Granted Patent B2

US 9,117,850 · App. 14/471,374 · Granted Aug 25, 2015

Abstract

Claims (51)

1. A method for fabricating a vertical JFET, the method comprising:

providing a III-nitride substrate of a first conductivity type;

forming a first III-nitride epitaxial layer of the first conductivity type coupled to the III-nitride substrate;

forming a second III-nitride epitaxial layer of the first conductivity type coupled to the first III-nitride epitaxial layer;

forming a first masking layer coupled to the second III-nitride epitaxial layer;

removing at least a portion of the first masking layer and the second III-nitride epitaxial layer to expose a vertical sidewall of the second III-nitride epitaxial layer and a horizontal surface of the first III-nitride epitaxial layer;

forming a spacer coupled to the vertical sidewall of the second III-nitride epitaxial layer and the horizontal surface of the first III-nitride epitaxial layer; and

removing at least a portion of the first III-nitride epitaxial layer to form a channel region of the vertical JFET, wherein the spacer is used as a mask to prevent removal of at least a portion of the horizontal surface of the first III-nitride epitaxial layer.

2. The method of claim 1 further comprising forming a second masking layer coupled to the first masking layer, wherein removing the at least a portion of the first masking layer includes removing at least a portion of the second masking layer.

3. The method of claim 2 wherein the second masking layer comprises at least one of polysilicon or another material with high etch selectivity to the first masking layer.

4. The method of claim 2 wherein:

removing the at least a portion of the second masking layer, the first masking layer, and the second III-nitride epitaxial layer includes performing an etch using a plurality of etching steps; and

each of the plurality of etching steps is configured to preferentially etch one or more of the second masking layer, the first masking layer, or the second III-nitride epitaxial layer.

5. The method of claim 1 wherein a vertical sidewall of the channel region is spaced apart from and laterally self-aligned to the vertical sidewall of the second III-nitride epitaxial layer via the spacer.

6. The method of claim 1 further comprising forming a III-nitride gate structure of a second conductivity type coupled to the channel region of the vertical JFET.

7. The method of claim 6 further comprising:

forming a first metal structure coupled to the III-nitride gate structure;

forming a dielectric layer coupled to the first metal structure;

removing a first portion of the dielectric layer to expose a surface of the second III-nitride epitaxial layer; and

forming a second metal structure coupled to the exposed surface of the second III-nitride epitaxial layer.

8. The method of claim 7 further comprising:

removing a second portion of the dielectric layer to expose a surface of the first metal structure; and

forming a third metal structure coupled to the exposed surface of the first metal structure.

9. The method of claim 6 further comprising:

forming a first metal structure coupled to the III-nitride gate structure;

forming a second metal structure coupled to a surface of the second III-nitride epitaxial layer;

forming a dielectric layer coupled to the first metal structure and the second metal structure;

removing at least a portion of the dielectric layer to expose at least a portion of the first metal structure and the second metal structure;

forming a gate electrode in contact with the first metal structure; and

forming a source electrode in contact with the second metal structure.

10. The method of claim 1 wherein the first masking layer comprises at least one of an oxide or a nitride.

11. The method of claim 1 wherein the first conductivity type is n-type characterized by a dopant including at least one of silicon and oxygen.

12. A method for fabricating a vertical JFET, the method comprising:

providing a III-nitride substrate;

forming a first III-nitride epitaxial layer having a first surface coupled to the III-nitride substrate and a second surface substantially opposite the first surface;

forming a second III-nitride epitaxial layer coupled to the second surface of the first III-nitride epitaxial layer;

removing at least a portion of the second III-nitride epitaxial layer and the first III-nitride epitaxial layer to form a trench, wherein the trench has at least one sidewall disposed at an angle with respect to a dimension normal to the second surface;

forming an insulating layer coupled to the at least one sidewall;

removing a portion of the insulating layer to expose a portion of the at least one sidewall; and

forming a III-nitride gate structure coupled to the portion of the at least one sidewall such that a portion of the insulating layer is disposed between the III-nitride gate structure and the second III-nitride epitaxial layer.

13. The method of claim 12 wherein:

the first III-nitride epitaxial layer and the second III-nitride epitaxial layer are of a first conductivity type, and

the III-nitride gate structure is of a second conductivity type.

14. The method of claim 12 further comprising:

forming a first metal structure coupled to the III-nitride gate structure;

forming a dielectric layer coupled to the insulating layer, III-nitride gate structure, and the first metal structure;

removing a first portion of the dielectric layer and a portion of the insulating layer to expose a surface of the second III-nitride epitaxial layer; and

forming a second metal structure coupled to the exposed surface of the second III-nitride epitaxial layer.

15. The method of claim 14 further comprising:

removing a second portion of the dielectric layer to expose a surface of the first metal structure; and

forming a third metal structure coupled to the exposed surface of the first metal structure.

Assignments (11)