Plasma processing apparatus and plasma processing method
A plasma processing apparatus includes a processing chamber configured to perform a plasma processing on a sample, a first radio frequency power supply configured to generate a plasma, a sample stage configured to place the sample thereon, a second radio frequency power supply configured to supply a radio frequency power to the sample stage, a mass flow controller configured to supply a gas into the processing chamber, and a control device configured to change the radio frequency power supplied from the first radio frequency power supply or the second radio frequency power supply based on a change of plasma impedance after a first gas is switched to a second gas.
1. A plasma processing apparatus comprising:
a processing chamber configured to perform plasma processing on a sample;
a first radio frequency power supply configured to supply a first radio frequency power to generate a plasma in the processing chamber via a first impedance matching box;
a sample stage configured to place the sample thereon;
a second radio frequency power supply configured to supply a second radio frequency power to the sample stage via a second impedance matching box;
a mass flow controller configured to supply a gas into the processing chamber; and
a control device configured to control the first radio frequency power supply to change the first radio frequency power from a value defined in a first set of process parameters to a value defined in a second set of process parameters based on a change of plasma impedance induced when switching from a first gas defined in the first set of process parameters to a second gas defined in the second set of process parameters, after switching a signal transmitted to the mass flow controller from a signal associated with the first gas to a signal associated with the second gas;
wherein said first and second impedance matching boxes each comprise a voltage sensor,
wherein the change of the plasma impedance is detected based on a value of a first or second derivative of a change in a measured peak-to-peak voltage, and
wherein the change of the first radio frequency power from the value defined in the first set of process parameters to the value defined in the second set of process parameters is determined based on said value of said first derivative of the change in the measured peak-to-peak voltage becoming equal to or greater than a non-zero threshold, or based on said value of said second derivative of said change in said measured peak-to-peak voltage crossing over a zero threshold.
2. The plasma processing apparatus according to claim 1 ,
wherein the change in the measured peak-to-peak voltage is for the second radio frequency power measured by the voltage sensor of the second impedance matching box.
3. The plasma processing apparatus according to claim 1 ,
wherein the change in the measured peak-to-peak voltage is for the first radio frequency power measured by the voltage sensor of the first impedance matching box.
4. The plasma processing apparatus according to claim 1 , wherein the control device is configured to control the first radio frequency power supply to change the first radio frequency power from the value defined in the first set of process parameters to the value defined in the second set of process parameters after switching from the first gas defined in the first set of process parameters to the second gas defined in the second set of process parameters.
5. A plasma processing apparatus comprising:
a processing chamber configured to perform plasma processing on a sample;
a first radio frequency power supply configured to supply a first radio frequency power to generate a plasma in the processing chamber via a first impedance matching box;
a sample stage configured to place the sample thereon;
a second radio frequency power supply configured to supply a second radio frequency power to the sample stage via a second impedance matching box;
a mass flow controller configured to supply a gas into the processing chamber; and
a control device configured to control the second radio frequency power supply to change the second radio frequency power from a value defined in a first set of process parameters to a value defined in a second set of process parameters based on a change of plasma impedance induced when switching from a first gas defined in the first set of process parameters to a second gas defined in the second set of process parameters in the processing chamber, after switching a signal transmitted to the mass flow controller from a signal associated with the first gas to a signal associated with the second gas,
wherein said first and second impedance matching boxes each comprise a voltage sensor,
wherein the change of the plasma impedance is detected based on a value of a first or second derivative of a change in a measured peak-to-peak voltage, and
wherein the change of the second radio frequency power from the value defined in the first set of process parameters to the value defined in the second set of process parameters is determined based on said value of said first derivative of the change in the measured peak-to-peak voltage becoming equal to or greater than a non-zero threshold, or based on said value of said second derivative of said change in said measured peak-to-peak voltage crossing over a zero threshold.
6. The plasma processing apparatus according to claim 5 ,
wherein the change in the measured peak-to-peak voltage is for the second radio frequency power measured by the voltage sensor of the second impedance matching box.