrate, at least a portion of the flexible conductive material comprising a mesh of conductive lines, wherein the flexible conductive material comprises at least one of anisotropic conductive paste (ACP), anisotropic conductive film (ACF), and conductive epoxy;
conductive tracks comprising flexible conductive material disposed on the flexible substrate, wherein the flexible conductive material comprises at least one of ACP, ACF, and conductive epoxy;
an electrical component bonded to the tail portion of-the flexible substrate such that the electrical component is bonded to the flexible substrate on which the touch sensor is disposed, wherein the conductive tracks electrically couple the electrical component to the touch sensor;
a stiffener positioned opposite the electrical component on a side of the flexible substrate opposite a side of the flexible substrate on which the electrical component is disposed;
an electrically conductive material, the electrically conductive material disposed above at least a portion of the conductive tracks and below the electrical component, wherein the electrically conductive material comprises at least one of a copper-based material, a silver-based material, and a carbon-based material;
a plurality of bonding pads arranged on the flexible substrate in a pattern associated with a plurality of pins of the electrical component, wherein the bonding pads are bonded to the pins using the electrically conductive material; and
a plurality of electrical interconnects formed between the bonding pads and the pins by a plurality of conductive particles of the electrically conductive material;
wherein the touch sensor comprises a double-layer configuration with one or more electrodes disposed on a first surface of the flexible substrate and one or more electrodes disposed on a second surface of the flexible substrate opposite the first surface.