IP Library Granted Patent US 9,785,508
Granted Patent B2
US 9,785,508 · App. 14/482,387 · Granted Oct 10, 2017

Method and apparatus for configuring I/O cells of a signal processing IC device into a safe state

Inventors: Robert F. Moran (Largs, GB); Alan Devine (Paisley, GB); Alistair Paul Robertson (Glasgow, GB)
Assignee: NXP USA, Inc.
G06F11/1415G01R31/3185G01R31/318544G06F2201/805
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Quick Facts
Patent No.
US 9,785,508
App. No.
14/482,387
Granted
Oct 10, 2017
Kind
B2
Abstract

A peripheral integrated circuit (IC) device for providing support to a data processing IC device. The peripheral IC device comprises a fault detection component arranged to detect an occurrence of fault conditions within the data processing IC device. The peripheral IC device further comprises a safe state control component. Upon detection of a fault condition occurring within the data processing IC device by the fault detection component, the safe state control component is arranged to cause at least one I/O cell of the data processing IC device to be configured into at least one scan-chain, and cause at least one predefined control signal to be scanned into the at least one scan-chain to configure the at least one I/O cell into a state corresponding to the predefined control signal.

Claims (41)

1. A peripheral integrated circuit, IC, device for providing support to a data processing IC device, the peripheral IC device comprising:

a fault detection component arranged to detect an occurrence of a fault condition within the data processing IC device; and

a safe state control component arranged to, in response to detection of the fault condition occurring within the data processing IC device by the fault detection component:

cause an input/output, I/O, cell of the data processing IC device to be configured into a scan-chain; and

cause a predefined control signal to be scanned into the scan-chain to configure the I/O cell into a state corresponding to the predefined control signal.

2. The peripheral IC device of claim 1 , wherein the peripheral IC device is arranged to be operably coupled to the data processing IC device via a serial peripheral interface, and the safe state control component is arranged to transmit command signals to the data processing IC device to cause the I/O cell of the data processing IC device to be configured into the scan-chain and to cause the predefined control signal to be scanned into the scan-chain via the serial peripheral interface.

3. The peripheral IC device of claim 1 , wherein the safe state control component is arranged to cause the I/O cell of the data processing IC device to be configured into the scan-chain by sending a command signal to a debug component of the data processing IC device instructing the debug component to configure the I/O cell of the data processing IC device into the scan-chain.

4. The peripheral IC device of claim 3 , wherein the safe state control component is arranged to cause the predefined control signal to be scanned into the scan-chain by sending the command signal to the debug component of the data processing IC device comprising a control signal pattern to cause the debug component to scan in a control signal into the scan-chain to configure the I/O cell to comprise a logical level corresponding to the control signal pattern.

5. The peripheral IC device of claim 3 , wherein the safe state control component is arranged to cause the predefined control signal to be scanned into the scan-chain by sending a command signal to the debug component of the data processing IC device to cause the debug component to scan in a control signal into the scan-chain to configure the I/O cell to comprise a high input impedance.

6. The peripheral IC device of claim 3 , wherein the safe state control component is arranged to cause the predefined control signal to be scanned into the scan-chain by sending a command signal to the debug component of the data processing IC device to cause the debug component to scan in a control signal into the scan-chain to configure the I/O cell to comprise a logical level corresponding to a predefined control signal pattern.

7. The peripheral IC device of claim 3 , wherein the safe state control component is operably coupled to a memory element and arranged to read therefrom a series of command signals for causing the I/O cell of the data processing IC device to be configured into the scan-chain and for causing a predefined control signal to be scanned into the scan-chain to configure the I/O cell into to a state corresponding to the predefined control signal.

8. The peripheral IC device of claim 7 , wherein the safe state control component is further arranged to read from the memory element the control signal to be scanned into the scan-chain.

9. The peripheral IC device of claim 3 , wherein the safe state control component is operably coupled to a fuse element configurable to define the control signal to be scanned into the scan-chain.

10. The peripheral IC device of claim 3 , wherein the control signal to be scanned into the scan-chain is hardcoded into the peripheral IC device.

11. The peripheral IC device of claim 1 , wherein the predefined control signal to be scanned into the scan-chain is arranged to force the I/O cell into to a state comprising at least one of:

a high logical level;

a low logical level; and

a high input impedance level.

12. The peripheral IC device of claim 1 , wherein the fault detection component is arranged to detect the occurrence of at least one of:

an over-current condition within the data processing IC device;

an over-voltage condition within the data processing IC device;

an over-temperature condition within the data processing IC device; and

a watchdog function not being serviced.

13. The peripheral IC device of claim 1 , wherein the fault detection component is arranged to detect the occurrence of fault conditions based on a notification received from the data processing IC device of the detection of a fault condition thereby.

14. The peripheral IC device of claim 1 , wherein the support provided by the peripheral IC device to the data processing IC device comprises at least one from a group comprising:

power regulator functionality;

over current detection functionality;

watchdog functionality; and

physical layer communication functionality.

15. A data processing integrated circuit, IC, device comprising a safety level configuration component, the safety level configuration component being controllable by a peripheral IC device operably coupled to the data processing IC device to:

configure an input/output, I/O, cell of the data processing IC device to be configured into a scan-chain in response to a detection of a fault condition occurring within the data processing IC device; and

cause a predefined control signal to be scanned into the scan-chain to configure the I/O cell into to a state corresponding to the predefined control signal.

16. The data processing IC device of claim 15 , wherein the I/O cell is arranged to be isolated from core functional components of the data processing IC device when configured into the scan-chain by the safety level configuration component.

17. The data processing IC device of claim 15 , wherein the safety level configuration component comprises a debug component of the data processing IC device.

18. The data processing IC device of claim 15 , wherein the scan-chain comprises at least one boundary scan scan-chain.

19. The data processing IC device of claim 15 , wherein the data processing IC device comprises a microprocessor.

20. A method comprising:

detecting, at a detection component, an occurrence of a fault condition within a data processing integrated circuit, IC, device; and

in response to detection of the fault condition occurring within the data processing IC device:

causing, by a safe state control component, an input/output, I/O, cell of the data processing IC device to be configured into a scan-chain; and

causing, by the safe state control component, a predefined control signal to be scanned into the scan-chain to configure the I/O cell into a state corresponding to the predefined control signal.

Assignments (15)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040626 FRAME: 0683. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016. Recorded Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
CHANGE OF NAME Recorded Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 7, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037458/0502 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 7, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037458/0460 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0921 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Nov 4, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 034153/0027 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Nov 4, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 034160/0351 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Nov 4, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 034160/0370 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2014
From: MORAN, ROBERT F.; DEVINE, ALAN; ROBERTSON, ALISTAIR PAUL
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 033710/0965 →
Continuity (1)
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