Monolithic bidirectional silicon carbide switching devices
View Patent ↗A monolithic bidirectional switching device includes a drift layer having a first conductivity type and having an upper surface, and first and second vertical metal-oxide semiconductor (MOS) structures at the upper surface of the drift layer. The drift layer provides a common drain for the first and second vertical MOS structures. The first and second vertical MOS structures are protected by respective first and second edge termination structures at the upper surface of the drift layer. A monolithic bidirectional switching device according to further embodiments includes a vertical MOS structure at the upper surface of the drift layer, and a diode at the upper surface of the drift layer. The drift layer provides a drain for the vertical MOS structure and a cathode for the diode, and the vertical MOS structure and the diode are protected by respective first and second edge termination structures.
1. A monolithic bidirectional switching device, comprising:
a drift layer having a first conductivity type and having an upper surface;
a vertical metal-oxide semiconductor (MOS) structure at the upper surface of the drift layer; and
a diode at the upper surface of the drift layer, wherein the drift layer provides a drain for the vertical MOS structure and a cathode for the diode, and wherein the vertical MOS structure and the diode are surrounded by respective first and second edge termination structures at the upper surface of the drift layer.
2. The monolithic bidirectional switching device of claim 1 , wherein the first edge termination structure comprises a first plurality of guard rings in the upper surface of the drift layer, the first plurality of guard rings having a second conductivity type opposite the first conductivity type, and wherein the second edge termination structure comprises a second plurality of guard rings in the upper surface of the drift layer, the second plurality of guard rings having the second conductivity type.
3. The monolithic bidirectional switching device of claim 1 , further comprising:
a substrate having the first conductivity type, wherein the drift layer is provided on a first surface of the substrate; and
a metal layer on a second surface of the substrate opposite the first surface.
4. The monolithic bidirectional switching device of claim 1 , wherein the MOS structure comprises:
a well region at the upper surface of the drift layer, the well region having a second conductivity type that is opposite the first conductivity type;
a source region in the well region, the source region having the first conductivity type;
a gate insulator on the upper surface of the drift layer and defining a channel region in the well region adjacent the source region;
a gate contact on the gate insulator; and
a source contact on the source region and on the well region.
5. The monolithic bidirectional switching device of claim 4 , wherein the source contact forms an ohmic contact with the source region and the well region.
6. The monolithic bidirectional switching device of claim 4 , further comprising:
a second well region at the upper surface of the drift layer, the second well region spaced apart from the well region and defining a vertical current flow region in the drift layer between the well region and the second well region;
a second source region in the second well region; and
a second source contact on the second source region and the second well region.
7. The monolithic bidirectional switching device of claim 1 , wherein the diode comprises a Schottky contact that forms a Schottky junction with the drift layer.
8. The monolithic bidirectional switching device of claim 7 , wherein the diode comprises a plurality of junction barrier Schottky regions in the drift layer, the junction barrier Schottky regions having the second conductivity type and contacting the Schottky contact.
9. The monolithic bidirectional switching device of claim 1 , wherein the drift layer comprises silicon carbide.
10. A packaged electronic device, comprising:
a package housing;
a monolithic bidirectional switching device within the package housing, the monolithic bidirectional switching device comprising a drift layer having a first conductivity type and having an upper surface, a vertical metal-oxide semiconductor (MOS) structure at the upper surface of the drift layer, and a diode at the upper surface of the drift layer, wherein the drift layer provides a drain for the vertical MOS structure and a cathode for the diode, and wherein the vertical MOS structure and the diode are surrounded by respective first and second edge termination structures at the upper surface of the drift layer; and
a plurality of electrical leads coupled to the monolithic bidirectional switching device and extending from the housing.
11. The packaged electronic device of claim 10 , wherein the first edge termination structure comprises a first plurality of guard rings in the upper surface of the drift layer, the first plurality of guard rings having a second conductivity type opposite the first conductivity type, and wherein the second edge termination structure comprises a second plurality of guard rings in the upper surface of the drift layer, the second plurality of guard rings having the second conductivity type.
12. The packaged electronic device of claim 10 , further comprising:
a substrate having the first conductivity type, wherein the drift layer is provided on a first surface of the substrate; and
a metal layer on a second surface of the substrate opposite the first surface.
13. The packaged electronic device of claim 10 , wherein the MOS structure comprises:
a well region at the upper surface of the drift layer, the well region having a second conductivity type that is opposite the first conductivity type;
a source region in the well region, the source region having the first conductivity type;
a gate insulator on the upper surface of the drift layer and defining a channel region in the well region adjacent the source region;
a gate contact on the gate insulator; and
a source contact on the source region and on the well region.
14. The packaged electronic device of claim 13 , wherein the source contact forms an ohmic contact with the source region and the well region.
15. The packaged electronic device of claim 13 , further comprising:
a second well region at the upper surface of the drift layer, the second well region spaced apart from the well region and defining a vertical current flow region in the drift layer between the well region and the second well region;
a second source region in the second well region; and
a second source contact on the second source region and the second well region.
16. The packaged electronic device of claim 10 , wherein the diode comprises a Schottky contact that forms a Schottky junction with the drift layer.
17. The packaged electronic device of claim 16 , wherein the diode comprises a plurality of junction barrier Schottky regions in the drift layer, the junction barrier Schottky regions having the second conductivity type and contacting the Schottky contact.