Method of manufacturing a display device comprising a step of simultaneously polishing a second substrate and a semiconductor chip to have the same thickness as each other
A display device including: a first substrate with a pixel switch and drivers mounted thereon; a second substrate disposed in facing relation to the first substrate; a material layer held between the first substrate and the second substrate and having peripheral edges sealed by a seal member, the material layer having an electrooptical effect; and a semiconductor chip mounted as a COG component on the first substrate, the semiconductor chip having a control system configured to control the drivers; wherein the semiconductor chip having a thickness equal to the total thickness of the seal member and the second substrate or larger than the thickness of the seal member and smaller than the total thickness.
1. A method of manufacturing a display device having a first substrate with a pixel switch and drivers mounted thereon, a second substrate disposed in facing relation to said first substrate, and a material layer held between said first substrate and said second substrate and sealed by a seal member, the method comprising:
a first step of mounting a semiconductor chip having a control system configured to control said drivers, as a COG component on said first substrate parallel to a region in which said seal member and said second substrate are stacked;
a second step of securing said first substrate and said semiconductor chip to each other; and
a third step of simultaneously polishing said second substrate and said semiconductor chip to the same thickness as each other.