IP Library Granted Patent US 9,215,361
Granted Patent B2
US 9,215,361 · App. 14/464,630 · Granted Dec 15, 2015

Array cameras with light barriers

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Quick Facts
Patent No.
US 9,215,361
App. No.
14/464,630
Granted
Dec 15, 2015
Kind
B2
Abstract

An imaging system such as an array camera may include an array of image sensors. The image sensors may each include an array of image pixels formed in a common image sensor substrate. A protective glass cover layer may be provided over the array of image sensors. The cover layer may be attached to the image sensor substrate using an adhesive. The adhesive may be formed on the image sensor substrate in a grid-like pattern in between adjacent image sensors in the array. A light blocking material may be formed on the adhesive grid to minimize optical crosstalk between neighboring image sensors. The light blocking material may fill or partially fill a trench in the adhesive, may coat the outer surfaces of the adhesive, and/or may coat the inner surfaces of the adhesive. If desired, light barriers may also be formed in openings in the glass cover layer.

Claims (32)

1. An imaging system, comprising:

an array of image sensors formed in an image sensor substrate, wherein each image sensor includes an array of image sensor pixels;

a transparent cover layer formed over the array of image sensors;

an adhesive interposed between the image sensor substrate and the transparent cover layer, wherein the adhesive attaches the transparent cover layer to the image sensor substrate; and

a light blocking material formed on the adhesive, wherein the light blocking material is interposed between adjacent image sensors in the array of image sensors.

2. The imaging system defined in claim 1 wherein the adhesive comprises a trench and wherein the light blocking material is located in the trench.

3. The imaging system defined in claim 2 wherein the light blocking material completely fills the trench.

4. The imaging system defined in claim 2 wherein the adhesive has inner surfaces that define the trench and wherein the inner surfaces are coated with the light blocking material.

5. The imaging system defined in claim 1 wherein the adhesive forms a wall between the adjacent image sensors in the array of image sensors, wherein the wall has first and second opposing outer surfaces, and wherein the first and second opposing outer surfaces are coated with the light blocking material.

6. The imaging system defined in claim 5 wherein the adhesive comprises a trench and wherein the light blocking material is located in the trench.

7. The imaging system defined in claim 6 wherein the light blocking material completely fills the trench.

8. The imaging system defined in claim 6 wherein the adhesive has inner surfaces that define the trench and wherein the inner surfaces are coated with the light blocking material.

9. The imaging system defined in claim 1 wherein the light blocking material comprises an opaque polymer.

10. The imaging system defined in claim 1 wherein the light blocking material transmits light corresponding to a first range of wavelengths and blocks light corresponding to a second range of wavelengths.

11. An imaging system, comprising:

an array of image sensors formed in an image sensor substrate, wherein each image sensor includes an array of image sensor pixels;

a transparent cover layer formed over the array of image sensors, wherein the transparent cover layer comprises at least one opening and wherein the opening is interposed between an adjacent pair of image sensors in the array of image sensors;

an adhesive interposed between the image sensor substrate and the transparent cover layer, wherein the adhesive attaches the transparent cover layer to the image sensor substrate; and

a light blocking material formed in the at least one opening in the transparent cover layer.

12. The imaging system defined in claim 11 wherein the transparent cover layer comprises glass and wherein the at least one opening is etched in the glass.

13. The imaging system defined in claim 12 wherein the at least one opening extends from an upper surface of the glass to a lower surface of the glass and wherein the light blocking material fills the opening.

14. The imaging system defined in claim 12 wherein the at least one opening extends only partially through the glass.

15. The imaging system defined in claim 11 wherein the light blocking material comprises black pigment.

16. An imaging system, comprising:

an array of image sensors formed in an image sensor substrate, wherein each image sensor includes an array of image sensor pixels;

a glass cover layer formed over the array of image sensors, wherein the glass cover layer comprises at least one opening and wherein the opening is interposed between an adjacent pair of image sensors in the array of image sensors;

an adhesive interposed between the image sensor substrate and the glass cover layer, wherein the adhesive attaches the glass cover layer to the image sensor substrate; and

a first opaque material formed in the at least one opening in the glass cover layer and a second opaque material formed on the adhesive, wherein the first and second opaque materials are interposed between the adjacent pair of image sensors in the array of image sensors.

17. The imaging system defined in claim 16 wherein the first and second opaque materials form respective first and second alignment marks, wherein the glass cover layer is aligned with respect to the image sensor substrate using the first and second alignment marks.

18. The imaging system defined in claim 16 wherein the adhesive comprises a trench and wherein the second opaque material is located in the trench.

19. The imaging system defined in claim 16 wherein the adhesive comprises a dry film adhesive.

20. The imaging system defined in claim 16 wherein the first and second opaque materials comprise black pigment that blocks visible light.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2014
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034673/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2014
From: BORTHAKUR, SWARNAL; CHURCHWELL, SCOTT; LAKE, RICK; LEE, NATHAN
To: APTINA IMAGING CORPORATION
Reel/Frame 033577/0304 →