Device isolation in FinFET CMOS
Embodiments herein provide approaches for device isolation in a complimentary metal-oxide fin field effect transistor. Specifically, a semiconductor device is formed with a retrograde doped layer over a substrate to minimize a source to drain punch-through leakage. A set of replacement fins is formed over the retrograde doped layer, each of the set of replacement fins comprising a high mobility channel material (e.g., silicon, or silicon-germanium). The retrograde doped layer may be formed using an in situ doping process or a counter dopant retrograde implant. The device may further include a carbon liner positioned between the retrograde doped layer and the set of replacement fins to prevent carrier spill-out to the replacement fins.
1. A method for forming a fin field effect transistor, the method comprising:
forming a retrograde doped layer over a substrate, the retrograde doped layer comprising one of:
doped silicon (Si), and doped silicon-germanium (Si—Ge);
forming a set of replacement fins over the retrograde doped layer, each of the set of replacement fins comprising a high mobility channel material, and
forming a carbon liner over the retrograde doped layer.
2. The method according to claim 1 , further comprising:
patterning a plurality of fins over the substrate;
patterning an opening in a hard mask formed over the plurality of fins; and
removing one or more of the plurality of fins exposed by the opening in the hard mask to form a set of openings in a source trench isolation (STI) layer.
3. The method according to claim 1 , the forming the retrograde doped layer comprising growing the retrograde doped layer over the substrate using an in situ doping process.
4. The method according to claim 1 , the forming the set of replacement fins comprising growing the set of replacement fins over the retrograde doped layer.
5. The method according to claim 4 , the growing the set of replacement fins comprising performing a chemical vapor deposition of at least one of: Si, and Si—Ge.
6. The method according to claim 1 , the forming the retrograde doped layer comprising performing a counter dopant retrograde implant to form the retrograde doped layer within the substrate.
7. The method according to claim 6 , further comprising:
patterning a plurality of fins over the substrate;
patterning an opening in another hard mask formed over the plurality of fins; and
removing one or more of the plurality of fins exposed by the opening in the another hard mask to form a set of openings in a source trench isolation (STI) layer and to expose the retrograde doped layer.
8. The method according to claim 7 , wherein the set of replacement fins is formed by growing the set of replacement fins over the retrograde doped layer exposed by the set of openings in the STI layer.
9. The method according to claim 6 , further comprising performing a retrograde carbon implant to form the carbon liner over the retrograde doped layer.
10. A method for providing device isolation in a complimentary metal-oxide fin field effect transistor, the method comprising:
forming a retrograde doped layer over a substrate, the retrograde doped layer comprising one of:
doped silicon (Si), and doped silicon-germanium (Si—Ge);
forming a set of replacement fins over the retrograde doped layer, each of the set of replacement fins comprising at least one of: Si, and Si—Ge, and
forming a carbon liner over the retrograde doped layer.
11. The method according to claim 10 , further comprising:
patterning a plurality of fins over the substrate;
patterning an opening in a hard mask formed over the plurality of fins; and
removing one or more of the plurality of fins exposed by the opening in the hard mask to form a set of openings in a source trench isolation (STI) layer, wherein the retrograde doped layer is grown using an in situ doping process, and wherein the set of replacement fins is grown over the retrograde doped layer within a set of openings in the STI layer.
12. The method according to claim 10 , the forming the retrograde doped layer comprising:
patterning an opening in a hardmask formed over the substrate; and
performing a counter dopant retrograde implant to form the retrograde doped layer within the substrate.
13. The method according to claim 12 , further comprising:
removing the hard mask;
patterning a plurality of fins over the substrate;
patterning an opening in another hard mask formed over the plurality of fins; and
removing one or more of the plurality of fins exposed by the opening in the another hard mask to form a set of openings in a source trench isolation (STI) layer and to expose the retrograde doped layer, wherein the set of replacement fins is grown over the retrograde doped layer exposed by the set of openings in the STI layer.
14. The method according to claim 10 , wherein forming the carbon liner over the retrograde doped layer comprises performing a retrograde carbon implant.