Fabrication of III-nitride semiconductor device and related structures
A method of fabricating a III-nitride power semiconductor device that includes growing a transition layer over a substrate using at least two distinct and different growth methods.
1. A method of fabricating a power semiconductor device, comprising:
providing a substrate;
growing a first III-nitride layer using a first growth method selected from the group consisting of MBE and HVPE, and a second III-nitride layer over said at least first III-nitride layer, and a third III-nitride layer over said second III-nitride layer;
forming an active semiconductor region over said third III-nitride layer, wherein at least one of said first, second, and third III-nitride layers act to transition lattice mismatch between said substrate and said active semiconductor region.
2. The method of claim 1 , wherein said second III-nitride layer is fabricated using a second growth method selected from the group consisting of MOCVD and HVPE.
3. The method of claim 1 , wherein said third III-nitride layer is fabricated using an MOCVD growth method.
4. The method of claim 1 , wherein at least one of said first, second, and third III-nitride layers further act to transition thermal expansion characteristics between said substrate and said active semiconductor region.
5. The method of claim 1 , wherein said active semiconductor region comprises first and second HI-nitride semiconductor bodies.
6. The method of claim 1 , wherein said substrate comprises material selected from the group consisting of silicon, silicon carbide, and sapphire.
7. The method of claim 1 , wherein said first growth method is MBE and said second growth method is HVPE.
8. The method of claim 1 , wherein said first III-nitride layer has a uniform composition.
9. The method of claim 1 , wherein said first III-nitride layer has a graded composition.
10. The method of claim 1 , wherein said second III-nitride layer has a uniform composition.
11. The method of claim 1 , wherein said second III-nitride layer has a graded composition.
12. A method of fabricating a power semiconductor device, comprising:
providing a substrate;
growing a first III-nitride layer using a first growth method selected from the group consisting of MBE and MOCVD, and a second III-nitride layer over said at least first III-nitride layer, and a third III-nitride layer over said second III-nitride layer;
forming an active semiconductor region over said third III-nitride layer, wherein at least one of said first, second, and third III-nitride layers act to transition lattice mismatch between said substrate and said active semiconductor region.
13. The method of claim 12 , wherein said second III-nitride layer is fabricated using a HVPE growth method.
14. The method of claim 12 , wherein said third III-nitride layer is fabricated using an MOCVD growth method.
15. The method of claim 12 , wherein said substrate comprises material selected from the group consisting of silicon, silicon carbide, and sapphire.
16. The method of claim 12 , wherein said first growth method is MOCVD and said second growth method is HVPE.
17. The method of claim 12 , wherein said first III-nitride layer has a uniform composition.
18. The method of claim 12 , wherein said first III-nitride layer has a graded composition.
19. The method of claim 12 , wherein said second III-nitride layer has a uniform composition.
20. The method of claim 12 , wherein said second III-nitride layer has a graded composition.