Capacitive opens testing of low profile components
View Patent ↗A probe assembly for capacitive testing electrical connections of a low profile component to a circuit assembly. The probe assembly is configured to reduce coupling of noise signals from the circuit assembly to the capacitive probe. The probe assembly includes a sensing member with a geometry that allows the probe to preferentially couple to test signals from the pins of a component under test rather than conductive structures on the circuit assembly, such as pads, and signal traces to which those pins are attached. The sensing member may be a vertical capacitive sense plate such that coupling is to an edge of the plate. The sensing member alternatively may be a horizontal capacitive sense plate with an active area of the probe surrounded by an isolation ring. Measurements made with such capacitive probes may provide test measurements that yield a reliable discrimination between a properly attached pin and an open pin.
1. A method of testing a circuit assembly comprising a substrate and a component mounted to the substrate, the component comprising a two-dimensional array of a plurality of conductors, the two-dimensional array having a first area, the method comprising acts of:
in production,
positioning a probe adjacent to the component, wherein the probe comprises a conductive sensing member having a second area that is smaller than the first area of the two-dimensional array of the plurality of conductors and having a length such that the conductive sensing member is positioned to capacitively couple to two or more of the plurality of conductors;
coupling a test signal to the substrate; and
sensing the signal capacitively coupled to the sensing member from a conductor of the plurality of conductors.
2. The method of claim 1 , wherein:
the plurality of conductors are configured within a housing to provide a dual in-line component, with each of two lines of conductors being perpendicular to a width of the sensing member.
3. The method of claim 2 , wherein:
positioning the probe comprises positioning the sensing member parallel to and between the two lines of conductors.
4. The method of claim 1 , wherein:
the component has a standoff from the substrate of less than 2 mm.
5. The method of claim 1 , wherein:
a plurality of pads are positioned on the substrate at a periphery of the component; and
positioning the probe comprises positioning the sensing member at a central location of the component.
6. The method of claim 1 , wherein:
the sensing member comprises a planar conductive member with a width less than 2 mm.
7. The method of claim 6 , wherein the planar conductive member is oriented horizontally with respect to the substrate.
8. The method of claim 6 , wherein the planar conductive member is oriented vertically with respect to the substrate.
9. The method of claim 1 , wherein:
the component comprises a housing with a cavity in which portions of conductors of the plurality of conductors are exposed;
the sensing member comprises a plate comprising an edge; and
positioning the probe adjacent to the component comprises positioning the edge in the cavity.
10. The method of claim 1 , wherein:
the sensing member comprises a wire.
11. The method of claim 1 , wherein:
the sensing member is embedded within the component; and
sensing the signal capacitively coupled to the sensing member further comprises making an electrical connection to the sensing member.
12. A probe assembly for making capacitive measurements of signals coupled from a conductor of a two-dimensional array of a plurality of conductors of a component, the two-dimensional array having a first area, the component being attached to a printed circuit board, the probe assembly having a component-facing portion, and the probe assembly comprising:
a support member;
a planar, conductive sensing member mechanically coupled to the support member, the sensing member comprising a portion defining the component-facing portion of the probe assembly, the component-facing portion having a second area that is less than the first area of the two-dimensional array of the plurality of conductors;
circuitry, electrically coupled to a sensor plate, the circuitry being configured to amplify a signal capacitively coupled from a conductor of the plurality of conductors to the sensor plate; and
a guide portion configured to guide the sensing member into alignment with the plurality of conductors of the electronic component.
13. The probe assembly of claim 12 , wherein:
the sensing member comprises a planar surface and an edge; and
the sensing member is attached to the support member such that the edge defines the component-facing portion of the probe assembly.
14. The probe assembly of claim 13 , wherein:
the support member comprises a planar dielectric portion; and
the sensing member is attached to the support member such that the surface of the sensing member is parallel to and extending from the planar dielectric portion of the support member.
15. The probe assembly of claim 14 , wherein:
the surface of the sensing member comprises a first surface;
the sensing member comprises a second opposing surface; and
the probe assembly further comprises:
a first guard plate parallel to the first surface; and
a second guard plate parallel to the second surface.
16. The probe assembly of claim 12 , wherein:
the sensing member comprises a surface and an edge; and
the sensing member is attached to the support member such that the surface defines the component-facing portion of the probe assembly.
17. The probe assembly of claim 16 , wherein:
the support member comprises a planar dielectric portion; and
the sensing member is attached to the planar dielectric portion of the support member, with the surface parallel to the planar dielectric portion.
18. The probe assembly of claim 17 , further comprising:
a guard portion attached to the planar dielectric portion of the support member, the guard portion surrounding the sensing member.
19. The probe assembly of claim 12 , wherein:
the component is a dual-inline microconnector, and the guide portion is sized to engage the dual-inline microconnector.
20. A probe assembly for making capacitive measurements of signals coupled from a conductor of a two-dimensional array of a plurality of conductors of a component, the two-dimensional array having a first area, the component being attached to a printed circuit board, the probe assembly having a component-facing portion, and the probe assembly comprising:
a support member;
a planar, conductive sensing member mechanically coupled to the support member, the sensing member comprising a portion defining the component-facing portion of the probe assembly, the component-facing portion having a second area that is less than the first area of the two-dimensional array of the plurality of conductors; and
circuitry, electrically coupled to a sensor plate, the circuitry being configured to amplify a signal capacitively coupled from a conductor of the plurality of conductors to the sensor plate, wherein:
the sensing member comprises a planar surface and an edge,
the sensing member is attached to the support member such that the edge defines the component-facing portion of the probe assembly,
the support member comprises a planar dielectric portion,
the sensing member is attached to the support member such that the surface of the sensing member is parallel to and extending from the planar dielectric portion of the support member,
the surface of the sensing member comprises a first surface,
the sensing member comprises a second opposing surface, and
the probe assembly further comprises:
a first guard plate parallel to the first surface; and
a second guard plate parallel to the second surface.