Interfaces and die packages, and appartuses including the same
A memory device includes a memory die package including a plurality of memory dies, an interface device including an interface circuit, and a memory controller configured to control the interface with control data received from at least one of the plurality of memory dies. The interface device of the memory device is configured to divide and multiplex an IO channel between the memory die package and the memory controller into more than one channel using the control data receive from the at least one of the plurality of memory dies. The interface device for a memory device includes a control input buffer configured to receive an enable signal through a control pad, a first input buffer configured to receive a first data through a first IO pad in response to a first state of the enable signal, and a second input buffer configured to receive a second data through a second IO pad in response to a second state of the enable signal. The interface device further includes an input multiplexer configured to multiplex the first data and the second data to provide an input data.
1. An interface, comprising:
an output multiplexer configured to divide output data to provide a first data and a second data in response to an external control signal, the output multiplexer being further configured to provide a first control signal and a second control signal;
a first pre-driving circuit configured to provide a first pull-up signal and a first pull-down signal in response to the first data and the first control signal;
a first output buffer configured to provide a first output data in response to the first pull-up signal and the first pull-down signal;
a second pre-driving circuit configured to provide a second pull-up signal and a second pull-down signal in response to the second data and the second control signal; and
a second output buffer configured to provide a second output data in response to the second pull-up signal and the second pull-down signal.
2. The interface of claim 1 , wherein the external control signal comprises a selection signal having a first state and a second state.
3. The interface of claim 2 , wherein the output multiplexer is configured to provide the first data and the first control signal in response to the first state of the selection signal, and to provide the second data and the second control signal in response to the second state of the selection signal.
4. The interface of claim 1 , further comprising:
a first IO pad configured to provide the first output data to a first group of dies in a die package; and
a second IO pad configured to provide the second output data to device second group of dies in the die package.
5. The interface of claim 1 , wherein the output multiplexer is configured to receive a die enable signal as the external control signal, the die enable signal indicating enablement of a memory die in a die package.
6. The interface of claim 5 , wherein the output multiplexer is further configured to determine whether the memory die indicated by the die enable signal is included in a first group of memory dies in the die package or in a second group of memory dies in the die package.
7. The interface of claim 6 , wherein if the output multiplexer determines that the memory die indicated by the die enable signal is included in the first group of memory dies in the die package, the output multiplexer is configured to provide the first data and the first control signal.
8. The interface of claim 1 , wherein the interface is to a plurality of memory dies.
9. The interface of claim 8 , wherein the memory dies comprise at least one memory die selected from the group comprising: a NAND memory die, a NOR memory die, a PCM memory die, a DRAM memory die, a SRAM memory die, a TRAM memory die, a RRAM memory die, and a MRAM memory die.