IP Library Granted Patent US 9,583,338
Granted Patent B2
US 9,583,338 · App. 14/496,660 · Granted Feb 28, 2017

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

Inventors: Yoshitomo Hashimoto (Toyama, JP); Yoshiro Hirose (Toyama, JP); Tatsuru Matsuoka (Toyama, JP)
Assignee: HITACHI KOKUSAI ELECTRIC INC.
H01L21/0228C23C16/45527C23C16/45544C23C16/52H01L21/02167H01L21/02211
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Quick Facts
Patent No.
US 9,583,338
App. No.
14/496,660
Granted
Feb 28, 2017
Kind
B2
Abstract

According to the present disclosure, a film containing a predetermined element, carbon and nitrogen is formed with high controllability of a composition thereof. A method of manufacturing a semiconductor device includes forming a film containing a predetermined element, carbon and nitrogen on a substrate by performing a cycle a predetermined number of times. The cycle includes supplying a first processing gas containing the predetermined element and a halogen element to the substrate, supplying a second processing gas composed of three elements of carbon, nitrogen and hydrogen to the substrate, and supplying a third processing gas containing carbon to the substrate.

Claims (24)

1. A method of manufacturing a semiconductor device, comprising forming a film containing a predetermined element, carbon and nitrogen on a substrate in a process chamber by performing a cycle a predetermined number of times, the cycle comprising:

supplying a first processing gas containing the predetermined element and a halogen element to the substrate in the process chamber;

supplying a second processing gas composed of three elements of carbon, nitrogen and hydrogen to the substrate in the process chamber; and

supplying a third processing gas containing carbon to the substrate in the process chamber, the third processing gas being different from the second processing gas,

wherein a partial pressure of the third processing gas in the process chamber is set to be higher than a partial pressure of the second processing gas in the process chamber.

2. The method of claim 1 , wherein supplying the third processing gas is performed during a period in which the second processing gas is supplied.

3. The method of claim 2 , wherein an internal pressure of the process chamber in the act of supplying the third processing gas is set to be greater than an internal pressure of the process chamber in the act of supplying the first processing gas.

4. The method of claim 1 , wherein supplying the third processing gas is performed during a period in which supplying the second processing gas is stopped.

5. The method of claim 4 ,

wherein an internal pressure of the process chamber in the act of supplying the third processing gas is set to be greater than an internal pressure of the process chamber in the act of supplying the second processing gas.

6. The method of claim 1 , wherein supplying the third processing gas is performed simultaneously with supplying the second processing gas.

7. The method of claim 1 , wherein supplying the third processing gas is performed prior to supplying the second processing gas.

8. The method of claim 7 ,

wherein an internal pressure of the process chamber in the act of supplying the third processing gas is set to be greater than an internal pressure of the process chamber in the act of supplying the second processing gas.

9. The method of claim 7 , wherein the act of supplying the second processing gas is initiated before an adsorption reaction of the third processing gas is saturated.

10. The method of claim 1 , wherein supplying the third processing gas is performed after supplying the second processing gas is terminated.

11. The method of claim 10 ,

wherein an internal pressure of the process chamber in the act of supplying the third processing gas is set to be greater than an internal pressure of the process chamber in the act of supplying the second processing gas.

12. The method of claim 1 , wherein the second processing gas comprises at least one selected from a group consisting of an amine and an organic hydrazine.

13. The method of claim 1 , wherein the third processing gas comprises a gas composed of two elements of carbon and hydrogen.

14. The method of claim 1 , wherein the third processing gas comprises a hydrocarbon-based gas.

15. The method of claim 1 , wherein the predetermined element comprises silicon or metal, and the halogen element comprises chlorine or fluorine.

16. The method of claim 1 , wherein, in the cycle, the act of supplying the third processing gas is initiated prior to the act of supplying the second processing gas, and is stopped after the supply of the second processing gas is terminated.

17. The method of claim 1 , wherein, in the cycle, the act of supplying the third processing gas is performed at least one time of before and after the act of supplying the second processing gas.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2014
From: HASHIMOTO, YOSHITOMO; HIROSE, YOSHIRO; MATSUOKA, TATSURU
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 033821/0121 →
Priority Claims (1)
JP 2013-218296 · Oct 21, 2013 · national
Continuity (1)
Related Publication 20150111395A1 · Apr 23, 2015