IP Library Granted Patent US 9,502,161
Granted Patent B2
US 9,502,161 · App. 14/473,118 · Granted Nov 22, 2016

Power resistor with integrated heat spreader

Inventors: Clark Smith (Columbus, NE); Todd Wyatt (Columbus, NE)
Assignee: VISHAY DALE ELECTRONICS, LLC
H01C1/084H01C1/14H01C1/148H01C17/28H01C7/003Y10T29/49082Y10T29/49101
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Quick Facts
Patent No.
US 9,502,161
App. No.
14/473,118
Granted
Nov 22, 2016
Kind
B2
Abstract

A resistor and an integrated heat spreader are provided. A resistive element having a first surface is in contact with electrically conducting terminals. A heat spreader is provided having at least a portion in thermally conductive contact with at least a portion of the first surface of the resistive element. The heat spreader comprising a thermally conducting and electrically insulating material, and has terminations, each termination adjacent to one of the electrically conducting terminals. Each termination is in thermally conducting contact with the adjacent electrically conducting terminal. A method of fabricating a resistor and an integrated heat spreader is also provided.

Claims (25)

1. A resistor and an integrated heat spreader, comprising:

a resistive element having a first surface, the resistive element comprising electrically conducting terminals; and

a heat spreader having at least a portion in thermally conductive contact with at least a portion of the first surface of the resistive element, the heat spreader comprising a thermally conducting and electrically insulating material, the heat spreader comprising terminations formed separately from the electrically conducing terminals, each termination adjacent to one of the electrically conducting terminals;

wherein each termination is in thermally conducting contact with the adjacent electrically conducting terminal.

2. The resistor and integrated heat spreader of claim 1 , wherein the heat spreader comprises a heat sink.

3. The resistor and integrated heat spreader of claim 2 , wherein at least a portion of the heat sink is bonded to at least a portion of the first surface of the resistor.

4. The resistor and integrated heat spreader of claim 3 , wherein the at least a portion of the heat sink is bonded to at least a portion of the first surface of the resistor with an adhesive, and, wherein the adhesive does not extend over the terminals and does not extend over the terminations.

5. The resistor and integrated heat spreader of claim 2 , wherein the heat sink comprises an edge surface, and wherein the terminations are situated only on the edge surface of the heat sink.

6. The resistor and integrated heat spreader of claim 2 , wherein the heat sink comprises a front surface that is in thermally conductive contact with at least a portion of the resistive element, and wherein the terminations are situated only on the front surface of the heat sink.

7. The resistor and integrated heat spreader of claim 2 , wherein the heat sink comprises an edge surface and a back surface on an opposite side of a front surface, and wherein the terminations wrap around onto at least one of the edge surface of the heat sink and the back surface of the heat sink.

8. The resistor and integrated heat spreader of claim 1 , further comprising a plated metallic layer on surfaces of the terminals and the terminations.

9. The resistor and integrated heat spreader of claim 3 , wherein the at least a portion of the heat sink is bonded to at least a portion of the first surface of the resistor with an adhesive, and wherein the adhesive is a thermally conductive and electrically insulating adhesive.

10. The resistor and integrated heat spreader of claim 1 , wherein the resistive element is a metal strip resistive element.

11. A method of fabricating a resistor having electrically conducting terminals and an integrated heat spreader having terminations, the electrically conducting terminals being formed separately from the terminations, comprising:

forming a thermally conductive contacting between at least a portion of the resistor and at least a portion of the heat spreader; and

forming a thermally conducting contact between each electrically conducting terminal and an adjacent termination.

12. The method of claim 11 , further comprising bonding each of the electrically conducting terminals to an adjacent termination to form thermally and electrically conductive contact between the electrically conducting terminals and the terminations.

13. The method of claim 11 , wherein the heat spreader comprises a heat sink, and further comprising bonding at least a portion of the resistive element to at least a portion of the heat sink.

14. The method of claim 13 , wherein at least a portion of the heat sink is bonded to at least a portion of the first surface of the resistor by a thermally conducting and electrically insulating adhesive.

15. The method of claim 13 , wherein the heat sink comprises edge surfaces, and further comprising forming the terminations only on the edge surfaces of the heat sink.

16. The method of claim 13 , wherein the heat sink comprises a front surface, and further comprising forming the terminations only on the front surface of the heat sink.

17. The method of claim 13 , wherein the heat sink comprises an edge surface and a back surface on an opposite side of a front surface, and wherein the terminations wrap around an onto at least one of the edge surface of the heat sink and the back surface of the heat sink.

18. The method of claim 11 , further comprising plating a metallic layer on surfaces of the terminals and the terminations.

19. The method of claim 13 , wherein at least a portion of the heat sink and at least a portion of the resistive element are bonded by a thermally conductive and electrically insulating adhesive.

20. The method of claim 11 , wherein the resistive element is a metal strip resistive element.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE
Reel/Frame 049772/0898 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 13, 2016
From: SMITH, CLARK; WYATT, TODD
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 037479/0692 →
CHANGE OF NAME Recorded Jan 13, 2016
From: VISHAY DALE ELECTRONICS, INC.
To: VISHAY DALE ELECTRONICS, LLC
Reel/Frame 037513/0107 →
SECURITY AGREEMENT Recorded Dec 10, 2015
From: VISHAY DALE ELECTRONICS, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037261/0616 →
Continuity (2)
Continuation 13725018 · Dec 21, 2012
Related Publication 20150042444A1 · Feb 12, 2015