Achieving greater planarity between upper surfaces of a layer and a conductive structure residing therein
View Patent ↗Greater planarity is achieved between surfaces of a conductive structure and a layer within which the conductive structure resides. A portion of the conductive structure protruding above the surface of the layer is selectively oxidized, at least in part, to form an oxidized portion. The oxidized portion is then removed, at least partially, to facilitate achieving greater planarity. The protruding portions may optionally be formed by selectively disposing conductive material over the conductive structure, when that the conductive structure is initially recessed below the surface of the layer. A further embodiment includes selectively oxidizing a portion of the conductive structure below the surface of the layer, removing at least some of the oxidized portion so that an upper surface of the conductive structure is below the upper surface of the layer, and planarizing the upper surface of the layer to the upper surface of the conductive structure.
1. A method comprising:
providing a conductive structure for an electronic circuit, the providing comprising:
selectively oxidizing, at least in part, a protruding portion of the conductive structure protruding above a surface of a layer within which the conductive structure at least partially resides, the selectively oxidizing comprising controllably oxidizing the protruding portion down to a controlled depth less than 5 nanometers above or below the surface of the layer based on targeting the surface of the layer, to form an oxidized portion of the conductive structure; and
subsequent to the selectively oxidizing, removing, at least partially, the oxidized portion of the conductive structure, wherein the removing removes at least a part of the protruding portion of the conductive structure, which facilitates achieving planarity between the surface of the layer and an upper surface of the conductive structure.
2. The method of claim 1 , wherein the controlled depth is selected prior to the selectively oxidizing.
3. The method of claim 2 , wherein the controlled depth is a 1 nanometer window of depths.
4. The method of claim 1 , wherein the selectively oxidizing comprises controllably oxidizing the protruding portion down to a controlled depth less than 2 nanometers above or below the surface of the layer.
5. The method of claim 1 , wherein the selectively oxidizing and the removing the oxidized portion are performed as part of a dry etch process.
6. The method of claim 1 , wherein the conductive structure comprises a metal contact and wherein the layer comprises a dielectric layer.
7. The method of claim 1 , wherein the providing further comprises:
forming the protruding portion of the conductive structure protruding above the surface of the layer, wherein the upper surface of the conductive structure is initially recessed below the surface of the layer, and wherein the forming comprises selectively disposing conductive material over the upper surface of the conductive structure to fill the recess and form the protruding portion of the conductive structure; and
performing the selectively oxidizing and the removing to achieve the planarity between the surface of the layer and the upper surface of the conductive structure.
8. The method of claim 1 , wherein, based on the removing, the upper surface of the conductive structure is recessed below the surface of the layer, and wherein the method further comprises planarizing the layer to the upper surface of the conductive structure.
9. A method comprising:
providing a conductive structure for an electronic circuit, the providing comprising:
controllably processing a protruding portion of the conductive structure protruding above a surface of a layer within which the conductive structure at least partially resides, the controllably processing comprising selectively oxidizing, at least in part, the protruding portion of the conductive structure down to a depth below a surface of the conductive structure, to form an oxidized portion of the conductive structure; and
subsequent to the controllably processing, removing, at least partially, the oxidized portion of the conductive structure, wherein the removing removes at least a part of the protruding portion of the conductive structure, which facilitates achieving planarity between the surface of the layer and an upper surface of the conductive structure, wherein the removing the oxidized portion comprises performing a chemical-mechanical polishing process, and wherein the selectively oxidizing is performed separate from the chemical-mechanical polishing process and prior to performing the chemical-mechanical polishing process.
10. The method of claim 9 , wherein the depth comprises a depth selected prior to the selectively oxidizing.
11. The method of claim 9 , wherein the selectively oxidizing comprises controllably oxidizing the protruding portion down to a controlled depth less than 2 nanometers above or below the surface of the layer.
12. The method of claim 9 , wherein the conductive structure comprises a metal contact and wherein the layer comprises a dielectric layer.
13. The method of claim 9 , wherein the providing further comprises:
forming the protruding portion of the conductive structure protruding above the surface of the layer, wherein the upper surface of the conductive structure is initially recessed below the surface of the layer, and wherein the forming comprises selectively disposing conductive material over the upper surface of the conductive structure to fill the recess and form the protruding portion of the conductive structure; and
performing the controllably processing and the removing to achieve the planarity between the surface of the layer and the upper surface of the conductive structure.
14. The method of claim 9 , wherein, based on the removing, the upper surface of the conductive structure is recessed below the surface of the layer, and wherein the method further comprises planarizing the layer to the upper surface of the conductive structure.
15. A method comprising:
providing a conductive structure for an electronic circuit, the providing comprising:
selectively oxidizing, at least in part, a protruding portion of the conductive structure protruding above a surface of a layer within which the conductive structure at least partially resides, the selectively oxidizing comprising controllably oxidizing the protruding portion down to a controlled depth less than 5 nanometers above or below the surface of the layer, to form an oxidized portion of the conductive structure; and
subsequent to the selectively oxidizing, removing, at least partially, the oxidized portion of the conductive structure, wherein the removing removes at least a part of the protruding portion of the conductive structure, which facilitates achieving planarity between the surface of the layer and an upper surface of the conductive structure, wherein the removing the oxidized portion comprises performing a chemical-mechanical polishing process, and wherein the selectively oxidizing is performed separate from the chemical-mechanical polishing process and prior to performing the chemical-mechanical polishing process.
16. The method of claim 15 , wherein the controlled depth is selected prior to the selectively oxidizing.
17. The method of claim 16 , wherein the controlled depth is a 1 nanometer window of depths.
18. The method of claim 15 , wherein the conductive structure comprises a metal contact and wherein the layer comprises a dielectric layer.
19. The method of claim 15 , wherein the providing further comprises:
forming the protruding portion of the conductive structure protruding above the surface of the layer, wherein the upper surface of the conductive structure is initially recessed below the surface of the layer, and wherein the forming comprises selectively disposing conductive material over the upper surface of the conductive structure to fill the recess and form the protruding portion of the conductive structure; and
performing the selectively oxidizing and the removing to achieve the planarity between the surface of the layer and the upper surface of the conductive structure.
20. The method of claim 15 , wherein, based on the removing, the upper surface of the conductive structure is recessed below the surface of the layer, and wherein the method further comprises planarizing the layer to the upper surface of the conductive structure.