Non-homogeneous molding of packaged semiconductor devices
A packaged semiconductor device has an integrated circuit (IC) die and first and second volumes of molding compound. The first volume of molding compound is disposed on a first portion of a first side of the IC die and comprises a first molding compound. The second volume of molding compound is disposed on a second side of the IC die, different from the first side, and comprises a second molding compound, different from the first molding compound. By including different molding compounds, the properties of the packaged semiconductor device can be varied across the device.
1. A method for assembling a packaged semiconductor device, the method comprising:
(a) positioning a partially-assembled packaged semiconductor device comprising an integrated circuit (IC) die within a mold cavity;
(b) positioning a molding compound pellet within a pot, wherein the molding compound pellet comprises a first molding compound and a second molding compound different from the first molding compound;
(c) pushing the second molding compound into a second volume of the mold cavity disposed on a second side of the IC die; and
(d) pushing the first molding compound into a first volume of the mold cavity disposed on at least a first portion of a first side of the IC die, different from the second side, and
after step (c) and before step (d), pushing a mixture of the first and second molding compounds from the first and second regions into a third volume of the mold cavity,
wherein the molding compound pellet comprises (i) a first region comprising the first molding compound and (ii) a second region comprising the second molding compound and a recess, wherein the first region is located within the recess of the second region.
2. The method of claim 1 , wherein:
the first portion is within a perimeter of the IC die; and
the second volume is further disposed on a second portion of the first side of the IC die, wherein the second portion comprises the perimeter of the IC die.
3. The method of claim 1 , wherein the third volume is situated between the first and second volumes.
4. The method of claim 3 , wherein the mixture is pushed into the third volume such that:
a concentration of the first molding compound in the mixture is highest nearest to a center of the IC die and decreases away from the center of the IC die; and
a concentration of the second molding compound in the mixture is highest away from the center of the IC die and decreases toward the center of the IC die.
5. The method of claim 1 , wherein the first volume has a substantially conical, frustum shape.
6. The method of claim 1 , wherein the first molding compound comprises one or more of the following properties:
(i) a higher thermal conductivity than the second molding compound;
(ii) a higher viscosity at molding temperature than the second molding compound; and
(iii) a higher elastic modulus than the second molding compound.
7. The method of claim 1 , wherein:
the molding compound pellet further comprises a third region comprising the first molding compound, wherein the third region is in a stacked arrangement with the first and second regions; and
step (d) comprises pushing the third region into the mold cavity.
8. The method of claim 7 , wherein:
the molding compound pellet further comprises a fourth region comprising the second molding compound, wherein the fourth region is in a stacked arrangement with the first and second regions, opposite the third region; and
step (c) comprises pushing the fourth region into the mold cavity.
9. The method of claim 7 , wherein:
the molding compound pellet further comprises a third region comprising the second molding compound, wherein the third region is in a stacked arrangement with the first and second regions; and
step (c) comprises pushing the third region into the mold cavity.